JPH0610678Y2 - Substrate dry cleaning equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> The present invention is designed to horizontally hold a semiconductor wafer, a glass substrate, a ceramic substrate, etc. (collectively referred to as “substrate” in this specification) by suction. The present invention relates to a dry cleaning apparatus for a substrate, which includes a rotating spin chuck and an ultraviolet irradiation lamp arranged above the spin chuck, and decomposes and removes organic substances adhering to the surface of the substrate by ultraviolet irradiation.

<Prior Art> As a conventional dry cleaning apparatus for substrates, for example, Japanese Patent Laid-Open No. 61-
As described in Japanese Patent No. 224320, while rotating the spin chuck and oscillating in the vertical direction (heating the substrate as necessary), the substrate surface is irradiated with ultraviolet rays,
There is a dry cleaning device that removes adhering organic substances.

In this dry cleaning device, the molecular bonds of adhering organic substances are dissociated by the irradiated ultraviolet rays, and oxygen in the irradiation path is secondarily converted to ozone by the ultraviolet rays, and the dissociated molecules are oxidized by the ozone to generate CO ₂ , H ₂ O, etc. to separate from the substrate.

Since the substrate is irradiated with ultraviolet rays while rotating, it is possible to uniformly irradiate the entire surface of the attached organic substance. Further, since the substrate is rocked in the vertical direction, C generated by contact with ozone is generated.
It is possible to prevent O ₂ , H ₂ O, etc. from stagnation on the surface of the attached organic substance, and to keep the surface of the attached organic substance in contact with fresh ozone at all times.

<Problems to be solved by the invention> However, the mechanism for swinging the spin chuck in the vertical direction at the same time as the rotation is inevitably complicated, and in addition, ozone is irradiated by ultraviolet rays to cause a secondary problem. However, the ozone amount tends to be insufficient because it is generated, and there is a problem that the rate of decomposition and removal of attached organic matter is slow.

An object of the present invention is to simplify the structure while increasing the decomposition / removal speed of the organic substances attached to the substrate, and at the same time, to facilitate the automatic transfer of the substrate.

<Means for Solving Problems> The present invention has the following configuration in order to achieve such an object.

That is, the substrate dry cleaning apparatus of the present invention comprises a spin chuck that holds a substrate by suction and horizontally rotates, and an ultraviolet irradiation lamp disposed above the spin chuck to remove organic substances adhering to the substrate surface. A dry cleaning apparatus for a substrate, which is decomposed and removed by irradiation of ultraviolet rays, comprising: a heater built in the spin chuck, a through hole provided in the spin chuck to project upward to project above a top surface thereof, and a spin chuck to descend. A lifter that passes through a through-hole provided in the bottom of the spin chuck and retreats below the bottom surface of the spin chuck to attach and detach the substrate to and from the spin chuck; a processing chamber that houses the spin chuck and the lifter; It moves back and forth in a horizontal direction between the lifted position of the lifter and the outside of the processing chamber to transfer the substrate to and from the lifter. A substrate loading / unloading mechanism, a lid body that incorporates the ultraviolet irradiation lamp, that moves upwards above the spin chuck upper surface and that lowers to close the upper opening of the processing chamber; It is characterized by comprising an ozone inlet for supplying ozone to the substrate and an ozone generator connected to the ozone inlet.

<Operation> The operation of the configuration of the present invention is as follows.

The substrate carried in by a substrate carry-in mechanism that moves the substrate from the outside in the horizontal direction is received by a lifter projecting above the upper surface thereof through a through hole provided in the spin chuck. The substrate is transferred onto the upper surface of the spin chuck by lowering the lifter.

The processing chamber accommodating the spin chuck and the lifter is closed by the descending lid, and while the spin chuck is rotating, the ozone generated by the ozone generator is introduced into the processing chamber through the ozone inlet, and the spin chuck is turned on. By irradiating the surface of the substrate, which is adsorbed and held by the heater in the spin chuck and heated by the heater, with ultraviolet rays from an ultraviolet ray irradiation lamp and by supplying ozone, organic substances adhering to the substrate are decomposed and removed.

