JPH0617310Y2 - 放熱板の固定構造 - Google Patents
放熱板の固定構造Info
- Publication number
- JPH0617310Y2 JPH0617310Y2 JP1332988U JP1332988U JPH0617310Y2 JP H0617310 Y2 JPH0617310 Y2 JP H0617310Y2 JP 1332988 U JP1332988 U JP 1332988U JP 1332988 U JP1332988 U JP 1332988U JP H0617310 Y2 JPH0617310 Y2 JP H0617310Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- circuit board
- printed circuit
- mounting
- pressing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1332988U JPH0617310Y2 (ja) | 1988-02-02 | 1988-02-02 | 放熱板の固定構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1332988U JPH0617310Y2 (ja) | 1988-02-02 | 1988-02-02 | 放熱板の固定構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01118453U JPH01118453U (US06623731-20030923-C00012.png) | 1989-08-10 |
JPH0617310Y2 true JPH0617310Y2 (ja) | 1994-05-02 |
Family
ID=31223541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1332988U Expired - Lifetime JPH0617310Y2 (ja) | 1988-02-02 | 1988-02-02 | 放熱板の固定構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0617310Y2 (US06623731-20030923-C00012.png) |
-
1988
- 1988-02-02 JP JP1332988U patent/JPH0617310Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01118453U (US06623731-20030923-C00012.png) | 1989-08-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4481525A (en) | Heat dissipator for integrated circuit chips | |
GB2037484A (en) | Heat transfer mounting arrangement for a solid state device connected to a circuit board | |
JPH0617310Y2 (ja) | 放熱板の固定構造 | |
JP2536470Y2 (ja) | プリント基盤固定構造 | |
JPH0617309Y2 (ja) | 半導体の放熱装置 | |
JP2546304Y2 (ja) | 半導体素子の固定装置 | |
JPH05191071A (ja) | 発熱部品の取付構造 | |
JPH08760Y2 (ja) | 部品取付装置 | |
JPS6023996Y2 (ja) | 発熱部品取付装置 | |
JPS5940733Y2 (ja) | トランスの取付装置 | |
JPH0559894U (ja) | 発熱電子部品の放熱構造 | |
JPS6325741Y2 (US06623731-20030923-C00012.png) | ||
JPH0735422Y2 (ja) | 電気部品の取付装置 | |
JPH0316314Y2 (US06623731-20030923-C00012.png) | ||
JPH0617355Y2 (ja) | プリント配線板における放熱板取付構造 | |
JPH0337267Y2 (US06623731-20030923-C00012.png) | ||
JPS5833754Y2 (ja) | 放熱板の取付構造 | |
JPH0356078Y2 (US06623731-20030923-C00012.png) | ||
JPH0541559Y2 (US06623731-20030923-C00012.png) | ||
JPH10209670A (ja) | シールドケース | |
JPH07235781A (ja) | プリント基板取付け装置 | |
JPS6023984Y2 (ja) | Ic取付装置 | |
JPH0440282Y2 (US06623731-20030923-C00012.png) | ||
JPH0711484Y2 (ja) | チップ部品の接続固定装置 | |
JPH0810230Y2 (ja) | 電気部品と放熱体の取付構造 |