JPH0611526Y2 - 回路基板 - Google Patents
回路基板Info
- Publication number
- JPH0611526Y2 JPH0611526Y2 JP1988089673U JP8967388U JPH0611526Y2 JP H0611526 Y2 JPH0611526 Y2 JP H0611526Y2 JP 1988089673 U JP1988089673 U JP 1988089673U JP 8967388 U JP8967388 U JP 8967388U JP H0611526 Y2 JPH0611526 Y2 JP H0611526Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- substrate
- ceramic substrate
- resistor
- lead pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 43
- 239000000919 ceramic Substances 0.000 claims description 36
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000003973 paint Substances 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 7
- 238000010304 firing Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988089673U JPH0611526Y2 (ja) | 1988-07-05 | 1988-07-05 | 回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988089673U JPH0611526Y2 (ja) | 1988-07-05 | 1988-07-05 | 回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0211374U JPH0211374U (enrdf_load_html_response) | 1990-01-24 |
| JPH0611526Y2 true JPH0611526Y2 (ja) | 1994-03-23 |
Family
ID=31314219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988089673U Expired - Lifetime JPH0611526Y2 (ja) | 1988-07-05 | 1988-07-05 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611526Y2 (enrdf_load_html_response) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53106465A (en) * | 1977-02-28 | 1978-09-16 | Akai Electric | Buried printed circuit substrate |
| JPS6039272U (ja) * | 1983-08-25 | 1985-03-19 | 日本ビクター株式会社 | 厚膜回路基板 |
-
1988
- 1988-07-05 JP JP1988089673U patent/JPH0611526Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0211374U (enrdf_load_html_response) | 1990-01-24 |
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