KR101678178B1 - Anisotropic conductive adhesive composition for accessing electric or electronic parts - Google Patents
Anisotropic conductive adhesive composition for accessing electric or electronic parts Download PDFInfo
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- KR101678178B1 KR101678178B1 KR1020160043406A KR20160043406A KR101678178B1 KR 101678178 B1 KR101678178 B1 KR 101678178B1 KR 1020160043406 A KR1020160043406 A KR 1020160043406A KR 20160043406 A KR20160043406 A KR 20160043406A KR 101678178 B1 KR101678178 B1 KR 101678178B1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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Abstract
Description
The present invention relates to an anisotropic conductive adhesive composition for connection to an electric or electronic part. More specifically, the present invention relates to an anisotropically conductive material for connecting electric or electronic parts, which can minimize the connection resistance between electric or electronic parts to be connected and stably maintain electrical connection between the electric or electronic parts even in thermal expansion ≪ / RTI >
BACKGROUND ART [0002] With the miniaturization and thinning of electronic devices including electronic components such as LCDs, OLEDs, camera modules, touch modules, and fingerprint recognition sensors, electronic components that constitute electronic devices have become more dense and highly accurate, It has been difficult to connect the electronic parts by a method such as soldering.
Thus, a method of using an adhesive composition as a connection method between electronic components for constituting an electronic device has been proposed.
The adhesive composition for connection between electronic components exists in a state in which conductive particles are dispersed in a curable resin and as the conductive particles are cured between the electronic components to be connected, the conductive particles are positioned between the electrodes facing each other, And has an anisotropic conductivity that enables electrical conduction between the electrodes facing each other and at the same time maintains the insulating property between the adjacent electrodes in the plane direction.
Since the connection between electronic parts using an anisotropically conductive adhesive composition is a lead free process that replaces the conventional soldering process, the process itself is simple, environmentally friendly, and electrical connection is made using fine conductive particles, so that a very fine electrode pitch There are many advantages such as the possibility of implementation.
However, the electrical conduction between the electrodes through the anisotropically conductive bonding composition and the connection between the electronic components realized thereby is dependent only on the conductive particles contained in the bonding composition, and the contact area between the conductive particles and the electrodes can be formed through conventional solder Since the contact area is smaller than the contact area, the connection resistance between the electrodes is increased, which may lead to a problem of complete connection between the electronic parts.
Further, the electronic component connected through the anisotropically conductive adhesive composition may be exposed to high temperature environment depending on the heat generated by the use of the electronic device or the temperature and the climate around the electronic device, and accordingly, it may be thermally expanded.
Here, the expansion of the anisotropic conductive adhesive composition may cause a connection failure between the electronic components. Specifically, since the connection between the electronic components is realized through the contact of the conductive particles to the electrodes facing each other, , The contact state between the electrode and the conductive particles is released as the distance between the electrodes facing each other increases, thereby causing a failure in the connection state between the electronic parts.
Therefore, it is possible to secure a sufficient electric conduction region between the electrodes to be electrically conducted, minimize the connection resistance between the electronic components, and maintain the electrical conduction state between the electrodes even during thermal expansion, Or an anisotropic conductive adhesive composition for connection of electronic parts are desperately required.
The present invention minimizes the connection resistance between the electric or electronic parts by securing a sufficient connection path between the electrodes to be electrically conducted and maintains a stable electrical conduction state between the electrodes even when inflated, The present invention provides an anisotropic conductive adhesive composition which enables the connection between the anisotropically conductive adhesive composition.
In order to solve the above problems,
1. An anisotropic conductive adhesive composition for connection to an electric or electronic part, comprising a base resin, a curing agent, conductive particles and spacer particles, wherein the spacer particles have an average particle diameter of 30 to 70% of an average particle diameter of the conductive particles, Wherein the hardness of the conductive particles is at least twice the hardness of the conductive particles.
