JPH0611523Y2 - 混成集積回路装置 - Google Patents
混成集積回路装置Info
- Publication number
- JPH0611523Y2 JPH0611523Y2 JP129390U JP129390U JPH0611523Y2 JP H0611523 Y2 JPH0611523 Y2 JP H0611523Y2 JP 129390 U JP129390 U JP 129390U JP 129390 U JP129390 U JP 129390U JP H0611523 Y2 JPH0611523 Y2 JP H0611523Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit device
- circuit boards
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 description 11
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000035882 stress Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP129390U JPH0611523Y2 (ja) | 1990-01-12 | 1990-01-12 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP129390U JPH0611523Y2 (ja) | 1990-01-12 | 1990-01-12 | 混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0395679U JPH0395679U (enrdf_load_stackoverflow) | 1991-09-30 |
| JPH0611523Y2 true JPH0611523Y2 (ja) | 1994-03-23 |
Family
ID=31505205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP129390U Expired - Lifetime JPH0611523Y2 (ja) | 1990-01-12 | 1990-01-12 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611523Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007103554A (ja) * | 2005-10-03 | 2007-04-19 | Rohm Co Ltd | ハイブリッド集積回路装置とその製造方法 |
-
1990
- 1990-01-12 JP JP129390U patent/JPH0611523Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0395679U (enrdf_load_stackoverflow) | 1991-09-30 |
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