JP3593734B2 - Additional component mounting structure for printed wiring boards - Google Patents

Additional component mounting structure for printed wiring boards Download PDF

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Publication number
JP3593734B2
JP3593734B2 JP04812095A JP4812095A JP3593734B2 JP 3593734 B2 JP3593734 B2 JP 3593734B2 JP 04812095 A JP04812095 A JP 04812095A JP 4812095 A JP4812095 A JP 4812095A JP 3593734 B2 JP3593734 B2 JP 3593734B2
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Japan
Prior art keywords
insulating sheet
printed wiring
wiring board
pad
component
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JP04812095A
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JPH08250836A (en
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博 綱島
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Fujitsu Ltd
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Fujitsu Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Description

【０００１】
【産業上の利用分野】
本発明は、印刷配線板の追加部品実装構造に関する。
電子装置の機能追加や性能の改善のため、実装部品が搭載された印刷配線板に、さらに半導体部品，抵抗体，コンデンサ等の電子部品を追加して実装することがある。このように電子部品を追加実装する際に、追加部品の実装が低コストのことが要求される。
【０００２】
【従来の技術】
電子装置の機能追加や性能の改善が要求されると思われる場合には、従来は印刷配線板に予めダミーパッドを配設しておき、電子部品の追加実装が必要になると、このダミーパッドに追加部品のリード又は電極を位置合わせしてはんだ付けして、追加部品を表面実装する。
【０００３】
そして、追加部品を接続すべきパターン又はパッドとダミーパッドとをワイヤをはんだ付け等して接続していた。
【０００４】
【発明が解決しようとする課題】
追加を予測してダミーパッドを設ける従来の手段は、印刷配線板への電子部品の高密度実装化を阻害するという問題点があった。
【０００５】
また、予測して設けたダミーパッドが、実際に追加実装する電子部品のパッド配列と異なる場合には、ダミーパッドを使用することができないので、その印刷配線板を廃却して新規に印刷配線板を製作することになり、印刷配線板がコスト高になるという問題点があった。
【０００６】
本発明はこのような点に鑑みて創作されたもので、電子部品を高密度実装した印刷配線板に適用して、追加部品の実装が容易で、追加部品の実装コストが安価な実装構造を提供することを目的としている。
【０００７】
【課題を解決するための手段】
上記の目的を達成するために本発明は、図１に例示したように絶縁シート１０の表面に形成したパッド２２−１，２２−２ に、リード２１−１或いは電極２１−２をはんだ付けして追加部品２０−１，２０−２ を絶縁シート１０に表面実装し、印刷配線板１に搭載した実装部品の上面に絶縁シート１０を搭載固着し、絶縁シート１０のパッド２２−１，２２−２ と印刷配線板１のパッド３又はパターンとを、ワイヤ３０を介して接続した構成とする。
【０００８】
図２に例示したように、絶縁シート１０の表面に形成したアースパッド１３と、絶縁シート１０の中間層のほぼ全面に形成したアース層１１とを、ビア１２を介して接続する。アースパッド１３と追加部品２０−１のアースリードをはんだ付けするリード対応パッドとをパターン又はワイヤ３０を介して接続する。
【０００９】
さらにアースパッド１３と印刷配線板１のアースパターンとをワイヤ３１を介して接続した構成とする。
或いは図３に例示したように、絶縁シート１０に通風用の孔１５を設けた構成とする。
【００１０】
或いはまた、絶縁シート１０は、裏面に保護フィルム１７で覆われたた接着剤１６が予め塗布形成されており、印刷配線板１に搭載するあたり保護フィルム１７を剥離して、絶縁シート１０を、印刷配線板１に搭載した実装部品の上面に、絶縁シート１０を接着剤１６を介して接着する構成とする。
【００１１】
図４に例示したように、絶縁シート１０のパッド２２−１のそれぞれの端部に、ピン４０を垂設し、一端を印刷配線板１のパッド３又はパターンに接続するワイヤ３０の他端を、ピン４０に巻回しはんだ付けして、絶縁シート１０と印刷配線板１を接続する構成とする。
【００１２】
図５に例示したように、絶縁シート１０の裏面に弾性ある一対の脚部材４５を設ける。この脚部材４５を印刷配線板１に搭載した実装部品２のパッケージに挟着することで、絶縁シート１０が印刷配線板１に搭載した実装部品２の上面に載置固着される構成とする。
【００１３】
図６乃至図９に例示したように、絶縁シート１０の表面に、重置固着される絶縁材よりなる係合板５０と、下方に突出するよう係合板５０に垂設され、絶縁シート１０の長孔１８を遊貫する複数の係着金具５１と、印刷配線板１に搭載した実装部品２のリード２Ａに係着するよう、それぞれの係着金具５１の下部に形成されたスリット５１Ａ と、係着金具５１がリード２Ａに係着した状態で、実装部品２の側端面に係止するよう絶縁シート１０の裏面に突設したストッパ板１９とを備える。
【００１４】
そして、係着金具５１がリード２Ａに係着して、印刷配線板１に搭載した実装部品２上に絶縁シート１０が載置固着された構成とする。
或いは、係着金具５１に接続されたパッド５３が係合板５０の表面に形成され、パッド５３と追加部品２０−１，２０−２ のリード又は電極をはんだ実装した選択したパッド２２−１とが、ワイヤ３０を介して接続する構成とする。
【００１５】
【作用】
追加部品を絶縁シートに表面し、その絶縁シートを印刷配線板に搭載した実装部品上に載置搭載する構成であるので、実装部品が高密度に印刷配線板に搭載されていても、追加部品を容易に印刷配線板に接続搭載することができる。
【００１６】
また、実際に追加実装する電子部品のパッド配列に合わせて、絶縁シートにパッドを設けるものであるから、従来のように、予測して設けたダミーパッドが実際に追加実装する電子部品のパッド配列と異なることがない。したがって、既存の印刷配線板を廃却して新規に印刷配線板を製作する必要がないので、追加部品の実装コストが安価である。
【００１７】