In the process of disassembling and removing the lifter, the lifter is retracted below the lower surface of the spin chuck so that the lifter does not hinder the rotation of the spin chuck.

When the disassembly and removal is completed, the substrate on the spin chuck is transferred to the lifter by protruding the lifter through the through hole provided in the spin chuck and above the upper surface thereof, and in that state, the substrate is unloaded by the substrate unloading mechanism. To the outside.

In this case, the ozone is not generated secondarily by the irradiation of ultraviolet rays, but is supplied to the surface of the substrate in the form of ozone from the beginning at the same time as the irradiation of ultraviolet rays, so that the contact frequency of ozone with the organic substances adhering to the substrate is high. Will be things. On the other hand, since ultraviolet rays are emitted while rotating the substrate, uniform irradiation is possible, and the substrate is also heated by the heater.

Therefore, the rate of decomposition and removal of organic substances is sufficiently high as a whole.

Further, the operation of the spin chuck in the process of decomposing and removing the organic matter is only rotation, and is not vertically rocked at the same time as the rotation as in the conventional example, so that the drive mechanism of the spin chuck becomes simple.

In addition, the structure is simplified in that the lifter serves both to attach and detach the substrate to and from the spin chuck and to deliver the substrate to and from an external substrate loading / unloading mechanism. It facilitates automatic transportation.

<Example> Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is an overall schematic configuration diagram of a substrate dry cleaning apparatus, FIG. 2 is an enlarged cross-sectional view of essential parts, and FIG. 3 is III in FIG.
-Plan view in the direction of arrow III, FIG. 4 is IV-IV in FIG.
It is sectional drawing of a line arrow.

First, the overall structure will be described mainly based on FIG.

A spin chuck 2 and a lifter 3 are provided inside a processing chamber 1 including a peripheral wall portion 1a and a bottom plate portion 1b. The rotation axis 4 of the spin chuck 2 extends in the vertical direction,
Is rotatably supported by a bearing portion 5 fixed to the bottom plate portion 1b.

A transmission belt 9 is stretched between a pulley 6 fixed to a rotating shaft 4 and a pulley 8 fixed to an output shaft of a motor 7, and the spin chuck 2 is horizontally rotated by driving the motor 7. Has been done. Specific structures of the spin chuck 2 and the bearing portion 5 will be described later.

A plurality of lifter rods 3a (six in this embodiment: see FIG. 4) are provided upright on a lift plate 10 which is vertically fitted onto a bearing portion 5 so as to be vertically movable. It constitutes the lifter 3 of A. The lifting mechanism of the lifter 3 will be described later.

Packing on the outer periphery of the upper end of the peripheral wall portion 1a forming the processing chamber 1.
The holder 12 of 11 is fixed. A lid 13 is disposed above the spin chuck 2 so as to be vertically movable and close to the packing 11 by being lowered to close the upper opening 1c of the processing chamber 1.

The processing chamber 1, the lid 13 and the space above the lid 13 form a peripheral wall portion 14.
a, a bottom plate portion 14b, and a conical top plate portion 14c. A window 14d made of a transparent material is attached to the top plate portion 14c so that the inside of the housing 14 can be observed from the outside. Bottom plate portion 1b of the processing chamber 1
Is fitted into the bottom plate portion 14b of the housing 14 and is airtightly connected.

The upper ends of the piston rods 15a of a plurality of lid raising / lowering air cylinders 15 attached to the lower surface of the bottom plate portion 14b of the housing 14 are connected to the lid 13, and the lid 13 moves up and down as the air cylinder 15 expands and contracts. Is configured. First
In the figure, the lid 13 is raised and the upper opening 1c of the processing chamber 1 is opened.

The lid 13 is composed of a top plate 13a, a transparent plate 13b, and two quartz thin plates 13d and 13e that face each other vertically and form a channel 13c. A large number of ozone introduction holes 13f communicating with the flow path 13c are formed in a uniformly distributed state.

