JPH0621258Y2 - Ｌｅｄランプ - Google Patents

Ｌｅｄランプ

Info

Publication number
JPH0621258Y2
JPH0621258Y2 JP1987051564U JP5156487U JPH0621258Y2 JP H0621258 Y2 JPH0621258 Y2 JP H0621258Y2 JP 1987051564 U JP1987051564 U JP 1987051564U JP 5156487 U JP5156487 U JP 5156487U JP H0621258 Y2 JPH0621258 Y2 JP H0621258Y2
Authority
JP
Japan
Prior art keywords
light emitting
light
emitting elements
led lamp
tapered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987051564U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63159859U (enrdf_load_stackoverflow
Inventor
孝夫 皆川
Original Assignee
日本デンヨ−株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本デンヨ−株式会社 filed Critical 日本デンヨ−株式会社
Priority to JP1987051564U priority Critical patent/JPH0621258Y2/ja
Publication of JPS63159859U publication Critical patent/JPS63159859U/ja
Application granted granted Critical
Publication of JPH0621258Y2 publication Critical patent/JPH0621258Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1987051564U 1987-04-07 1987-04-07 Ｌｅｄランプ Expired - Lifetime JPH0621258Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987051564U JPH0621258Y2 (ja) 1987-04-07 1987-04-07 Ｌｅｄランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987051564U JPH0621258Y2 (ja) 1987-04-07 1987-04-07 Ｌｅｄランプ

Publications (2)

Publication Number Publication Date
JPS63159859U JPS63159859U (enrdf_load_stackoverflow) 1988-10-19
JPH0621258Y2 true JPH0621258Y2 (ja) 1994-06-01

Family

ID=30875944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987051564U Expired - Lifetime JPH0621258Y2 (ja) 1987-04-07 1987-04-07 Ｌｅｄランプ

Country Status (1)

Country Link
JP (1) JPH0621258Y2 (enrdf_load_stackoverflow)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002170998A (ja) * 2000-12-01 2002-06-14 Sharp Corp 半導体発光装置およびその製造方法
KR100732267B1 (ko) * 2003-09-29 2007-06-25 마츠시타 덴끼 산교 가부시키가이샤 선형 광원장치 및 그 제조방법, 그리고 면 발광장치
JP4789433B2 (ja) * 2004-06-30 2011-10-12 三洋電機株式会社 Ｌｅｄ表示器用筺体及びｌｅｄ表示器
JP2006210627A (ja) * 2005-01-27 2006-08-10 Kyocera Corp 発光素子収納用パッケージおよび発光装置ならびに照明装置
JP2006310568A (ja) * 2005-04-28 2006-11-09 Toyoda Gosei Co Ltd 発光装置
JP5722759B2 (ja) * 2006-04-21 2015-05-27 日亜化学工業株式会社 発光装置
JP2006287267A (ja) * 2006-07-25 2006-10-19 Nippon Leiz Co Ltd 光源装置の製造方法
JP2006310887A (ja) * 2006-07-25 2006-11-09 Nippon Leiz Co Ltd 光源装置の製造方法
DE102007015474A1 (de) * 2007-03-30 2008-10-02 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
JP5017085B2 (ja) * 2007-12-27 2012-09-05 株式会社日立製作所 光源モジュール
US8314442B2 (en) * 2008-02-08 2012-11-20 Nichia Corporation Light emitting device
TWI426594B (zh) * 2010-02-08 2014-02-11 能夠提高演色性之混光式發光二極體封裝結構
TW201203627A (en) * 2010-07-15 2012-01-16 Lextar Electronics Corp Light emitting diode and method for forming supporting frame thereof and improved structure of the supporting frame
JP6680274B2 (ja) 2017-06-27 2020-04-15 日亜化学工業株式会社 発光装置及び樹脂付リードフレーム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6037260U (ja) * 1983-08-22 1985-03-14 舶用電球株式会社 発光ダイオ−ドランプの発光部
JPS61158606A (ja) * 1984-12-28 1986-07-18 株式会社小糸製作所 照明装置

Also Published As

Publication number Publication date
JPS63159859U (enrdf_load_stackoverflow) 1988-10-19

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