絶縁シートの中間層にアース層を設けたものは、追加部品と印刷配線板に搭載した実装部品間のノイズの授受が減少する。
絶縁シートに通風用の孔を設けることにより、印刷配線板を冷却した空気がこの孔を経て上昇し排出されるので、絶縁シートを設けたことによる印刷配線板の冷却性能の低下がある程度軽減される。
【００１８】
絶縁シートの裏面に保護フィルムで覆われたた接着剤を予め塗布形成しておくことにより、絶縁シートを簡単に印刷配線板に搭載した実装部品上に固着でき、追加部品を印刷配線板に実装できる。
【００１９】
絶縁シートのパッドのそれぞれの端部にピンを垂設し、一端を印刷配線板のパッド又はパターンに接続するワイヤの他端を、ピンに巻回しはんだ付けして接続する構成とすることで、追加部品と印刷配線板との接続作業が容易になる。
【００２０】
絶縁シートの裏面に実装部品のパッケージに挟着す弾性ある一対の脚部材を設けることで、絶縁シートを簡単に印刷配線板に搭載した実装部品上に固着でき、追加部品を印刷配線板に実装できる。
【００２１】
絶縁シート表面に重置固着する絶縁材よりなる係合板と、係合板に垂設した係着金具とを設けることで、絶縁シートを印刷配線板に搭載した実装部品上に固着でき、追加部品を印刷配線板に実装できる。
【００２２】
係着金具に接続されたパッドと、追加部品リード又は電極をはんだした選択したパッドとをワイヤを介して接続する構成とすることで、印刷配線板の所定のパターン−実装部品のリード−係着金具−係合板のパッド−ワイヤ−追加部品のリードという回路ができ、係着金具が追加部品の接続素子の機能を有する。
【００２３】
【実施例】
以下図を参照しながら、本発明を具体的に説明する。なお、全図を通じて同一符号は同一対象物を示す。
【００２４】
図１は本発明の実施例１の図で、(A)は平面図、(B)は側面図、図２は本発明の実施例２の図で、(A)は平面図、(B)は側断面図、図３は本発明の実施例３の図で、(A)は平面図、(B)は側断面図であり、図４は本発明の実施例４の図で、(A)は平面図、(B)は側断面図である。
【００２５】
図５は本発明の実施例５の図で、(A)は組合せ前の側面図、(B)は組合せ後の側面図、図６は本発明の実施例６の平面図、図７は図６に示すＡ矢視側面図、図８は図６に示すＢ矢視側面図であり、図９は係合板の図で、(A)は平面図、(B)は側面図である。
【００２６】
図において、１は半導体部品等の実装部品２が、高密度に表面実装された印刷配線板である。実装部品２のそれぞれのリード２Ａは、印刷配線板１の表面に配列したパッド３にはんだ付けされて接続されている。
【００２７】
２０−１は、電子装置の機能追加や性能の改善のため、印刷配線板１に追加実装する、パッケージの側面にリード２１−１が配列した表面実装型の半導体部品等の追加部品である。
【００２８】
２０−２ は電子装置の機能追加や性能の改善のため、印刷配線板１に追加実装する、本体の両端面に電極２１−２を設けた表面実装型の抵抗体， コンデンサー等の追加部品である。
【００２９】
１０は、樹脂積層基板、セラミックス基板、厚い樹脂フィルム等の絶縁シートである。
絶縁シート１０の表面に配列形成したパッド２２−１に、追加部品２０−１の対応するリード２１−１を位置合わせして載せ、はんだ付けして追加部品２０−１を絶縁シート１０に表面実装している。また、絶縁シート１０の表面に対向して形成したパッド２２−２に、追加部品２０−２の対向する電極２１−２を位置合わせして載せ、はんだ付けして追加部品２０−２を絶縁シート１０に表面実装している。
【００３０】
印刷配線板１に配列搭載された実装部品２に架橋するように、絶縁シート１０を載置し、絶縁シート１０の裏面と実装部品２の上面とを接着剤を用いて接着することで、絶縁シート１０を印刷配線板１上に搭載している。
【００３１】
金線， アルミニウム線， 銅線等のワイヤ３０の一端を、絶縁シート１０のパッド２２−１，２２−２ に、熱圧着或いははんだ付けして接続し、またワイヤ３０の他端を印刷配線板１のパッド３又はパターンに、熱圧着或いははんだ付けして接続して、追加部品２０−１，２０−２ を印刷配線板１の回路に接続している。
【００３２】
上述のように追加部品を絶縁シート１０に表面実装し、絶縁シート１０を実装部品２の上部に固着しているので、実装部品が高密度に搭載された印刷配線板１に、追加部品を簡単に実装することができる。
【００３３】
図２に図示した絶縁シート１０は、表面の一隅にアースパッド１３を形成するとともに、中間層にアース層１１を設け、ビア１２を介してアース層１１とアースパッド１３とを接続している。
【００３４】
この絶縁シート１０に追加部品２０−１を表面実装し、絶縁シート１０の裏面を実装部品２の上面に載置固着し、ワイヤを介して絶縁シート１０のパッド２２−１と印刷配線板１のパッド又はパターンとを接続している。
【００３５】
アースパッド１３と追加部品２０−１のアースリードをはんだ付けするリード対応パッドとをワイヤ３０を介して接続している。
さらに、アースパッド１３と印刷配線板１のアースパターンとを断面積が大きい銅線等のワイヤ３１を介して接続している。
【００３６】
上述のように絶縁シート１０に中間層の全面にアース層１１を設けて、絶縁シート１０の上面と印刷配線板１との間を電磁波的に遮断している。したがって、追加部品２０−１と印刷配線板１に搭載した実装部品２との間のノイズの授受が減少する。
【００３７】
図３に図示した絶縁シート１０には、後部の幅が大きい平面視が凸形のパッド２２−１を２列に対向配列し、パッド列の間に通風用の細長い孔１５を設けている。
上述のように絶縁シート１０に通風用の孔１５を設けることにより、印刷配線板１を冷却した空気がこの孔１５を経て上昇し排出されるので、絶縁シート１０を印刷配線板１に搭載したことにより、印刷配線板の冷却性能の低下がある程度軽減される。
【００３８】
平面視が凸形のパッドとすることで、同一のパッドに２本のワイヤ３０を平面的に並べてはんだつけ接続することが容易となり、且つその接続の信頼度が高くなる。
【００３９】
また、図３に図示したように、絶縁シート１０の裏面に予め接着剤１６を塗布形成し、絶縁シート１０を搭載する前まで、保護フィルム１７で接着剤１６を覆っている。追加部品２０−１を印刷配線板１に実装する際に、保護フィルム１７を剥がして接着剤１６を裸出し、絶縁シート１０の裏面を印刷配線板１に搭載した実装部品２の上面に載置し接着剤１６で接着するものとする。
【００４０】
上述のようにすることで、絶縁シートを印刷配線板に搭載する直前に接着剤を塗布する方法に較べて、絶縁シートの搭載固着作業が簡単になる。
図４において、４０は、絶縁シート１０の表面に形成した矩形状のパッド２２−１のそれぞれの端部に設けた孔に圧入して、絶縁シート１０に垂設した銅合金等の金属材よりなるピンである。
【００４１】
さらに、絶縁シート１０の裏面に絶縁フィルム４１を貼着して、ピン４０の下端部が印刷配線板１に搭載した実装部品２の上面に電気的に接触するのを防止するとともに、実装部品２が損傷しないようにしている。
【００４２】
一端を印刷配線板の印刷配線板のパッド又はパターンに接続したするワイヤ３０の他端を、絶縁シート１０の表面に突出したピン４０に巻回し、さらにはんだ付けしている。
【００４３】
上述のようなピン４０を設けたことにより、ワイヤ３０の接続作業が容易となるとともに、その接続の信頼度が向上する。