An ozone inlet 16 is formed at one end of the flow path 13c, and an inert gas inlet 17 for purging is formed at the other end. On the lower surface of the lid body 13, there is attached a closing cylinder body 18 that is pressed against the packing 11 to seal the processing chamber 1 when the lid body 13 descends.

An ultraviolet irradiation lamp 19 is arranged in a space between the transparent plate 13b and the upper quartz thin plate 13d, and a lamp cooling means (water cooling type) not shown is provided in this space.

In order to increase the efficiency of decomposing and removing organic substances, it is preferable to make the distance between the substrate A on the spin chuck 2 and the ultraviolet irradiation lamp 19 as short as possible, and the height of the closing cylinder 18 is determined so as to do so. .

A surface treatment end point detecting means 20 for detecting completion of decomposition and removal of organic substances from the substrate A is attached to the top plate 13a of the lid 13.

The surface treatment end point detecting means 20 irradiates the substrate A with light,
The state of decomposition and removal of the organic substance is detected by the interference (phase shift) between the reflected light from the surface of the organic material and the reflected light from the surface of the substrate A, and the completion of decomposition and removal is detected when the interference is eliminated.

At a position corresponding to the height position of the spin chuck 2,
A substrate carry-in port 21a and a substrate carry-out port 21b are formed on the peripheral wall 14a of the housing 14 so as to face each other in the diametrical direction, and shutters 22a, 22b with racks for opening and closing the carry-in port 20a and the carry-out port 21b by vertical sliding. , The pinion gears 23a, 23b meshing with the racks of the shutters 22a, 22b, and the pinion gears 23
A motor (not shown) for driving a and 23b is provided. The racks of the shutters 22a and 22b are also attached to the pinion gear 23.
The tooth portions of a and 23b are also not shown.

Outside the peripheral wall portion 14a of the housing 14, the substrate loading port
A substrate loading mechanism 24a for loading the substrate A into the housing 14 through the 21a and a substrate unloading mechanism 24b for loading the substrate A out of the housing 14 through the substrate unloading port 21b are provided.

The substrate loading mechanism 24a and the substrate unloading mechanism 24b have the same structure and are disclosed, for example, in Japanese Utility Model Laid-Open No. 176548/1985, and as shown in FIG. The first arm 26 attached to the rotary shaft of the
The second arm 27 rotatably attached to the free end of the arm 26 and the second arm 27 by transmitting the rotational movement of the first arm 26.
It is composed of a transmission mechanism 28 for rotating 27, a vacuum chuck port 29 and the like formed on the free end of the second arm 27 for sucking and holding the placed substrate A.

30 is an oxygen cylinder, 31 is a valve, 32 is a flow meter, 33 is a filter, 34 is a valve, 35 is an ozone generator, and an ozone generator 35
The tip of the ozone introducing pipe 36 led out from the above faces the upper and lower quartz thin plates 13d and 13e, and forms the ozone introducing port 16 described above.

The arrangement order of the respective devices for supplying ozone to the ozone inlet port 16 may be changed, for example, by disposing the flow meter 32 on the ozone outlet side of the ozone generator 35.
The arrangement order shown in the figure is not limited.

37 is a cylinder of an inert gas such as nitrogen, 38 is a valve, 39 is an inert gas introducing pipe, and the tip of the inert gas introducing pipe 39 faces between the upper and lower quartz thin plates 13d and 13e. The gas inlet 17 is formed.

An ozone exhaust chamber 40 is formed between the peripheral wall portion 1a of the processing chamber 1 and the peripheral wall portion 14a of the housing 14, and an exhaust duct 41 communicating with the exhaust chamber 40 is led out of the housing 14 to a blower (not shown). It is connected.