Wherein the conductive particles are resiliently deformed when they are compressed at an interval maintained by the spacer particles for connection of an electric or electronic part with a compressive strength of 200 to 2000 kg / mm 2 at 10% compression. Thereby providing a conductive adhesive composition.
The present invention also provides an anisotropic conductive adhesive composition, wherein the conductive particles have an average particle diameter of 3 to 30 탆.
Wherein the average particle diameter of the conductive particles is 10 to 30 占 퐉 and the average particle diameter of the spacer particles is 3 to 21 占 퐉.
On the other hand, the content of the conductive particles is 2 to 30 parts by weight based on 100 parts by weight of the base resin, and the weight ratio of the conductive particles to the spacer particles is 1: 1 to 1:10. To provide an adhesive composition.
And, the spacer particles include conductive particles made of gold, silver, nickel, copper or an alloy thereof, nonconductive particles, or all of them, and are plastic-deformed.
Further, the present invention provides an anisotropic conductive adhesive composition, wherein the composition is in the form of a film.
The base resin comprises 20 to 50% by weight of a thermoplastic resin, 0 to 20% by weight of an epoxy resin, and 0 to 45% by weight of an acrylate based on the total weight of the anisotropic conductive adhesive composition. An anisotropic conductive adhesive composition is provided.
Also, based on the total weight of the anisotropic conductive adhesive composition, the curing agent comprises 0 to 50 wt% of a latent curing agent, wherein the anisotropically conductive adhesive composition comprises 0 to 10 wt% of a radical initiator and 1 to 5 wt% of a silane coupling agent %, Based on the total weight of the composition.
The epoxy resin comprises a bisphenol-type epoxy resin and a polyfunctional epoxy resin, and the content of the polyfunctional epoxy resin is 10 to 40% by weight based on the total weight of the epoxy resin. Lt; / RTI >
The anisotropic conductive adhesive composition for connecting electric or electronic parts according to the present invention sufficiently provides an electrical connection path between electrodes by controlling physical properties, particularly hardness and compressive strength, of the conductive particles and the spacer particles, Effect.
In addition, the anisotropic conductive adhesive composition for connecting electric or electronic parts according to the present invention maintains electrical conduction between electrodes through elasticity of conductive particles even during thermal expansion, thereby exhibiting an excellent effect of enabling more stable connection between electronic parts.
FIG. 1 is a schematic view showing an electronic component connected by an anisotropic conductive adhesive composition according to an embodiment of the present invention.
Hereinafter, preferred embodiments of the present invention will be described in detail. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.
The present invention relates to an anisotropic conductive adhesive composition for connection to an electric or electronic part. In particular, the present invention relates to an anisotropic conductive adhesive composition in the form of a film that does not include an organic solvent.
The anisotropic conductive adhesive composition for electrical or electronic component connection according to the present invention is an anisotropic conductive adhesive composition which enables electrical connection between electric or electronic parts, and can include a thermoplastic resin, a curing agent, conductive particles and spacer particles, An epoxy resin, an acrylate, and the like, and may include a latent curing agent and the like as the curing agent, and may further include a radical initiator, a silane coupling agent, and the like.
The thermoplastic resin has an unsaturated double bond in consideration of reliability and thermal stability. The thermoplastic resin can improve adhesion to a substrate while imparting adhesiveness to a film-form adhesive composition and film film property and improving reworkability. Examples of the resin that can be used in the present invention include resins such as phenoxy resin, urethane resin, acrylic rubber, acrylonitrile butadiene rubber, polymethyl methacrylic copolymer resin, polyvinyl butyral resin, polyvinyl acetal resin, cellulose, polyol resin, polystyrene- (SEBS) resin, a polystyrene-poly (ethylene-propylene) -polystyrene (SEPS) resin, an isoprene-polystyrene (SIS) resin, a polystyrene-polybutadiene-polystyrene , Or a derivative thereof, or a mixed resin thereof can be used.