図５において、４５は、弾性ある金属材よりなる逆Ｌの字形の脚部材である。一対の脚部材４５は、それぞれの水平板部が絶縁シート１０の裏面に密着し、ねじ等により絶縁シート１０に対向して固着されている。
【００４４】
なお、脚部材４５の垂直板部は実装部品２のパッケージを挟持し易いように外側に凸に湾曲させてある。
図５の（Ａ） に図示したように、表面に追加部品２０−１を表面実装した絶縁シート１０に、上述の脚部材４５を対向して取付けている。
【００４５】
そして、印刷配線板１に搭載した実装部品２のパッケージの上方に、脚部材４５を位置合わせし、絶縁シート１０を押下すると一対の脚部材４５のそれぞれの垂直部材が外側に開脚し、脚の下端部近傍の内側面がパッケージの側面を摺動しながら絶縁シート１０が降下する。
【００４６】
そして、絶縁シート１０の裏面が実装部品２の上面に当接した時に、図５の（Ｂ） に図示したように、脚部材４５が復帰して閉脚し実装部品２のパッケージに挟着する。
【００４７】
したがって、絶縁シート１０を簡単に印刷配線板１に搭載した実装部品２上に固着でき、追加部品２０−１を印刷配線板１に実装することができる。
図６乃至図９において、５０は、絶縁シート１０の表面に重置固着する細長い角板上の絶縁材よりなる係合板である。
【００４８】
５１は、下方に突出するよう係合板５０に垂設された、銅系合金等からなる短冊片状の係着金具である。
印刷配線板１に搭載した実装部品２のパッケージの側面に配列したリード２Ａのピッチの倍数のピッチで、係着金具５１は係合板５０に横一列に配列している。
【００４９】
係合板５０の表面に、係着金具５１の上部に繋がるパッド５３を設けている。
係着金具５１の下部に、詳細を図９に図示したように一方の側面が開口したスリット５１Ａ を設けてある。このスリット５１Ａ は、実装部品２のリード２Ａの水平部分に差し込まれ嵌合するものである。
【００５０】
また、係合板５０の一方の端部にねじ６１の頸部を挿入する孔５２を設けている。
一方、絶縁シート１０には、係合板５０を重置する際に、係着金具５１が遊貫する長孔１８を設けている。また、係着金具５１が実装部品２のリード２Ａに係着した時に、実装部品２の側端面に係止するストッパ板１９を、絶縁シート１０の裏面に取り付けてある。
【００５１】
６０は、係合板５０を絶縁シート１０に重置した状態で、係合板５０を絶縁シート１０に固着する側面視がコ形のホルダ金具である。
ホルダ金具６０の開口幅（上板部と下板部の間隔） は、（絶縁シート１０の板厚＋係合板５０の板厚）よりもわずかに大きい。
【００５２】
ホルダ金具６０の上板部は、ねじ６１の頸を挿入するねじ用孔を有し、可撓性あるように板厚が薄い。ホルダ金具６０の下板部は厚くて剛性を有し、上板部のねじ用孔に対向する位置に、ねじ６１のねじ部が螺合するねじ孔を設けてある。
【００５３】
上述のように構成した素子を用いた追加部品２０−１を印刷配線板１に実装するには、下記の手順による。
絶縁シート１０を印刷配線板１に搭載した２個の実装部品２の上面に架橋するように載置し、一方の実装部品２のパッケージの側端面にストッパ板１９の側面を当接する。
【００５４】
係着金具５１を絶縁シート１０の長孔１８に差込み、係合板５０を絶縁シート１０の上面に重ねる。
そして係合板５０をストッパ板１９方向にずらして、それぞれの係着金具５１のスリット５１Ａ を実装部品２の対応するリード２Ａに嵌入し、係着金具５１をリード２Ａに係着させる。
【００５５】
重置した絶縁シート１０と係合板５０とを挟むように、絶縁シート１０の横方向からホルダ金具６０の開口を嵌挿しする。ホルダ金具６０の上板部のねじ用孔、係合板５０の孔５２及び絶縁シート１０の長孔１８を貫通するように、ねじ６１を差込みホルダ金具６０の下板部のねじ孔に螺着し、上板部を撓ませて、上板部，係合板５０及び絶縁シート１０を締め付けて、係合板５０を絶縁シート１０に固着する。
【００５６】
一方、ストッパ板１９が実装部品２のパッケージの側端面に当接しているので、係着金具５１のスリット５１Ａ が実装部品２のリード２Ａから外れる方向に、絶縁シート１０即ち係合板５０が動くことが阻止される。
【００５７】
金線，アルミニウム線，銅線等のワイヤ３２の一端を、係着金具５１に繋がる係合板５０の表面に設けたパッド５３にはんだ付け等して接続する。またそのワイヤ３２の他端を、追加部品２０−１のリード２１−１が接続した絶縁シート１０の表面に設けた選択したパッド２２−１にはんだ付け等して接続する。
【００５８】
また、実装部品２のその他のパッド２２−１は、ワイヤ３０を介して印刷配線板１のパッド３又はパターンに接続する。
上述のような構成とすることで、印刷配線板１の所定のパターン−実装部品２のリード２Ａ−係着金具５１−係合板５０のパッド−ワイヤ３２−実装部品２のリード２Ａとい回路が形成され、係着金具５１を絶縁シート１０の固着手段と、電気回路素子との両者の兼用として使用できる。
【００５９】
【発明の効果】
本発明は、以上のように構成されているので、以下に記載されるような効果を奏する。
【００６０】
追加部品を絶縁シートに表面し、その絶縁シートを印刷配線板に搭載した実装部品上に載置搭載する構成であるので、実装部品が高密度に印刷配線板に搭載されていても、追加部品を容易に印刷配線板に接続搭載することができる。
【００６１】
また、実際に追加実装する電子部品のパッド配列に合わせて、絶縁シートにパッドを設けるものであるから、従来のように、予測して設けたダミーパッドが実際に追加実装する電子部品のパッド配列と異なることがない。したがって、既存の印刷配線板を廃却して新規に印刷配線板を製作する必要がないので、追加部品の実装コストが安価である。
【００６２】
絶縁シートの中間層にアース層を設けたものは、追加部品と印刷配線板に搭載した実装部品間のノイズの授受が減少する。
絶縁シートに通風用の孔を設けたことにより、絶縁シートを設けたことによる印刷配線板の冷却性能の低下がある程度軽減される。
【００６３】
絶縁シートの裏面にに保護フィルムで覆われたた接着剤を予め塗布形成しておくことにより、追加部品を印刷配線板に簡単に実装できる。
絶縁シートのパッドのそれぞれの端部にピンを垂設したものは、追加部品と印刷配線板との接続作業が容易になり、且つ接続の信頼度が向上する。
【００６４】
絶縁シートの裏面に実装部品のパッケージに挟着す弾性ある一対の脚部材を設けたものは、絶縁シートを簡単に印刷配線板に搭載した実装部品上に固着できて、追加部品を印刷配線板に簡単に実装できる。
【００６５】
絶縁シート表面に係合板を重置固着し、実装部品のリードに係着金具を係着する構成のものは、電子部品を高密度実装した印刷配線板の搭載し易い実装部品を選択して、その上方に追加部品を実装できる。
【００６６】
また、係着金具が絶縁シートを固着する機能と追加部品の接続素子との機能を有する。
【図面の簡単な説明】
【図１】本発明の実施例１の図で、(A)は平面図、(B)は側面図である。
【図２】本発明の実施例２の図で、(A)は平面図、(B)は側断面図である。
【図３】本発明の実施例３の図で、(A)は平面図、(B)は側断面図である。
【図４】本発明の実施例４の図で、(A)は平面図、(B)は側断面図である。
【図５】本発明の実施例５の図で、(A)は組合せ前の側面図、(B)は組合せ後の側面図である。
【図６】本発明の実施例６の平面図である。
【図７】図６に示すＡ矢視側面図である。
【図８】図６に示すＢ矢視側面図である。
【図９】係合板の図で、(A)は平面図、(B)は側面図である。