Further, a perforated plate 42 is provided in the lower part of the processing chamber 1, and CO ₂ and H ₂ generated when the organic substances are decomposed and removed from the space between the perforated plate 42 and the bottom plate portion 1b of the processing chamber 1. An exhaust duct 43 for discharging a gas such as O is led out of the processing chamber 1 and is connected to the blower (not shown) via an exhaust valve 44. The housing 14 is a base via a plurality of columns 45.
The above-mentioned motor 7 which is supported by 46 and rotates the spin chuck 2 is attached to this base 46. The piston rod 47a of the lifter lifting air cylinder 47 provided upright on the base 46 penetrates the guide tube 48 fixed through the bottom plate portion 1b of the processing chamber 1, and the upper end thereof is fixed to the lifting plate 10 described above. There is. The piston rod 47a penetrates the perforated plate 42.

The plurality of lifter rods 3a constituting the lifter 3 penetrates the spin chuck 2 and moves up and down, and ascends to project above the upper surface of the spin chuck 2, while descends below the bottom surface of the spin chuck 2. Is configured to.

The following mechanism is provided for aligning the lifter rod 3a and the penetrating portion of the spin chuck 2.

That is, a disc 49 is attached to the lower end of the rotary shaft 4 of the spin chuck 2.
As shown in FIG. 6, a recess 49a is formed at one position on the periphery of the disk 49, and a lock pin 51 that engages with the recess 49a is provided at the tip of the piston rod 52a. The cylinder 52 is attached to the base 46.

An optical rotation angle sensor (not shown) is provided for stopping the motor 7 when the recess 49a reaches a position just opposite to the lock pin 51.

Next, based on FIGS. 2 and 3, the spin chuck 2 will be described.
The specific structure of will be described.

In the spin chuck 2, an upper plate 2a and a lower plate 2b sandwiching a heater 53 in a sandwich shape are clamped and fixed by a plurality of bolts 54 on the circumference near the periphery of the upper plate 2a and the lower plate 2b.
A plurality of (six) through holes 2c for penetrating the lifter rods 3a of the lifter 3 are formed.

A vacuum suction path 2d is formed in a cross shape on the upper plate 2a, and a plurality of vacuum suction paths 2d for adsorbing and holding the substrate A in a state of penetrating from the vacuum suction path 2d to the surface of the upper plate 2a (four for every 90 degrees in the circumferential direction and the center) are provided. Substrate adsorbing holes 2e of a total of 5) are formed,
The vacuum suction passage 2f formed in the lower plate 2b and the vacuum suction passage 2d in the upper plate 2a are airtightly connected to each other via a vertical communication passage 2g.

In 2h and 2i, the vacuum suction paths 2d and 2f are the upper plate 2a and the lower plate 2.
It is a plug for airtightly closing a portion of the peripheral end face of b.

In the vicinity of the center of the spin chuck 2, a temperature sensor 55 such as a thermocouple is embedded in the upper plate 2a, and its lead wire 55a and the lead wire 53a of the heater 53 penetrate the lower plate 2b and are led out downward.

The upper end of the connecting cylinder 56, which is externally fitted and fixed to the upper end of the cylindrical rotary shaft 4, is brought into contact with the lower plate 2b of the spin chuck 2, and the spin chuck 2 is attached by a plurality of bolts 57 penetrating the upper plate 2a and the lower plate 2b. And the connecting tube 56 are fixed.

The connecting cylinder 56 is formed with a vacuum suction passage 56a communicating with the vacuum suction passage 2f of the lower plate 2b. 56b is a stopper. Also,
An outer cylinder 58 for forming the vacuum suction passage 4a communicating with the vacuum suction passage 56a is fixed to the outer side of the rotary shaft 4.

The lead wires 53a and 55a pass through the inside of the connecting cylinder 56 and are wired inside the rotary shaft 4. The spin chuck 2 is exchanged according to the size of the substrate A, and the spin chuck 2 is detachably attached to the connecting cylinder 56 by operating a bolt 57.

Along with this, the lead wires 53a and 55a led out from the spin chuck 2 also need to be connectable and separable with respect to the lead wire 59 extending through the rotary shaft 4.
And the lead wire 59 are connected by a connector 60.

Further, it is necessary to adjust the position of the lifter rod 3a of the lifter 3 as the spin chuck 2 is replaced. Therefore, the screw rod 3a at the lower end of the lifter rod 3a is inserted through the hole 10a of the elevating plate 10 and is fixed by the nut 61, so that the lifter rod 3a can be attached and detached.