The thermoplastic resin may be 20 to 50% by weight based on the total weight of the anisotropic conductive adhesive composition. If the content of the thermoplastic resin is less than 20% by weight, the adhesiveness of the anisotropic conductive adhesive composition, the film coatability and the like of the anisotropically conductive adhesive composition may be greatly lowered. On the other hand, if the content of the thermoplastic resin exceeds 50% by weight, .
The epoxy resin generally refers to a resin containing an epoxy group in a chemical structure, and is formed as an insoluble three-dimensional network structure by a reaction with the curing agent as a prepolymer of a thermosetting resin, and is cured to have an adhesive force.
Examples of the epoxy resin include, but not limited to, bisphenol A epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, bisphenol S epoxy resin, bisphenol A epoxy resin, , Glycidyl ether type epoxy resins, and biphenyl and alicyclic resins, can be used.
The content of the epoxy resin may be 20 wt% or less, preferably 10 to 20 wt%, based on the total weight of the anisotropic conductive adhesive composition. If the content of the epoxy resin is less than 10% by weight, the adhesive force of the anisotropic conductive adhesive composition may be greatly deteriorated. If the epoxy resin is more than 20% by weight, the anisotropic conductive adhesive composition may be excessively shrunk and brittle can do.
In particular, when the cross-linking density of a single-molecular weight epoxy resin is high, shrinkage after curing becomes excessive and brittleness becomes strong, so that the epoxy resin may be vulnerable to impact, and as a result, adhesion strength may be weakened. It is preferable to include a strong polyfunctional epoxy resin.
Therefore, the epoxy resin may be composed of a mixture of a monofunctional epoxy resin and the polyfunctional epoxy resin. For example, the epoxy resin may be composed of a mixture of a bisphenol-type epoxy resin and a polyfunctional epoxy resin. The content of the polyfunctional epoxy resin may be 10 to 40% by weight based on the total weight of the epoxy resin, and the equivalent weight is preferably 100 to 500 g / eq.
If the content of the polyfunctional epoxy resin is less than the above range, the cross-linking density of the epoxy resin can not be prevented from becoming too high, so that the impact resistance and the adhesive strength of the adhesive composition may be lowered. The crosslinking density of the epoxy resin is excessively lowered and it is difficult to form a three-dimensional network structure due to the reaction with the curing agent, which may cause problems in the curing performance of the adhesive.
The acrylate may include a monomer, an oligomer, and a combination thereof as a material having a functional group polymerized by a radical initiator described later. Examples of the monomer include monomers having at least one unsaturated bond in the molecule, such as styrene, methylstyrene, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, Acrylate, methacrylate, isodecylmethacrylate, n-laurylmethacrylate, tridecylmethacrylate, n-stearylmethacrylate, cyclohexylmethacrylate, tetrahydrofurfurylmethacrylate, isobornylmethacrylate Acrylate, benzyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate, dimethylaminoethyl methacrylate, diethylaminoethyl methacrylate, Glycidyl methacrylate, ethylene glycol dimethacrylate, diethylene glycol Butadiene dimethacrylate, 1,6-hexanediol dimethacrylate, t-butyl methacrylate, isostearyl methacrylate, behenyl methacrylate, n-butoxy Hydroxy-3-acryloxypropylmethacrylate, 3-chloro-2-hydroxypropylmethacrylate, 1-hydroxyethyl methacrylate, 2-hydroxyethyl methacrylate, , 3-butanediol dimethacrylate, neopentyl glycol dimethacrylate, 1,10-decanediol dimethacrylate, dibromoneopentyl glycol dimethacrylate, trichloroethyl methacrylate, 2,2, 3,3-tetrachloropropyl methacrylate, 2,2,3,4,4-tetrafluoropropyl butyl methacrylate, perfluorooctylethyl methacrylate, 3-chloro-2-hydroxypropyl methacrylate Acrylic Ray Modified styrenes such as stearyl methacrylate, lauryl