JPH0617303Y2 - 半導体素子収納用パツケ−ジ - Google Patents

半導体素子収納用パツケ−ジ

Info

Publication number
JPH0617303Y2
JPH0617303Y2 JP15715786U JP15715786U JPH0617303Y2 JP H0617303 Y2 JPH0617303 Y2 JP H0617303Y2 JP 15715786 U JP15715786 U JP 15715786U JP 15715786 U JP15715786 U JP 15715786U JP H0617303 Y2 JPH0617303 Y2 JP H0617303Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
convex portion
insulating frame
metal base
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP15715786U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6364047U (US07909887-20110322-C00021.png
Inventor
耕司 前
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP15715786U priority Critical patent/JPH0617303Y2/ja
Publication of JPS6364047U publication Critical patent/JPS6364047U/ja
Application granted granted Critical
Publication of JPH0617303Y2 publication Critical patent/JPH0617303Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Die Bonding (AREA)
JP15715786U 1986-10-14 1986-10-14 半導体素子収納用パツケ−ジ Expired - Lifetime JPH0617303Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15715786U JPH0617303Y2 (ja) 1986-10-14 1986-10-14 半導体素子収納用パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15715786U JPH0617303Y2 (ja) 1986-10-14 1986-10-14 半導体素子収納用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS6364047U JPS6364047U (US07909887-20110322-C00021.png) 1988-04-27
JPH0617303Y2 true JPH0617303Y2 (ja) 1994-05-02

Family

ID=31079446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15715786U Expired - Lifetime JPH0617303Y2 (ja) 1986-10-14 1986-10-14 半導体素子収納用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPH0617303Y2 (US07909887-20110322-C00021.png)

Also Published As

Publication number Publication date
JPS6364047U (US07909887-20110322-C00021.png) 1988-04-27

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