As shown in FIG. 4, in the elevating plate 10, in addition to the hole 10a formed on the circumference of a large diameter, a hole 10b is formed on the inside of the inside of the hole 10b, and the inside of the hole 10b is further formed. A hole 10c is formed on a small circumference. These holes 10
The a, 10b, and 10c are arranged in a line toward the center, and six such hole lines are equally arranged.

When replacing the spin chuck 2 according to the size of the substrate A, the nut 61 is removed and the mounting positions (holes 10a, 10b, 10c) of the lifter rods 3a are changed. In addition, 10d is a hole for reducing the weight of the elevating plate 10.

Next, the structure of the bearing portion 5 will be described with reference to FIGS. 2 and 4.

The bearing portion 5 includes a tubular body 62 whose flange portion 62a is fixed to the bottom plate portion 1b of the processing chamber 1 by a bolt 63, a lid portion 65 which is fitted inside the tubular body 62 and fixed by a bolt 64, It is composed of bearings 66, 67, etc., which are mounted on the upper and lower portions of the tubular body 62 and support the rotating shaft 4.

The lid 65 has a vacuum suction path 4a between the rotary shaft 4 and the outer cylinder 58.
A vacuum suction path 65a communicating with the vacuum suction path 65a is formed.
65a is connected to a vacuum pump (not shown) via a path (not shown).

Next, the operation of the substrate dry cleaning apparatus of this embodiment will be described step by step.

In the initial state, the positioning air cylinder 52 has already been
Are extended and the lock pin 51 is engaged with the recess 49a of the disc 49, and the rotation of the rotary shaft 4 and the spin chuck 2 is restricted. In this state, each lifter rod 3a is aligned with each through hole 2c of the spin chuck 2.

In the initial state, the heater 53 is energized via the lead wires 59 and 53a to heat the spin chuck 2. The heating temperature is maintained at a predetermined temperature based on the temperature detection by the temperature sensor 55. The temperature is usually 200 ° C or higher and 300 ° C or lower.

The pinion gear 23a is driven to lower the shutter 22a and open the substrate loading port 21a. The other substrate outlet 21b is a shutter
It is blocked by 22b.

The lid raising / lowering air cylinder 15 is extended to raise the lid 13 to secure a space between the lower surface of the lid 13 and the upper surface of the spin chuck 2 to which the second arm 27 of the substrate loading mechanism 24a can enter. .

The substrate A is placed on the second arm 27 of the substrate loading mechanism 24a, and the substrate A is held by vacuum suction from the vacuum chuck port 29. By driving the motor 25, the first arm
26, the second arm 27 is displaced to move the substrate A on the second arm 27.
When the substrate A is loaded into the housing 14 from the substrate loading port 21a and the substrate A comes directly above the spin chuck 2, the motor 25
To stop.

When the lifter elevating air cylinder 47 is extended, the plurality of lifter rods 3a constituting the lifter 3 pass through the through holes 2c of the spin chuck 2 and the upper end portions thereof project above the upper surface of the spin chuck 2 to carry in the substrate. The height position of the second arm 27 of the mechanism 24a is reached. At this timing, the vacuum suction from the vacuum chuck port 29 is released.

The lifter rod 3a continues to rise and receives the substrate A on the second arm 27 at the upper ends of the plurality of lifter rods 3a.

The motor 25 is driven in the reverse direction to move the second arm 27 to the substrate loading port.
Then, the pinion gear 23a is reversely driven to raise the shutter 22a and close the substrate loading opening 21a.

The lifter lifting air cylinder 47 is contracted to retract the lifter rod 3a of the lifter 3 until its upper end is below the lower surface of the spin chuck 2. This is so as not to hinder the rotation of the spin chuck 2 in the subsequent process.

When the upper end of the lifter rod 3a passes the upper surface position of the spin chuck 2, the substrate A on the lifter rod 3a is transferred to the upper surface of the spin chuck 2.