acrylate, carbonyldiacrylate, ethylene oxide modified bisphenol A diacrylate, ethylene oxide modified bisphenol F diacrylate, ethylene oxide modified paraxylphenol acrylate, polypropylene glycol di Acrylate, isocyanuric acid ethylene oxide modified diacrylate, lauryl acrylate, stearyl acrylate, butoxy ethyl acrylate, phenoxy ethyl acrylate, tetrahydrofurfuryl acrylate, isobornyl acrylate, 2 Hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxy-3-phenoxypropyl acrylate, neopentyl glycol diacrylate, 1,6-hexadiol diacrylate, isooctyl acrylate, Benzyl acrylate, nonylphenoxy ethyl acrylate, 2-hydroxybenzyl acrylate, Acrylate, mono (2-acryloyloxyethyl) acid phosphate, mono (2-methacryloyloxyethyl) acrylate, perfluorooctylethyl acrylate, dimethylol tricyclodetane diacrylate, 2- acryloyloxyethyl acid phosphate, 2-hydroxyethyl-2-hydroxypropyl phthalate,? -Acryloyloxyethylhydrogen succinate, 2-hydroxy-1,3-dimethanethoxypropoxy, di Acrylonitrile, methacrylic acid, methacrylic acid, methacrylic acid, methacrylic acid, methacrylic acid, methacrylic acid, methacrylic acid, methacrylic acid, methacrylic acid, The fluidity, flexibility, adhesion to an adherend, and the like can be improved when the resin component is cured. The monomers may be used in combination of monofunctional monomers having one unsaturated bond, polyfunctional monomers having two or more unsaturated bonds, and the like.
The content of the acrylate may be 45 wt% or less, preferably 25 to 45 wt%, based on the total weight of the anisotropic conductive adhesive composition. When the content of the acrylate is less than 25% by weight, the anisotropic conductive adhesive composition may have poor fluidity, flexibility, adhesion to an adherend upon curing, while when it exceeds 45% by weight, The film property, the film property, and the like may be largely lowered.
The latent curing agent is a solid insoluble in an epoxy resin at room temperature, or a compound which functions as a curing agent having the potential to be solubilized in the epoxy resin or broken in the capsule by heating and pressurization, and is an imidazole compound solid at room temperature, (Amine-epoxy adduct system) of an amine compound with an epoxy compound, a reaction product of an amine compound and an isocyanate compound or an urea compounded silicate (a urea-based adduct system ), And the like.
In particular, the latent curing agent may be provided in the form of a capsule encapsulated in a film form, for example, a polymer material such as polyurethane, polystyrene, gelatin and polyisocyanate, an inorganic material such as calcium silicate, zeolite, or the like, And may be provided in the form of a capsule surrounded by a film of a metal thin film such as nickel or copper. Here, the diameter of the capsules may be 10 μm or less, and the lower limit of the capsule diameter may preferably be less than 2 μm for the storage stability of the curing accelerator.
Representative commercially available examples of the solid dispersed latent curing accelerator include Amicure PN-23 (manufactured by Ajinomoto Co., Ltd.), Amicure PN-40 (manufactured by Ajinomoto Co., Ltd.) as an amine-epoxy adduct system (Manufactured by Asahi Kasei Corporation), Hardener X-3661S (manufactured by ECR Corporation), Hardener X-3670S (manufactured by ECR Corporation), Novacure HX-3932 ), Nova Cure HX-3721 (manufactured by Asahi Kasei Corporation), and the urea type duct system includes Ajiquer FXE-1000 (manufactured by Fuji Kasei Co., Ltd.), Ajikure FXR-1030 (Manufactured by Fuji Chemical Co., Ltd.), and in the case of a capsule type latent curing accelerator, it may have favorable properties in terms of liquid stability and pot life.
The latent curing agent may be 30 to 50 wt% based on the total weight of the anisotropically conductive contact composition. If the content of the latent curing agent is less than 30% by weight, the adhesiveness of the anisotropic conductive adhesive composition and the film coatability may be greatly deteriorated. When the content of the latent curing agent is more than 50% by weight, Flexibility and the like may be greatly reduced.