【符号の説明】
１ 印刷配線板
２ 実装部品
2A リード
３，22-1,22-2,53 パッド
10 絶縁シート
11 アース層
12 ビア
13 アースパッド
16 接着剤
17 保護フィルム
18 長孔
19 ストッパ板
20-1，20-2 追加部品
21-1 リード
21-2 電極
30，31 ワイヤ
40 ピン
43 脚部材
50 係合板
51 係着金具
51A スリット
60 ホルダ金具[0001]
[Industrial applications]
The present invention relates to an additional component mounting structure for a printed wiring board.
In order to add functions and improve performance of electronic devices, electronic components such as semiconductor components, resistors, and capacitors may be additionally mounted on a printed wiring board on which mounted components are mounted. When the electronic components are additionally mounted in this way, it is required that the mounting of the additional components be at low cost.
[0002]
[Prior art]
Conventionally, when it is considered that additional functions and performance improvement of electronic devices are required, dummy pads are previously arranged on the printed wiring board, and when additional mounting of electronic components is necessary, The additional components are surface-mounted by aligning and soldering the leads or electrodes of the additional components.
[0003]
Then, a pattern or pad to which an additional component is to be connected and the dummy pad are connected by soldering a wire or the like.
[0004]
[Problems to be solved by the invention]
The conventional means of providing dummy pads in anticipation of addition has a problem in that high-density mounting of electronic components on a printed wiring board is hindered.
[0005]
Also, if the dummy pad that is predicted and provided is different from the pad arrangement of the electronic component to be actually additionally mounted, the dummy pad cannot be used. There is a problem in that a printed circuit board is required to be manufactured, which increases the cost.
[0006]
The present invention has been made in view of the above points, and is applied to a printed wiring board on which electronic components are mounted at a high density, and a mounting structure in which mounting of additional components is easy and mounting cost of the additional components is inexpensive. It is intended to provide.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, the leads 21-1 or the electrodes 21-2 are soldered to the pads 22-1 and 22-2 formed on the surface of the insulating sheet 10 as illustrated in FIG. The additional components 20-1 and 20-2 are surface-mounted on the insulating sheet 10, and the insulating sheet 10 is mounted and fixed on the upper surface of the mounted component mounted on the printed wiring board 1, and the pads 22-1 and 22-22 of the insulating sheet 10 are mounted. 2 and a pad 3 or a pattern of the printed wiring board 1 are connected via a wire 30.
[0008]
As illustrated in FIG. 2, the ground pad 13 formed on the surface of the insulating sheet 10 and the ground layer 11 formed on almost the entire intermediate layer of the insulating sheet 10 are connected via the via 12. The ground pad 13 is connected to a lead corresponding pad for soldering the ground lead of the additional component 20-1 via a pattern or a wire 30.
[0009]
Further, the ground pad 13 and the ground pattern of the printed wiring board 1 are connected via a wire 31.
