JPH0611523Y2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a hybrid integrated circuit device mounted on a motherboard or the like to form various electronic devices.

In particular, the present invention provides a hybrid integrated circuit device which is not damaged by a suction device or a sandwiching device when a miniaturized hybrid integrated circuit device is assembled at high speed.

[Conventional technology]

FIG. 3 is an explanatory view of a hybrid integrated circuit device in a conventional example. In the figure, the electronic components 15 are connected to the insulating circuit boards 11 and 12 in a wiring pattern (not shown). On one of the insulating circuit boards 11 and 12 (the insulating circuit board 11 in FIG. 3), a molded resin molded body 16 into which the lead terminals 14 are inserted is attached by, for example, an epoxy resin adhesive. The insulating circuit board 11 and the other of the insulating circuit board 12 are electrically connected to each other by a jumper board 13 having flexibility so that the board sides are aligned. The electronic component 15 and the flexible jumper substrate 13 are mounted on cream solder and then connected to the electrode 18 or a wiring pattern (not shown) by reflow soldering.

The insulated circuit boards 11 and 12 are made of a metal base or a ceramic board having a good heat dissipation property, and the board side on which the electronic component 15 is not mounted is fixed with an epoxy resin adhesive.

Such a hybrid integrated circuit device H not only becomes compact, but also dissipates heat from the insulating circuit boards 11 and 12.

[Problems to be solved by the device]

In recent years, the hybrid integrated circuit device H has been required to have high-speed assembly, downsizing, high integration, improvement of heat dissipation, and the like.

For example, in order to mount the hybrid integrated circuit device H in the conventional example on the mother substrate at high speed, the movement of the suction device or the sandwiching device of the automatic machine is accelerated.

When the suction device or the sandwiching device that moves at a high speed sucks or sandwiches the hybrid integrated circuit device H, the electronic component 15 of the hybrid integrated circuit device H or the insulating circuit board 11 or 12 is subjected to a force more than the set force for some reason. It may hit. In such a case, stress was applied to that portion more than necessary, and due to aging, cracks were generated in that portion, causing a failure.

Further, since the surface of the hybrid integrated circuit device H in the conventional example has irregularities due to the electronic components 15 and the like arranged at a high density, the electronic components mounted on the hybrid device H with the suction device or the sandwiching device. There was a case where it was not adhered to 15 and an adsorption error or a clamping error occurred.

Further, when the power electronic component is mounted on the hybrid integrated circuit device H in the conventional example, the heat of the power electronic component is transferred to the insulated circuit boards 11 and 12, and the insulated circuit board 1 concerned.
Heat is accumulated on the adhesive surfaces 17 of 1 and 12. Such heat may cause power electronic components to change over time, and electronic components 15 near the power electronic components or the insulated circuit board 1.
1 and 12 may be deteriorated, which may lead to a failure of electronic devices equipped with these.

Further, since the insulated circuit boards 11 and 12 of the hybrid integrated circuit device H in the conventional example are connected as shown in FIG. 3 by the jumper board 13 having flexibility, they protrude from the insulated circuit boards 11 and 12. The number of parts increases, and the size cannot be reduced.

Further, since the surface of the hybrid integrated circuit device H in the conventional example is an electronic component or the like arranged in high density, there is no place to attach the product name or lot number of the hybrid integrated circuit device H.

SUMMARY OF THE INVENTION In order to solve the above problems, an object of the present invention is to provide a hybrid integrated circuit device which is strong against impact of an automatic suction device or a sandwiching device and convenient for the suction or sandwiching.

Another object of the present invention is to provide a hybrid integrated circuit device in which the suction device or the sandwiching device does not fail to grab the hybrid integrated circuit device.

A further object of the present invention is to provide a hybrid integrated circuit device which has good heat dissipation and is small in size and which can be given a product name or a lot number.

[Means for Solving the Problems]

To achieve the above object, the hybrid integrated circuit device of the present invention is mounted on both of the insulating circuit boards, and two insulating circuit boards on which a plurality of electronic components are electrically connected by a wiring pattern and mounted. A jumper board having a spring property that electrically and mechanically connects to one of the inner ends of the insulated both-insulated circuit boards so that the electronic components facing each other face inward,
At the other end of at least one of the two insulated circuit boards,
And a molded resin molded body having lead terminals that are fixed so as to provide a space between the electronic components of the two insulated circuit boards.