The radical initiator is a compound that generates free radicals by heat and decomposes by heating with a peroxide compound or an azo compound to generate a free radical. Depending on the application, the radical initiator may be selected from the group consisting of a connecting temperature, The organic peroxide having a half-life of 10 hours at a temperature of 40 DEG C or higher and a half-life of 1 minute at 180 DEG C or lower is preferable from the standpoints of high reactivity and available time, There may be mentioned peroxides such as peroxides, diacyl peroxides, peroxydicarbonates, peroxyesters, peroxyketals, dialkyl peroxides, hydroperoxides, silyl peroxides, benzoyl peroxides, dibenzoyl peroxides, cumyl hydroperoxides, And may be, for example, wheat hydroperoxide.
The content of the radical initiator may be 5 to 10% by weight based on the total weight of the anisotropic conductive adhesive composition. When the content of the radical initiator is less than 5% by weight, the adhesiveness of the anisotropic conductive adhesive composition and the film coatability of the anisotropic conductive adhesive composition may be greatly deteriorated. When the content of the radical initiator is more than 10% by weight, Etc. can be greatly reduced.
The silane coupling agent reinforces the adhesive interface of a circuit or the like and improves the moisture resistance by using an inorganic substance such as nickel, gold, silver, copper aluminum, ITO, aluminum, or molybdenum, or polyimide, PET, PPS, LPS, For example, vinyltriethoxysilane, vinyltris (? -Methoxyethoxy) silane,? -Methacryloxypropyltrimethoxysilane (? -Methoxypropyltrimethoxysilane), and the like. , γ-glycidoxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, N- β- (aminoethyl) - γaminopropylmethyldimethoxysilane, γ-aminopropyltri Ethoxysilane, N-phenyl- gamma -aminopropyltrimethoxysilane, gamma-mercaptopropyltrimethoxysilane, gamma -chlorophorophyltrimethoxysilane, and the like.
The content of the silane coupling agent may be 1 to 5 wt% based on the total weight of the anisotropic conductive adhesive composition. If the content of the silane coupling agent is less than 1% by weight, the adhesion between the anisotropic conductive adhesive composition and the adherend may deteriorate.
The conductive particles act to connect opposing electrodes to be electrically connected to each other in electrical or electronic parts to be connected, and for example, gold, nickel, copper, silver, solder, palladium, (TiO 2 ), boron nitride (BN), zinc oxide (ZnO), silicon oxide (SiO 2 ), or silicon oxide (SiO 2) 2 ), aluminum oxide (Al 2 O 3 ), inorganic inorganic oxide such as inorganic glass, carbon carbon nanotube, graphene nano-plate, expanded graphite, Particles, and the like.
In the metal-coated resin particle, the resin particle may include particles such as a styrene resin, a benzoguanamine resin, and a nylon resin, and the resin particle may be coated with the metal by an electroless plating method, an electrolytic plating method or the like.
The conductive particles may be contained in an amount of 2 to 30 parts by weight based on 100 parts by weight of the resin component such as the thermoplastic resin and the epoxy resin. When the content of the conductive particles is less than 2 parts by weight, the resistance between the connected electric or electronic parts may be greatly increased, while when it is more than 30 parts by weight, the interval or the structure between the connected electric or electric parts may be unstable can do.
The spacer particles maintain a gap between opposing electrodes to be electrically connected in the electric or electronic parts to be connected, so that a sufficient adhesive composition remains in the gap, thereby realizing a sufficient adhesive force, and at the same time, So that the restoring force is lost and the short circuit between the electrodes electrically connected in the expansion of the adhesive composition is suppressed.
