JPH0610678Y2 - 基板の乾式洗浄装置 - Google Patents
基板の乾式洗浄装置Info
- Publication number
- JPH0610678Y2 JPH0610678Y2 JP1987181668U JP18166887U JPH0610678Y2 JP H0610678 Y2 JPH0610678 Y2 JP H0610678Y2 JP 1987181668 U JP1987181668 U JP 1987181668U JP 18166887 U JP18166887 U JP 18166887U JP H0610678 Y2 JPH0610678 Y2 JP H0610678Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- spin chuck
- ozone
- lifter
- processing chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 139
- 238000005108 dry cleaning Methods 0.000 title claims description 17
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 78
- 238000012545 processing Methods 0.000 claims description 32
- 239000000126 substance Substances 0.000 claims description 29
- 239000010453 quartz Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 238000012546 transfer Methods 0.000 claims description 6
- 238000000354 decomposition reaction Methods 0.000 description 12
- 239000011261 inert gas Substances 0.000 description 12
- 238000004140 cleaning Methods 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000005416 organic matter Substances 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cleaning In General (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987181668U JPH0610678Y2 (ja) | 1987-11-28 | 1987-11-28 | 基板の乾式洗浄装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987181668U JPH0610678Y2 (ja) | 1987-11-28 | 1987-11-28 | 基板の乾式洗浄装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0186233U JPH0186233U (enrdf_load_html_response) | 1989-06-07 |
| JPH0610678Y2 true JPH0610678Y2 (ja) | 1994-03-16 |
Family
ID=31473146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987181668U Expired - Lifetime JPH0610678Y2 (ja) | 1987-11-28 | 1987-11-28 | 基板の乾式洗浄装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0610678Y2 (enrdf_load_html_response) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61194830A (ja) * | 1985-02-25 | 1986-08-29 | Dainippon Screen Mfg Co Ltd | 基板の有機物除去装置 |
-
1987
- 1987-11-28 JP JP1987181668U patent/JPH0610678Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0186233U (enrdf_load_html_response) | 1989-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100812482B1 (ko) | 매엽식 기판세정방법 및 매엽식 기판세정장치 | |
| TWI539548B (zh) | 液體處理裝置及液體處理方法 | |
| KR100827796B1 (ko) | 기판처리장치 | |
| US4924890A (en) | Method and apparatus for cleaning semiconductor wafers | |
| US5998766A (en) | Apparatus and method for cleaning substrate surface by use of Ozone | |
| TWI751432B (zh) | 基板處理裝置及基板處理方法 | |
| KR20020091746A (ko) | 매엽식 기판세정방법 및 매엽식 기판세정장치 | |
| TW202328828A (zh) | 基板處理方法及基板處理裝置 | |
| JP2010245575A (ja) | スピン処理装置及びスピン処理方法 | |
| JPH0610678Y2 (ja) | 基板の乾式洗浄装置 | |
| JP3958993B2 (ja) | 液処理装置および液処理方法 | |
| JP3894141B2 (ja) | 塗布装置 | |
| JPH02315A (ja) | 基板のレジスト除去洗浄方法 | |
| JP2002299213A (ja) | 基板処理装置 | |
| KR102847044B1 (ko) | 기판처리장치 | |
| JPH0656833B2 (ja) | 基板のレジスト除去洗浄方法及びその装置 | |
| JP2628070B2 (ja) | アッシング装置 | |
| JP2003257925A (ja) | スピン処理装置及びスピン処理方法 | |
| JP2572568B2 (ja) | アッシング方法 | |
| JP3033008B2 (ja) | 処理方法及び処理装置 | |
| JPH0777212B2 (ja) | 基板のレジスト除去洗浄方法 | |
| JP3027686B2 (ja) | 紫外線照射装置 | |
| JP2003047842A (ja) | 紫外線照射装置と照射方法 | |
| JP4048189B2 (ja) | 基板処理装置 | |
| JP3901777B2 (ja) | 基板洗浄装置のゲート装置 |