Alternatively, as illustrated in FIG. 3, the insulating sheet 10 is provided with a ventilation hole 15.
[0010]
Alternatively, the adhesive 16 covered on the back surface with the protective film 17 is applied and formed in advance on the insulating sheet 10, and the protective film 17 is peeled off when the insulating sheet 10 is mounted on the printed wiring board 1. The insulating sheet 10 is bonded to the upper surface of the mounted component mounted on the printed wiring board 1 via an adhesive 16.
[0011]
As illustrated in FIG. 4, a pin 40 is suspended from each end of the pad 22-1 of the insulating sheet 10, and one end of the wire 30 connecting one end to the pad 3 or the pattern of the printed wiring board 1 is connected to the other end. , Wound around the pins 40 and soldered to connect the insulating sheet 10 and the printed wiring board 1.
[0012]
As illustrated in FIG. 5, a pair of elastic leg members 45 are provided on the back surface of the insulating sheet 10. By sandwiching the leg member 45 in a package of the mounted component 2 mounted on the printed wiring board 1, the insulating sheet 10 is placed and fixed on the upper surface of the mounted component 2 mounted on the printed wiring board 1.
[0013]
As illustrated in FIGS. 6 to 9, an engaging plate 50 made of an insulating material that is overlapped and fixed on the surface of the insulating sheet 10, and the engaging plate 50 is vertically provided so as to protrude downward, and A plurality of fasteners 51 penetrating through the holes 18 and slits 51A formed at the lower portion of the respective fasteners 51 so as to be engaged with the leads 2A of the mounted components 2 mounted on the printed wiring board 1; A stopper plate 19 is provided on the rear surface of the insulating sheet 10 so as to be engaged with the side end surface of the mounted component 2 in a state where the fitting 51 is engaged with the lead 2A.
[0014]
Then, the attachment metal member 51 is attached to the lead 2 </ b> A, and the insulating sheet 10 is placed and fixed on the mounting component 2 mounted on the printed wiring board 1.
Alternatively, a pad 53 connected to the metal fitting 51 is formed on the surface of the engagement plate 50, and the pad 53 and the selected pad 22-1 on which leads or electrodes of the additional components 20-1 and 20-2 are solder-mounted. , And a connection through a wire 30.
[0015]
[Action]
Since the additional components are placed on the insulating sheet and the insulating sheet is placed and mounted on the mounted components mounted on the printed wiring board, even if the mounted components are densely mounted on the printed wiring board, Can be easily connected and mounted on a printed wiring board.
[0016]
Further, since pads are provided on the insulating sheet in accordance with the pad arrangement of electronic components to be actually additionally mounted, the dummy pads that are provided by prediction are arranged in the same manner as in the related art. Never different. Therefore, there is no need to discard the existing printed wiring board and newly manufacture a printed wiring board, so that the mounting cost of additional components is low.
[0017]
In the case where the ground layer is provided in the intermediate layer of the insulating sheet, transmission and reception of noise between the additional component and the mounted component mounted on the printed wiring board is reduced.
By providing the ventilation holes in the insulating sheet, the air that has cooled the printed wiring board rises and is discharged through these holes, so that the deterioration of the cooling performance of the printed wiring board due to the provision of the insulating sheet is reduced to some extent. You.
[0018]
By applying an adhesive covered with a protective film on the back of the insulation sheet in advance, the insulation sheet can be easily fixed to the mounted components mounted on the printed wiring board, and additional components can be mounted on the printed wiring board it can.
[0019]
By providing a pin at each end of the pad of the insulating sheet, and connecting the other end of the wire connecting one end to the pad or pattern of the printed wiring board by winding and soldering the pin, Connection work between the additional component and the printed wiring board is facilitated.
[0020]
By providing a pair of elastic legs on the back side of the insulating sheet to be mounted on the package of mounted components, the insulating sheet can be easily fixed on the mounted components mounted on the printed wiring board, and additional components can be mounted on the printed wiring board it can.
[0021]
By providing an engaging plate made of an insulating material that is overlaid and fixed on the surface of the insulating sheet, and a fastening metal member vertically attached to the engaging plate, the insulating sheet can be fixed on the mounted component mounted on the printed wiring board, and additional components can be attached. Can be mounted on printed wiring boards.
[0022]
By connecting via a wire the pad connected to the attachment metal and the selected pad to which the additional component lead or electrode is soldered, a predetermined pattern of the printed wiring board-the lead of the mounted component-the attachment A circuit consisting of a metal fitting, a pad of an engagement plate, a wire, and a lead of an additional component is formed, and the attachment metal has a function of a connection element of the additional component.
[0023]
【Example】
Hereinafter, the present invention will be specifically described with reference to the drawings. The same reference numerals indicate the same objects throughout the drawings.
[0024]
Figure 1 is a diagram of Example 1 of the present invention, (A) is a plan view, (B) is a side view, FIG. 2 is a diagram of Example 2 of the present invention, (A) is a plan view, (B) in view of a third embodiment of a side sectional view, FIG. 3 is the invention, (a) is a plan view, (B) is a side sectional view, FIG. 4 is a view of the fourth embodiment of the present invention, (a () Is a plan view, and (B) is a side sectional view.
[0025]
5A and 5B are diagrams of a fifth embodiment of the present invention . FIG. 5A is a side view before the combination, FIG. 5B is a side view after the combination, FIG. 6 is a plan view of the sixth embodiment of the present invention , and FIG. 6 is a side view as viewed from the direction of the arrow A shown in FIG. 6, FIG. 8 is a side view as viewed from the direction of the arrow B shown in FIG. 6, FIG. 9 is a view of the engagement plate, (A) is a plan view, and (B) is a side view.
[0026]
In FIG. 1, reference numeral 1 denotes a printed wiring board on which surface mount components 2 such as semiconductor components are mounted at high density. Each lead 2A of the mounted component 2 is connected by soldering to a pad 3 arranged on the surface of the printed wiring board 1.
[0027]
Reference numeral 20-1 denotes an additional component, such as a surface-mounted semiconductor component having leads 21-1 arranged on the side surface of the package, which is additionally mounted on the printed wiring board 1 in order to add functions and improve performance of the electronic device.