The spacer particles may include conductive particles, non-conductive particles, or both. For example, the conductive particles may be particles of gold, silver, nickel, copper, or an alloy thereof, (TiO 2 ), boron nitride (BN), zinc oxide (ZnO), silicon oxide (SiO 2 ), aluminum oxide (Al 2 O 3 ), and metal oxide particles , Conductive inorganic oxides such as inorganic glass, carbon-based conductive particles such as carbon nanotubes, graphene nano-plates and expanded graphite, and the non-conductive particles may be ceramics And the like.
The average particle diameter of the conductive particles may be in the range of 3 to 30 탆, and the average particle diameter of the spacer particles may have an average particle diameter of 30 to 70% of the average particle diameter of the conductive particles. For example, The particle diameter may be 10 to 30 mu m and the average particle diameter of the spacer particles may be 3 to 21 mu m.
The hardness of the spacer particles may be at least two times the hardness of the conductive particles. For example, the conductive particles may have a compressive strength at 10% compression, that is, a force in one direction to the conductive particles, The compressive strength when the particle size is reduced by 10% is 200 to 2,000 kg / mm 2 and the spacer particles can have a compressive strength of at least twice the compressive strength when the conductive particles are compressed by 10% When the conductive adhesive composition according to the present invention is applied between electric or electronic parts and pressed at high temperature and high pressure, the conductive particles are elastically deformed and the spacer particles can be deformed or plastically deformed.
The conductive adhesive composition according to the present invention can minimize the connection resistance between the electric or electronic components to be connected by including the conductive particles and the spacer particles having different sizes and hardness from each other, So that the electrical connection can be stably maintained.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an electronic component connected by an adhesive composition according to an embodiment of the present invention; Fig.
As shown in Fig. 1, the
Particularly, the conductive particles (c1) having a relatively large average particle diameter but a low hardness are contracted in a direction in which the pressure is applied by the high pressure at the time of the compression, and expand and expand in the direction perpendicular to the direction in which the pressure is applied, ), And as a result, the function of reducing the connection resistance can be performed.
When the distance between the
On the other hand, the spacer particles c2 having a relatively small average particle size but a high hardness can prevent the interval between the pair of
The spacer particles c2 are partly inserted into the surfaces of the
As described above, the spacer particle (c2) having a relatively small average particle diameter has an average particle diameter of 40 to 60% of the average particle diameter of the conductive particle (c1) having a relatively large average particle diameter. When the average particle diameter of the spacer particles (c2) is less than 40% of the average particle diameter of the conductive particles (c1), the gap between the pair of electrodes (11a, 11b) is narrowed and the adhesive composition is insufficiently present, At the same time, the deformation of the conductive particles (c1) is excessively deformed to plastic deformation at a level at which the original restoring force is lost, thereby increasing the connection resistance when the contact composition thermally expands.
On the other hand, when the average particle diameter of the spacer particles (c2) exceeds 60% of the average particle diameter of the conductive particles (c1), the deformation of the conductive particles (c1) c1) can not be ensured, resulting in an increase in the connection resistance.
On the other hand, the spacer particles c2 having relatively high hardness can have a compressive strength of not less than twice the compressive strength when the conductive particles (c1) having relatively low hardness are compressed by 10%. When the compressive strength of the spacer particles c2 is less than twice the compressive strength of the conductive particles c1, the hardness of the spacer particles c2 is insufficient, so that the distance between the pair of
In particular, the weight ratio of the conductive particles (c1) and the spacer particles (c2) contained as the conductive particles may be 1: 1 to 1:10. If the content ratio is less than 1: 1, it is difficult to maintain the gap between the pair of
[Example]
1. Manufacturing Example
An anisotropic conductive adhesive film (thickness: 25 mu m) according to each of Examples and Comparative Examples was produced with the components and contents shown in Table 1 below. The unit of the content shown in Table 1 below is% by weight.