Since the spin chuck 2 has already been heated to a predetermined temperature by the heater 53, the substrate A starts to be heated immediately after being transferred onto the upper surface of the spin chuck 2. As a result, the substrate A
The organic substance-containing resist film applied to the surface of the film begins to thermally decompose. The thermal decomposition of the resist film promotes decomposition and removal of organic substances in the next step.

The air cylinder 15 for raising and lowering the lid body is contracted to lower the lid body 13, and the lower surface of the closing cylinder 18 of the lid body 13 is pressure-bonded to the packing 11 at the upper end of the processing chamber 1 to seal the processing chamber 1.

Next, the vacuum suction passages 65a, 4a, 56a, 2f, the communication passage 2
g, a negative pressure is applied to the substrate suction hole 2e via the vacuum suction path 2d to suck and hold the substrate A on the spin chuck 2.

The positioning air cylinder 52 is contracted to separate the lock pin 51 from the recess 49a of the disc 49, and the rotary shaft 4 is set in a free state.

Next, by rotating the motor 7 at high speed, the rotary shaft 4 and the spin chuck 2 are rotated via the pulley 8, the transmission belt 9 and the pulley 6, and the substrate A sucked and held by the spin chuck 2 is rotated at high speed. .

Further, the valves 31 and 34 are opened to supply oxygen from the oxygen cylinder 30 to the ozone generator 35, and the power of the ozone generator 35 is turned on to convert the supplied oxygen into ozone, and the ozone introduction pipe 36 is connected. Through the ozone introduction port 16, a required flow rate of ozone is supplied between the upper and lower quartz thin plates 13d and 13e of the lid 13.

The valves 31 and 34 are always open, and the ozone inlet 16
It is also possible to provide an exhaust duct for discharging ozone while ozone is not supplied to the device, and to discharge ozone to the exhaust duct.

The ozone is introduced through the ozone introduction hole 13 formed in the lower thin plate 13e.
It is adsorbed and held by the spin chuck 2 via f and supplied to the surface of the substrate A which is rotating at a high speed.

Simultaneously with this ozone supply, a blower (not shown) is driven to bring the exhaust chamber 40 to a negative pressure through the exhaust duct 41 to prevent the ozone from unexpectedly leaking from the inside of the processing chamber 1. Also,
Leave valve 44 open.

Then, the ultraviolet irradiation lamp 19 is turned on to irradiate the surface of the rotating substrate A with the above-mentioned ozone and ultraviolet rays.

Ozone O ₃ is decomposed into activated oxygen atoms O by the irradiated ultraviolet rays, and the oxygen atoms O oxidize adhered organic substances such as a resist film on the surface of the substrate A, thereby reducing CO ₂ ,
It is changed to H ₂ O or the like and decomposed and removed from the substrate A. The generated gas such as CO ₂ and H ₂ O is discharged to the outside through the exhaust duct 43.

In addition, in the above-mentioned oxidation reaction, ultraviolet rays and heat have a function of promoting decomposition of an organic substance and a bond between the organic substance and the activated oxygen atom O.

Since ultraviolet rays are irradiated while rotating the substrate A, it is possible to uniformly irradiate the entire surface of the attached organic substance.

Further, unlike the conventional example, ozone is not generated from oxygen in the air by ultraviolet rays as in the conventional example, but it is directly supplied to the adhered organic matter in the form of ozone from the beginning, so the amount of ozone supplied is sufficient and the adhered organic matter and ozone are The contact frequency is high, and the rate of decomposition and removal of adhered organic matter becomes faster.

Further, unlike the conventional example, a mechanism for vertically swinging the spin chuck 2 is not required, which is useful for simplifying the structure.

In the process of simultaneously supplying ozone and irradiating ultraviolet rays to the rotating substrate A, the adhered organic substances are gradually decomposed and removed as described above. The degree of decomposition and removal (for example, the amount of decrease in the film thickness of the resist film) is monitored by a signal from the surface treatment end point detecting means 20, and when the decomposition and removal is completed (when the film thickness becomes almost zero). The supply of ozone is stopped by the completion signal from the surface treatment end point detecting means 20.
That is, the power of the ozone generator 35 is turned off and the valves 31 and 34 are closed.