[0028]
Reference numeral 20-2 denotes an additional component such as a surface-mounted resistor or a capacitor provided with electrodes 21-2 on both end surfaces of the main body, which is additionally mounted on the printed wiring board 1 for adding functions and improving performance of the electronic device. is there.
[0029]
Reference numeral 10 denotes an insulating sheet such as a resin laminated substrate, a ceramic substrate, and a thick resin film.
The corresponding leads 21-1 of the additional component 20-1 are aligned and mounted on the pads 22-1 arranged and formed on the surface of the insulating sheet 10, and soldered to surface mount the additional component 20-1 on the insulating sheet 10. are doing. Further, the opposing electrode 21-2 of the additional component 20-2 is placed on the pad 22-2 formed facing the surface of the insulating sheet 10 in a position-aligned manner, and soldered to attach the additional component 20-2 to the insulating sheet. 10 is surface-mounted.
[0030]
An insulating sheet 10 is placed so as to bridge the mounted components 2 arranged and mounted on the printed wiring board 1, and the back surface of the insulating sheet 10 and the upper surface of the mounted component 2 are adhered to each other using an adhesive, thereby providing insulation. The sheet 10 is mounted on the printed wiring board 1.
[0031]
One end of a wire 30 such as a gold wire, an aluminum wire, or a copper wire is connected to the pads 22-1 and 22-2 of the insulating sheet 10 by thermocompression bonding or soldering, and the other end of the wire 30 is printed wiring board. The additional components 20-1 and 20-2 are connected to the circuit of the printed wiring board 1 by thermocompression bonding or soldering to the pads 3 or the pattern 1.
[0032]
As described above, the additional components are surface-mounted on the insulating sheet 10 and the insulating sheet 10 is fixed to the upper part of the mounting component 2, so that the additional components can be easily mounted on the printed wiring board 1 on which the mounting components are mounted at a high density. Can be implemented.
[0033]
The insulating sheet 10 shown in FIG. 2 has a ground pad 13 formed in one corner of the surface, a ground layer 11 provided in an intermediate layer, and the ground layer 11 and the ground pad 13 are connected via a via 12.
[0034]
The additional component 20-1 is surface-mounted on the insulating sheet 10, the back surface of the insulating sheet 10 is placed and fixed on the upper surface of the mounting component 2, and the pads 22-1 of the insulating sheet 10 and the printed wiring board 1 Connected to pad or pattern.
[0035]
The ground pad 13 is connected via a wire 30 to a lead corresponding pad for soldering a ground lead of the additional component 20-1.
Further, the ground pad 13 and the ground pattern of the printed wiring board 1 are connected via a wire 31 such as a copper wire having a large sectional area.
[0036]
As described above, the ground layer 11 is provided on the entire surface of the intermediate layer on the insulating sheet 10 to electromagnetically shield the space between the upper surface of the insulating sheet 10 and the printed wiring board 1. Therefore, the transfer of noise between the additional component 20-1 and the mounted component 2 mounted on the printed wiring board 1 is reduced.
[0037]
In the insulating sheet 10 illustrated in FIG. 3, pads 22-1 having a large rear portion and having a convex shape in plan view are opposed to each other in two rows, and elongated holes 15 for ventilation are provided between the pad rows.
By providing the holes 15 for ventilation in the insulating sheet 10 as described above, the air that has cooled the printed wiring board 1 rises through the holes 15 and is discharged, so the insulating sheet 10 is mounted on the printed wiring board 1. Thereby, the deterioration of the cooling performance of the printed wiring board is reduced to some extent.
[0038]
By using a pad having a convex shape in plan view, it is easy to connect two wires 30 to the same pad two-dimensionally and to connect them by soldering, and to increase the reliability of the connection.
[0039]
As shown in FIG. 3, an adhesive 16 is applied and formed on the back surface of the insulating sheet 10 in advance, and the adhesive 16 is covered with the protective film 17 before the insulating sheet 10 is mounted. When mounting the additional component 20-1 on the printed wiring board 1, the protective film 17 is peeled off to expose the adhesive 16, and the back surface of the insulating sheet 10 is placed on the upper surface of the mounted component 2 mounted on the printed wiring board 1. And the adhesive 16 is used.
[0040]
By doing as described above, the work of mounting and fixing the insulating sheet becomes simpler than the method of applying the adhesive just before mounting the insulating sheet on the printed wiring board.
In FIG. 4, reference numeral 40 denotes a metal pad such as a copper alloy which is press-fitted into a hole provided at each end of a rectangular pad 22-1 formed on the surface of the insulating sheet 10 and hangs down from the insulating sheet 10. It becomes a pin.
[0041]
Further, an insulating film 41 is attached to the back surface of the insulating sheet 10 to prevent the lower end of the pin 40 from electrically contacting the upper surface of the mounted component 2 mounted on the printed wiring board 1 and to prevent the mounting component 2 Are not damaged.
[0042]
The other end of the wire 30 having one end connected to a pad or pattern of the printed wiring board is wound around a pin 40 protruding from the surface of the insulating sheet 10 and further soldered.
[0043]
By providing the pins 40 as described above, the connection operation of the wires 30 is facilitated, and the reliability of the connection is improved.
In FIG. 5, reference numeral 45 denotes an inverted-L-shaped leg member made of an elastic metal material. Each of the pair of leg members 45 has a horizontal plate portion in close contact with the back surface of the insulating sheet 10 and is fixed to the insulating sheet 10 so as to face the insulating sheet 10 with screws or the like.
[0044]
Note that the vertical plate portion of the leg member 45 is curved so as to protrude outward so as to easily hold the package of the mounted component 2.
As shown in FIG. 5A, the leg member 45 described above is attached to the insulating sheet 10 having the additional component 20-1 mounted on the surface thereof.
[0045]
Then, when the leg member 45 is positioned above the package of the mounted component 2 mounted on the printed wiring board 1 and the insulating sheet 10 is pressed down, the vertical members of the pair of leg members 45 are opened outward, and the leg is opened. The insulating sheet 10 descends while the inner side surface near the lower end portion slides on the side surface of the package.
[0046]
Then, when the back surface of the insulating sheet 10 comes into contact with the upper surface of the mounting component 2, the leg member 45 returns and closes as shown in FIG.