- Conductive particles: metal-coated resin particles (average particle size: 20 占 퐉; compressive strength of 600 kg / mm 2 at 10% compression)
- Spacer particles: spherical nickel particles (average particle diameter: 8 占 퐉)
2. Property evaluation
(1) Evaluation of adhesion
Each of the adhesive films of Examples and Comparative Examples was laminated on a soda glass substrate coated with ITO in an amount of 1800 Å on a soda glass substrate and a FPCB (polyimide substrate) substrate having a Cu / NiAu electrode (200 μm wide and 300 μm spacing) Flexible Printed Circuit Board) substrates, and the adhesive films of Example 1 and Comparative Examples 1 and 2 were cured at a temperature of 150 ° C at a pressure of 3.0 MPa for 10 seconds, and the adhesives of Example 2 and Comparative Examples 3 and 4 The film was cured at a temperature of 180 ° C at a pressure of 3.0 MPa for 10 seconds and then the force applied when peeling the FPCB substrate at an angle of 90 ° with respect to the glass substrate was measured by an adhesive force. After the reliability evaluation, the adhesive strength was measured in a high-temperature and high-humidity chamber of 85 ° C and 85% RH for 500 hours.
(2) Evaluation of connection resistance
Each of the adhesive films of Examples and Comparative Examples was placed between the FPC substrate and the ITO glass designed as shown in the following figure, and the adhesive film of Example 1 and Comparative Examples 1 and 2 was peeled off at a temperature of 150 캜 at a pressure of 3.0 MPa for 10 seconds And the adhesive films of Example 2 and Comparative Examples 3 and 4 were cured at a temperature of 180 캜 for 10 seconds at a pressure of 3.0 MPa and then a current of 10 mA was constantly flowed using a Kiethley 236 apparatus and the V1 point and V2 The initial contact resistance due to the conductive particles contained in the adhesive composition was measured using the voltage difference at the point. Further, the reliability of the connection was measured after leaving a 500-hour period in a high-temperature and high-humidity chamber at 85 DEG C and 85% RH in a state in which a current of 10 mA and a voltage of 3.5 V were applied to the FPC board and the ITP glass connected thereto.
The evaluation results of the physical properties are shown in Table 2 below.
As shown in Table 2, the bonding compositions of Examples 1 and 2 according to the present invention can appropriately maintain the gap between the objects to be bonded by suitable conductive particles, so that the bonding strength is excellent and the connection resistance, particularly, Of the total.
On the other hand, the bonding compositions of Comparative Examples 1 and 3 contained only conductive particles having a large average particle diameter and a low hardness and did not contain spacer particles, so that the gap between the electrodes connected was not maintained, And it was confirmed that the connection resistance after thermal expansion was greatly increased by being deformed and losing the original state restoring force.
In addition, since the bonding compositions of Comparative Examples 2 and 4 contain only the spacer particles having a small average particle size and a high hardness, when the reliability between the electrodes is increased, the spacer particles and the electrodes It was confirmed that the connection resistance was greatly increased.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention as defined in the following claims. . It is therefore to be understood that the modified embodiments are included in the technical scope of the present invention if they basically include elements of the claims of the present invention.
10a, 10b:
c1: conductive particle c2: spacer particle
Claims (10)
A base resin, a curing agent, conductive particles, and spacer particles,
Wherein the spacer particles have an average particle diameter of 30 to 70% of an average particle diameter of the conductive particles,
Wherein the conductive particles are elastically deformed when compressed at an interval maintained by the spacer particles for connection of an electric or electronic part with a compressive strength of 600 to 2000 kg / mm < 2 > at 10%
Wherein the spacer particles are not deformed or plastically deformed when the adhesive composition is pressed for connection of an electric or electronic part, the compressive strength of the spacer particles being 2 times or more the compressive strength at 10% compression of the conductive particles at 10% Based on the total weight of the composition.
Wherein the conductive particles have an average particle diameter of 3 to 30 占 퐉.
Wherein the average particle diameter of the conductive particles is 10 to 30 占 퐉 and the average particle diameter of the spacer particles is 3 to 21 占 퐉.