Note that the ozone generator 35 is not turned off and the valve is
Instead of closing 31, 34, ozone generation may be continued, and an ozone exhaust duct may be provided to discharge ozone, and the ozone may be exhausted there.

Even after the ozone supply is stopped, the irradiation of ultraviolet rays is continued for a required time, whereby the organic substances remaining on the interface of the surface of the substrate A are continuously decomposed and removed.

After the passage of the required time, the ultraviolet irradiation lamp 19 is turned off. However, energization of the heater 53 is continued.

Next, the valve 38 is opened, and the inert gas cylinder 37 is introduced through the inert gas introduction pipe 16 and the inert gas introduction port 17 through the lid 13
An inert gas (for example, nitrogen gas) having a required flow rate is supplied between the upper and lower quartz thin plates 13d and 13e.

This inert gas flows into the processing chamber 1 through the ozone introduction hole 13f formed in the lower thin plate 13e, and the ozone remaining in the processing chamber 1 and the CO generated in the processing chamber 1 are generated. ₂ ,
A gas such as H ₂ O is purged outside the room through the exhaust duct 43.

Next, the lid raising / lowering air cylinder 15 is extended to raise the lid 13 to open the processing chamber 1. Then, the rotation of the motor 7 is switched from high speed to low speed. The motor 7 is stopped when an optical rotation angle sensor (not shown) detects a predetermined rotation phase of the disk 49 at the lower end of the rotation shaft 4. by this,
The recess 49a of the disc 49 stops at a position just opposite to the lock pin 51.

Next, the vacuum pump (not shown) is stopped to release the negative pressure applied to the substrate suction holes 2e, and the suction holding of the substrate A is released.

Then, the positioning air cylinder 52 is extended to engage the lock pin 51 with the concave portion 49a of the disk 49 to restrict the rotation of the rotary shaft 4 and the spin chuck 2. This makes lifter 3
Each of the lifter rods 3a constituting the
Are aligned with the through holes 2c.

The lifter lifting air cylinder 47 is extended to lift the lifter 3.
The plurality of lifter rods 3 a are projected through the through holes 2 c of the spin chuck 2 so that their upper ends are higher than the upper surface of the spin chuck 2. Then, the substrate A on the spin chuck 2 is transferred onto the plurality of lifter rods 3a.
The lifter rod 3a further rises and stops at a predetermined position.

The pinion gear 23b is driven to lower the shutter 22b and open the substrate carry-out port 21b. Motor for board unloading mechanism 24b
By driving 25, the first arm 26, the second arm 27
Is displaced to move the tip of the second arm 27 to the lifter rod 3a.
The motor 25 is stopped by moving the substrate A below the substrate A.

Then, the substrate A is sucked and held by the second arm 27 by vacuum suction from the vacuum chuck port 29.

The lifter lifting air cylinder 47 is contracted to retract the lifter rod 3a until its upper end is below the lower surface of the spin chuck 2. Even when the lifter rod 3a is lowered, the substrate A is kept sucked and held by the second arm 27.

The board A is carried out of the housing 14 by driving the motor 25 in the board carry-out mechanism 24b in the reverse direction to retract the second arm 27 from the board carry-out port 21b.

Then, the pinion gear 23b is reversely driven to drive the shutter 22b.
To close the substrate outlet 21b.

As described above, one of the processes for decomposing and removing organic substances on one substrate A
The cycle ends.

As described above, in the case of the present invention, ozone is not secondarily generated by irradiation with ultraviolet rays as in the conventional example, but is supplied to the surface of the substrate A in the form of ozone from the beginning simultaneously with irradiation with ultraviolet rays, Moreover, since the ozone is uniformly diffused through the ozone introduction hole 13f, the contact frequency between the ozone and the adhered organic matter on the substrate A becomes high.

On the other hand, since the substrate A is irradiated with ultraviolet rays while being rotated, uniform irradiation is possible, and since the substrate A is also heated by the heater 53, the decomposition rate of organic substances can be sufficiently increased as a whole.