[0047]
Therefore, the insulating sheet 10 can be easily fixed on the mounting component 2 mounted on the printed wiring board 1, and the additional component 20-1 can be mounted on the printed wiring board 1.
6 to 9, reference numeral 50 denotes an engagement plate made of an insulating material on an elongated rectangular plate that is overlapped and fixed on the surface of the insulating sheet 10.
[0048]
Reference numeral 51 denotes a strip-shaped attachment fitting made of a copper-based alloy or the like, which is suspended from the engagement plate 50 so as to protrude downward.
Attachment fittings 51 are arranged in a horizontal line on engagement plate 50 at a pitch which is a multiple of the pitch of leads 2A arranged on the side surface of the package of mounting component 2 mounted on printed wiring board 1.
[0049]
A pad 53 is provided on the surface of the engagement plate 50 so as to be connected to the upper part of the attachment metal member 51.
As shown in detail in FIG. 9, a slit 51A having one side open is provided at a lower portion of the attachment metal member 51. The slit 51A is inserted and fitted into the horizontal portion of the lead 2A of the mounting component 2.
[0050]
A hole 52 for inserting the neck of the screw 61 is provided at one end of the engagement plate 50.
On the other hand, the insulating sheet 10 is provided with the long hole 18 through which the attachment metal member 51 penetrates when the engaging plate 50 is laid. Further, a stopper plate 19 that is engaged with a side end surface of the mounted component 2 when the attachment fitting 51 is engaged with the lead 2 </ b> A of the mounted component 2 is attached to the back surface of the insulating sheet 10.
[0051]
Reference numeral 60 denotes a U-shaped holder fitting for fixing the engaging plate 50 to the insulating sheet 10 in a state where the engaging plate 50 is placed on the insulating sheet 10.
The opening width of the holder fitting 60 (the distance between the upper plate portion and the lower plate portion) is slightly larger than (the plate thickness of the insulating sheet 10 + the plate thickness of the engagement plate 50).
[0052]
The upper plate portion of the holder fitting 60 has a screw hole into which the neck of the screw 61 is inserted, and has a small thickness so as to be flexible. The lower plate portion of the holder fitting 60 is thick and rigid, and a screw hole into which the screw portion of the screw 61 is screwed is provided at a position facing the screw hole of the upper plate portion.
[0053]
The following procedure is used to mount the additional component 20-1 using the element configured as described above on the printed wiring board 1.
The insulating sheet 10 is placed so as to crosslink on the upper surfaces of the two mounted components 2 mounted on the printed wiring board 1, and the side surface of the stopper plate 19 contacts the side end surface of the package of one of the mounted components 2.
[0054]
The metal fitting 51 is inserted into the long hole 18 of the insulating sheet 10, and the engaging plate 50 is overlaid on the upper surface of the insulating sheet 10.
Then, the engaging plate 50 is displaced in the direction of the stopper plate 19, and the slits 51A of the respective fastening members 51 are fitted into the corresponding leads 2A of the mounting component 2, and the fastening members 51 are engaged with the leads 2A.
[0055]
The opening of the holder 60 is inserted from the lateral direction of the insulating sheet 10 so as to sandwich the stacked insulating sheet 10 and the engaging plate 50. A screw 61 is inserted into the screw hole of the lower plate portion of the holder fitting 60 so as to pass through the screw hole of the upper plate portion of the holder fitting 60, the hole 52 of the engagement plate 50, and the long hole 18 of the insulating sheet 10. Then, the upper plate portion is bent, and the upper plate portion, the engagement plate 50 and the insulating sheet 10 are tightened to fix the engagement plate 50 to the insulating sheet 10.
[0056]
On the other hand, since the stopper plate 19 is in contact with the side end surface of the package of the mounted component 2, the insulating sheet 10, that is, the engaging plate 50 moves in a direction in which the slit 51 </ b> A of the fastening member 51 is separated from the lead 2 </ b> A of the mounted component 2. Is prevented.
[0057]
One end of a wire 32 such as a gold wire, an aluminum wire, or a copper wire is connected to a pad 53 provided on a surface of an engagement plate 50 connected to a metal fitting 51 by soldering or the like. The other end of the wire 32 is connected to a selected pad 22-1 provided on the surface of the insulating sheet 10 to which the lead 21-1 of the additional component 20-1 is connected by soldering or the like.
[0058]
The other pads 22-1 of the mounted component 2 are connected to the pads 3 or the pattern of the printed wiring board 1 via the wires 30.
With the above-described configuration, a circuit is formed with a predetermined pattern of the printed wiring board 1, a lead 2A of the mounted component 2, an attachment metal 51, a pad of the engaging plate 50, a wire 32, and a lead 2A of the mounted component 2. Then, the attachment metal member 51 can be used as both a fixing means of the insulating sheet 10 and an electric circuit element.
[0059]
【The invention's effect】
The present invention is configured as described above, and has the following effects.
[0060]
Since the additional components are placed on the insulating sheet and the insulating sheet is placed and mounted on the mounted components mounted on the printed wiring board, even if the mounted components are densely mounted on the printed wiring board, Can be easily connected and mounted on a printed wiring board.
[0061]
Further, since pads are provided on the insulating sheet in accordance with the pad arrangement of electronic components to be actually additionally mounted, the dummy pads that are provided by prediction are arranged in the same manner as in the related art. Never different. Therefore, there is no need to discard the existing printed wiring board and newly manufacture a printed wiring board, so that the mounting cost of additional components is low.
[0062]
In the case where the ground layer is provided in the intermediate layer of the insulating sheet, transmission and reception of noise between the additional component and the mounted component mounted on the printed wiring board is reduced.
By providing the ventilation holes in the insulating sheet, the deterioration of the cooling performance of the printed wiring board due to the provision of the insulating sheet is reduced to some extent.
[0063]
By applying in advance an adhesive covered with a protective film on the back surface of the insulating sheet, additional components can be easily mounted on the printed wiring board.
When the pins are suspended from the respective ends of the pads of the insulating sheet, the connection work between the additional component and the printed wiring board is facilitated, and the reliability of the connection is improved.
[0064]
With a pair of elastic leg members on the back side of the insulating sheet to be sandwiched in the package of mounted components, the insulating sheet can be easily fixed on the mounted component mounted on the printed wiring board, and additional components can be printed wiring board Easy to implement.
