JPH0616433Y2 - 接続具の取付け構成体 - Google Patents
接続具の取付け構成体Info
- Publication number
- JPH0616433Y2 JPH0616433Y2 JP9588890U JP9588890U JPH0616433Y2 JP H0616433 Y2 JPH0616433 Y2 JP H0616433Y2 JP 9588890 U JP9588890 U JP 9588890U JP 9588890 U JP9588890 U JP 9588890U JP H0616433 Y2 JPH0616433 Y2 JP H0616433Y2
- Authority
- JP
- Japan
- Prior art keywords
- pieces
- insulating base
- attached
- connector
- locking hook
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011810 insulating material Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 7
- 239000004033 plastic Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000004677 Nylon Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9588890U JPH0616433Y2 (ja) | 1990-09-12 | 1990-09-12 | 接続具の取付け構成体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9588890U JPH0616433Y2 (ja) | 1990-09-12 | 1990-09-12 | 接続具の取付け構成体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0454181U JPH0454181U (enrdf_load_stackoverflow) | 1992-05-08 |
| JPH0616433Y2 true JPH0616433Y2 (ja) | 1994-04-27 |
Family
ID=31834980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9588890U Expired - Lifetime JPH0616433Y2 (ja) | 1990-09-12 | 1990-09-12 | 接続具の取付け構成体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0616433Y2 (enrdf_load_stackoverflow) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD975665S1 (en) | 2019-05-17 | 2023-01-17 | Asm Ip Holding B.V. | Susceptor shaft |
| US11557474B2 (en) | 2019-07-29 | 2023-01-17 | Asm Ip Holding B.V. | Methods for selective deposition utilizing n-type dopants and/or alternative dopants to achieve high dopant incorporation |
| US11594600B2 (en) | 2019-11-05 | 2023-02-28 | Asm Ip Holding B.V. | Structures with doped semiconductor layers and methods and systems for forming same |
| USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
| US11594450B2 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Method for forming a structure with a hole |
| US11848200B2 (en) | 2017-05-08 | 2023-12-19 | Asm Ip Holding B.V. | Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures |
| US11851755B2 (en) | 2016-12-15 | 2023-12-26 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
| US12040177B2 (en) | 2020-08-18 | 2024-07-16 | Asm Ip Holding B.V. | Methods for forming a laminate film by cyclical plasma-enhanced deposition processes |
| US12040184B2 (en) | 2017-10-30 | 2024-07-16 | Asm Ip Holding B.V. | Methods for forming a semiconductor structure and related semiconductor structures |
| US12040200B2 (en) | 2017-06-20 | 2024-07-16 | Asm Ip Holding B.V. | Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus |
| US12040199B2 (en) | 2018-11-28 | 2024-07-16 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
| US12406846B2 (en) | 2021-05-21 | 2025-09-02 | Asm Ip Holding B.V. | Method for depositing boron and gallium containing silicon germanium layers |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3000192B2 (ja) * | 1994-09-30 | 2000-01-17 | 第一電装部品株式会社 | ウェッジベースバルブ用ソケット |
-
1990
- 1990-09-12 JP JP9588890U patent/JPH0616433Y2/ja not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11851755B2 (en) | 2016-12-15 | 2023-12-26 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
| US11848200B2 (en) | 2017-05-08 | 2023-12-19 | Asm Ip Holding B.V. | Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures |
| US12040200B2 (en) | 2017-06-20 | 2024-07-16 | Asm Ip Holding B.V. | Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus |
| US12040184B2 (en) | 2017-10-30 | 2024-07-16 | Asm Ip Holding B.V. | Methods for forming a semiconductor structure and related semiconductor structures |
| US12040199B2 (en) | 2018-11-28 | 2024-07-16 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
| USD975665S1 (en) | 2019-05-17 | 2023-01-17 | Asm Ip Holding B.V. | Susceptor shaft |
| US11557474B2 (en) | 2019-07-29 | 2023-01-17 | Asm Ip Holding B.V. | Methods for selective deposition utilizing n-type dopants and/or alternative dopants to achieve high dopant incorporation |
| USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
| US12040229B2 (en) | 2019-08-22 | 2024-07-16 | Asm Ip Holding B.V. | Method for forming a structure with a hole |
| US11594450B2 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Method for forming a structure with a hole |
| US11594600B2 (en) | 2019-11-05 | 2023-02-28 | Asm Ip Holding B.V. | Structures with doped semiconductor layers and methods and systems for forming same |
| US12040177B2 (en) | 2020-08-18 | 2024-07-16 | Asm Ip Holding B.V. | Methods for forming a laminate film by cyclical plasma-enhanced deposition processes |
| US12406846B2 (en) | 2021-05-21 | 2025-09-02 | Asm Ip Holding B.V. | Method for depositing boron and gallium containing silicon germanium layers |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0454181U (enrdf_load_stackoverflow) | 1992-05-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5049092A (en) | Connector assembly for electrical components | |
| JP2590046B2 (ja) | 接続具の取付構成体 | |
| JPH0616433Y2 (ja) | 接続具の取付け構成体 | |
| US5108314A (en) | Connector assembly for electrical components | |
| JPH0737272Y2 (ja) | 接続具の取付け構成体 | |
| JPH0616431Y2 (ja) | 接続具の取付け構成体 | |
| JPH0616432Y2 (ja) | 接続具の取付け構成体 | |
| JPH0644047Y2 (ja) | 接続具の取付け構成体 | |
| JPH0633670Y2 (ja) | 接続具の取付け構成体 | |
| JPH071744Y2 (ja) | 接続具の取付構成体 | |
| JPH0648776Y2 (ja) | ランプの取付け構成体 | |
| JPH0648777Y2 (ja) | ランプの取付け構成体 | |
| JPH0648775Y2 (ja) | ランプの取付け構成体 | |
| JPH0626182U (ja) | 接続具の取付構成体 | |
| JPH0635356Y2 (ja) | 接続具の取付構成体 | |
| JPH0737273Y2 (ja) | 接続具の取付け構成体 | |
| JPH0754929Y2 (ja) | 接続具の取付構成体 | |
| JPH081569Y2 (ja) | 接続具の取付構成体 | |
| JPH0719115Y2 (ja) | 接続具の取付構成体 | |
| JPH0754930Y2 (ja) | 接続具の取付構成体 | |
| JP2506850Y2 (ja) | 接続具の取付構成体 | |
| JPH0658582U (ja) | 接続具の取付構成体 | |
| JPH0644075U (ja) | 接続具の取付け構成体 | |
| JPH0619121Y2 (ja) | 導電接続装置 | |
| JPH0644074U (ja) | 接続具の取付け構成体 |