[Action]

When the suction device or the sandwiching device collides with the hybrid integrated circuit device with a force larger than the preset value for some reason, the jumper board with a spring property provided between the insulating circuit boards serves as a buffer member for the electronic component or Reduce the stress on the insulated circuit board. In addition, the flat surface of the insulated circuit board opposite to the surface on which the electronic components are mounted eliminates the possibility of gripping the suction device or the sandwiching device, and allows sufficient space for displaying the product name or lot number. In addition, the spring action of the jumper substrate having a spring property prevents the hybrid integrated circuit device from dropping out of the holding device during high-speed movement of the holding device.

Since the electronic component mounting sides of the hybrid integrated circuit device are arranged so as to face each other, an air flow path is formed and the heat dissipation effect of the hybrid integrated circuit device is improved.

Since the jumper substrate was connected to the inside of the insulating circuit substrate to enhance the spring property and the portion protruding from the insulating circuit substrate to the outside was reduced, a small hybrid integrated circuit device could be obtained.

〔Example〕

An embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a sectional view of a hybrid integrated circuit device according to the present invention, and FIG. 2 is an assembly explanatory view of the hybrid integrated circuit device according to the present invention.

In the figure, an electronic component 5 is provided on the insulated circuit boards 1 and 2.
Are connected to a wiring pattern (not shown). One end of the molded resin molded body 6 into which the lead terminals 4 are inserted is fixed to the insulated circuit board 1 by, for example, an epoxy resin adhesive 9. Lead terminals 14 are soldered to a wiring pattern (not shown) of the insulating circuit board 1. The insulated circuit board 1 and the insulated circuit board 2 are
The jumper wire 7 embedded in the jumper substrate 3 having a spring property is electrically connected to the electrode 8 on the mounting side of the electronic component 5. The jumper substrate 3 is made of polyimide or polyamide and is thickly formed so as to have a spring property. The electronic component 5 and the jumper substrate 3 having a spring property are mounted on the cream solder and then connected to the electrode 8 or a wiring pattern (not shown) by reflow soldering. The insulated circuit boards 1 and 2 are made of a metal base or a ceramic board having good heat dissipation. Such a hybrid integrated circuit device H is bent from the middle of the jumper substrate 3 having a spring property, and one end of the insulating circuit substrate 2 is bonded to the other end of the molded resin molded body 6 into which the lead terminal 4 is inserted. Fixed by.

Although the embodiment of the present invention has been described in detail above, the present invention is not limited to the above embodiment. Various design changes can be made without departing from the present invention described in the claims for utility model registration.

For example, the material or shape of the insulating circuit board can be changed arbitrarily. Also, in order to reduce the stress applied to the molded resin molded body with the lead terminals inserted,
A known elastic material may be mixed in the molded resin molded body. However, when a mold resin molded body having elasticity is adopted, stress is applied to the root of the lead terminal. In order to prevent this, the lead terminal may be provided with a movable hole in the molded resin molding.

[Advantage of the Invention] According to the present invention, since the jumper board having the spring property is present between the two insulated circuit boards, it is strong against the impact of the automatic suction device or the sandwiching device, and is suitable for the suction or sandwiching. An integrated circuit device can be provided.

Further, according to the present invention, even in a small hybrid integrated circuit device, since the contact portion of the suction device or the sandwiching device is flat, a hybrid integrated circuit device that does not fail to grab the hybrid integrated circuit device is provided. You can

Further, according to the present invention, since there is an air flow passage on the electronic component mounting side, cooling can be performed from both sides of the electronic component, heat dissipation is improved, and a compact integrated space with a space for attaching a product name or lot number is provided. A circuit device can be provided.

[Brief description of drawings]

FIG. 1 is a sectional view of a hybrid integrated circuit device according to the present invention, and FIG.
FIG. 3 is an explanatory view of the assembly of the hybrid integrated circuit device according to the present invention.
The figure is an explanatory view of a hybrid integrated circuit device in a conventional example. 1, 2 ... Insulated circuit board 3 ... Spring-provided jumper board 4 ... Lead terminal 5 ... Electronic component 6 ... Molded resin molding 7 ... Jumper wire 8 ... Electrode 9 ... Adhesive 10 ... Air flow passage

Claims (1)

[Scope of utility model registration request] 1. Two insulated circuit boards 1, 2 on which a plurality of electronic components 5 are electrically connected by a wiring pattern and are mounted, and electronic components 5 mounted on the both insulated circuit boards 1, 2.
So that they face each other inwardly.
Between the electronic components of the insulating circuit boards 1 and 2 at the other end of at least one of the insulating circuit boards 1 and 2 and a jumper board 3 having a spring property for electrically and mechanically connecting to one inner side of the 2. A hybrid integrated circuit device comprising: a molded resin molded body 6 having a lead terminal 4 fixed so as to provide a space therein.