[0065]
For the configuration in which the engaging plate is overlapped and fixed on the surface of the insulating sheet and the metal fitting is engaged with the lead of the mounted component, select a mounted component on which the printed wiring board on which electronic components are mounted at high density is easy to mount. Additional components can be mounted above it.
[0066]
In addition, the attachment fitting has a function of fixing the insulating sheet and a function of a connection element of an additional component.
[Brief description of the drawings]
[1] In the figure the first embodiment of the present invention, (A) is a plan view, (B) is a side view.
In view of a second embodiment of the present invention; FIG, (A) is a plan view, (B) is a side sectional view.
In view of a third embodiment of the invention, FIG, (A) is a plan view, (B) is a side sectional view.
FIGS. 4A and 4B are diagrams of a fourth embodiment of the present invention, wherein FIG. 4A is a plan view and FIG.
5A and 5B are diagrams of a fifth embodiment of the present invention, wherein FIG. 5A is a side view before combination and FIG. 5B is a side view after combination.
FIG. 6 is a plan view of a sixth embodiment of the present invention .
FIG. 7 is a side view as viewed in the direction of arrow A shown in FIG. 6;
FIG. 8 is a side view as viewed in the direction of arrow B shown in FIG. 6;
9A and 9B are views of an engagement plate, in which FIG. 9A is a plan view and FIG. 9B is a side view.
[Explanation of symbols]
1 printed wiring board 2 mounted parts
2A lead 3,22-1,22-2,53 pad
10 Insulation sheet
11 Ground layer
12 Via
13 Ground pad
16 adhesive
17 Protective film
18 Slot
19 Stopper plate
20-1, 20-2 additional parts
21-1 Lead
21-2 electrode
30, 31 wires
40 pin
43 Leg material
50 Engagement plate
51 Moment fitting
51A slit
60 Holder bracket

Claims (2)

表面に形成したパッドにリード或いは電極をはんだ付けして追加部品を表面実装する絶縁シートの表面に、重置固着される絶縁材よりなる係合板と、
下方に突出するよう該係合板に垂設され、該絶縁シートの長孔を遊貫し、印刷配線板に搭載した実装部品のリードに係着するスリットが下部に形成される係着金具と、
該係着金具が該リードに係着した状態で、該実装部品の側端面に係止するよう該絶縁シートの裏面に突設したストッパ板とを備え、
該係着金具が該リードに係着して、該印刷配線板に搭載した実装部品上に該絶縁シートが載置固着されたことを特徴とする印刷配線板の追加部品実装構造。 An engaging plate made of an insulating material that is overlapped and fixed on the surface of an insulating sheet on which additional components are surface-mounted by soldering leads or electrodes to pads formed on the surface,
A metal fitting which is vertically provided on the engagement plate so as to project downward, penetrates a long hole of the insulating sheet, and has a slit formed at a lower portion to be engaged with a lead of a mounted component mounted on the printed wiring board;
A stopper plate protruding from a rear surface of the insulating sheet so as to be engaged with a side end surface of the mounted component in a state where the metal fitting is engaged with the lead;
An additional component mounting structure for a printed wiring board , wherein the fastening metal fitting is engaged with the lead, and the insulating sheet is mounted and fixed on a mounted component mounted on the printed wiring board. 前記係合板の表面に前記係着金具に繋がるパッドが形成され、該パッドと追加部品を表面実装する該絶縁シートの表面形成された選択したパッドとが、ワイヤを介して接続されてなることを特徴とする請求項１記載の印刷配線板の追加部品実装構造。 A pad is formed on the surface of the engagement plate, the pad being connected to the attachment fitting, and the pad and a selected pad formed on the surface of the insulating sheet for surface mounting the additional component are connected via a wire. The additional component mounting structure for a printed wiring board according to claim 1, wherein:
JP04812095A 1995-03-08 1995-03-08 Additional component mounting structure for printed wiring boards Expired - Fee Related JP3593734B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04812095A JP3593734B2 (en) 1995-03-08 1995-03-08 Additional component mounting structure for printed wiring boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04812095A JP3593734B2 (en) 1995-03-08 1995-03-08 Additional component mounting structure for printed wiring boards

Publications (2)

Publication Number Publication Date
JPH08250836A JPH08250836A (en) 1996-09-27
JP3593734B2 true JP3593734B2 (en) 2004-11-24

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Application Number Title Priority Date Filing Date
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Publication number Priority date Publication date Assignee Title
JP4951651B2 (en) 2009-05-26 2012-06-13 パナソニック株式会社 Connector set and joiner used therefor
JP6891819B2 (en) * 2018-01-09 2021-06-18 株式会社Ｓｏｋｅｎ Inspection equipment

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5575248A (en) * 1978-12-01 1980-06-06 Hitachi Ltd Method of repairing integrated circuit device and repairing insulating substrate
JPS5994487A (en) * 1982-11-19 1984-05-31 松下電器産業株式会社 Method of connecting between front and back of flexible both-side circuit board
JPS6194376U (en) * 1984-11-26 1986-06-18
JPS6336592A (en) * 1986-07-30 1988-02-17 富士通株式会社 High density parts mounting structure
JPS6329972U (en) * 1986-08-11 1988-02-27
JPH01104065U (en) * 1987-12-25 1989-07-13
JPH0213764U (en) * 1988-07-11 1990-01-29
JPH03423U (en) * 1989-02-21 1991-01-07
JPH0747902Y2 (en) * 1989-03-30 1995-11-01 ローム株式会社 Mounting device for mounting chip type electronic components
JPH03284898A (en) * 1990-03-30 1991-12-16 Matsushita Electron Corp Mounting device for semiconductor device
JPH0426566U (en) * 1990-06-27 1992-03-03
JPH0430761U (en) * 1990-07-03 1992-03-12
JPH06104031A (en) * 1992-09-17 1994-04-15 Fujitsu Ltd Terminal for adjustment parts
JPH06244525A (en) * 1993-02-17 1994-09-02 Cmk Corp Manufacture of printed-wiring board
JPH06252612A (en) * 1993-02-24 1994-09-09 Kyocera Corp Printed circuit board incorporating strip line

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