Wherein the content of the conductive particles is 2 to 30 parts by weight based on 100 parts by weight of the base resin and the weight ratio of the conductive particles to the spacer particles is 1: 1 to 1:10. .
Wherein the spacer particles comprise conductive particles of gold, silver, nickel, copper, or an alloy thereof, nonconductive particles, or both, and are plastic-deformed.
Wherein the composition is in the form of a film.
Characterized in that the base resin comprises 20 to 50% by weight of a thermoplastic resin, 0 to 20% by weight of an epoxy resin and 0 to 45% by weight of an acrylate based on the total weight of the anisotropically conductive adhesive composition. Adhesive composition.
Based on the total weight of the anisotropic conductive adhesive composition, the curing agent comprises 0 to 50 wt% of a latent curing agent, wherein the anisotropic conductive adhesive composition comprises 0 to 10 wt% of a radical initiator and 1 to 5 wt% of a silane coupling agent ≪ / RTI > further comprising an anisotropic conductive adhesive composition.
Wherein the epoxy resin comprises a bisphenol-type epoxy resin and a polyfunctional epoxy resin, and the content of the polyfunctional epoxy resin is 10 to 40% by weight based on the total weight of the epoxy resin.
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020160043406A KR101678178B1 (en) | 2016-04-08 | 2016-04-08 | Anisotropic conductive adhesive composition for accessing electric or electronic parts |
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| KR1020160043406A KR101678178B1 (en) | 2016-04-08 | 2016-04-08 | Anisotropic conductive adhesive composition for accessing electric or electronic parts |
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| KR101678178B1 true KR101678178B1 (en) | 2016-11-21 |
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| KR1020160043406A KR101678178B1 (en) | 2016-04-08 | 2016-04-08 | Anisotropic conductive adhesive composition for accessing electric or electronic parts |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112151729A (en) * | 2019-06-26 | 2020-12-29 | 泰连德国有限公司 | Carrier structure, cell contact system and method of manufacture |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06187834A (en) * | 1992-12-18 | 1994-07-08 | Sumitomo Bakelite Co Ltd | Anisotropic conductive film |
| KR20000075397A (en) * | 1999-05-06 | 2000-12-15 | 신와 고교 가부시키가이샤 | Pipe coupling that has enhanced the earthquake-proof and sealing property |
| KR20070097250A (en) * | 2006-03-29 | 2007-10-04 | 삼성전자주식회사 | Anisotropic conductive film and display apparatus having the same |
| KR20110006012A (en) * | 2009-07-13 | 2011-01-20 | 한국과학기술원 | Anisotropic conductive adhesives for ultrasonic bonding and electrical interconnection method of electronic components using thereof |
-
2016
- 2016-04-08 KR KR1020160043406A patent/KR101678178B1/en active IP Right Grant
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06187834A (en) * | 1992-12-18 | 1994-07-08 | Sumitomo Bakelite Co Ltd | Anisotropic conductive film |
| KR20000075397A (en) * | 1999-05-06 | 2000-12-15 | 신와 고교 가부시키가이샤 | Pipe coupling that has enhanced the earthquake-proof and sealing property |
| KR20070097250A (en) * | 2006-03-29 | 2007-10-04 | 삼성전자주식회사 | Anisotropic conductive film and display apparatus having the same |
| KR20110006012A (en) * | 2009-07-13 | 2011-01-20 | 한국과학기술원 | Anisotropic conductive adhesives for ultrasonic bonding and electrical interconnection method of electronic components using thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112151729A (en) * | 2019-06-26 | 2020-12-29 | 泰连德国有限公司 | Carrier structure, cell contact system and method of manufacture |
| CN112151729B (en) * | 2019-06-26 | 2024-03-08 | 泰连德国有限公司 | Carrier structure, battery cell contact system and method of manufacture |
| US12027727B2 (en) | 2019-06-26 | 2024-07-02 | Te Connectivity Germany Gmbh | Carrier structure, cell contacting system and manufacturing method |
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