In addition, the spin chuck 2 in the process of decomposing and removing organic substances
The operation of is only rotation, and is not oscillated in the vertical direction at the same time as rotation as in the conventional example. Therefore, the drive mechanism of the spin chuck 2 becomes simple.

In addition, the lifter 3 performs the operation of detaching / attaching the substrate A from / to the spin chuck 2, the external substrate loading mechanism 24a, and the substrate unloading mechanism.
The structure is simplified in that it also serves to transfer the substrate A to and from the substrate 24b, and the automatic transfer of the substrate A is facilitated.

The dry cleaning apparatus for a substrate of this embodiment can also be used in combination with a wet cleaning apparatus arranged in parallel at the next stage.

As an example of the wet cleaning apparatus, there is one that cleans the substrate surface by spraying a cleaning liquid onto the surface of the substrate that is adsorbed and held by a spin chuck and is rotating at high speed.

In this case, the resist components such as iron, sodium, potassium and other metals remaining on the substrate surface in the dry cleaning are washed away with a cleaning liquid. By adding ultrasonic vibration to the cleaning liquid, the cleaning effect can be further enhanced.

Further, instead of arranging a wet cleaning device side by side, in the substrate dry cleaning device of this embodiment itself, a cleaning liquid injection nozzle is provided in the lid body 13, and after the organic substance is decomposed and removed, the substrate is lifted when the lid body 13 is raised. The cleaning liquid may be sprayed onto the surface of A.

If the ultraviolet irradiation lamp 19 can be sufficiently cooled, the upper thin plate 13d of the two quartz thin plates 13d and 13e is omitted and the ozone inlet 16 and the inert gas inlet 17 are omitted. It may be arranged between the transparent plate 13b and the lower thin plate 13.

Further, the lower thin plate 13e is omitted, and a plurality of ultraviolet irradiation lamps 19 are horizontally arranged in a row, and the ozone introduction port 16 is provided between the ultraviolet irradiation lamps 19 and the transparent plate 13b.
By arranging the inert gas introducing port 17, ozone or an inert gas may be supplied from the slit-shaped gap between the ultraviolet irradiation lamps. By doing so, the distance from the ozone inlet 16 to the substrate A and the distance between the ultraviolet irradiation lamp 19 and the substrate A are shortened, and the efficiency of decomposing and removing organic substances can be improved.

In the above embodiment, the through hole 2c is formed in the spin chuck 2 in order to move the lifter rod 3a up and down the spin chuck 2, but a cutout groove may be formed instead of the through hole 2c.

<Effects of the Invention> According to the present invention, the following effects are exhibited.

Ozone is not secondarily generated by UV irradiation, but simultaneously with UV irradiation, ozone is supplied to the substrate surface in the form of ozone from the beginning when the processing chamber is sealed. The contact frequency is high. On the other hand, while the substrate is rotating, it is irradiated with ultraviolet rays in the state of being close to the substrate, so that uniform irradiation is possible, and the substrate is also heated by the heater. Can be sufficiently high.

Further, the operation of the spin chuck in the process of decomposing and removing the organic matter is only rotation, and is not oscillated in the vertical direction at the same time as the rotation as in the conventional example. Therefore, the drive mechanism of the spin chuck can be simplified. .

Furthermore, the lifter has both the operation of detaching the substrate from the spin chuck through a through hole provided in the spin chuck and the operation of transferring the substrate to and from an external substrate loading / unloading mechanism. However, the structure can be downsized and simplified, and it is also advantageous in facilitating automatic transfer of the substrate.

[Brief description of drawings]

1 to 6 relate to an embodiment of the present invention. FIG. 1 is an overall schematic configuration diagram of a dry cleaning apparatus for a substrate, FIG. 2 is an enlarged cross-sectional view of an essential part, and FIG. Fig. 4 is a plan view taken along the line III-III in Fig. 4, Fig. 4 is a sectional view taken along the line IV-IV in Fig. 2, and Fig. 5 is a perspective view of a substrate loading mechanism and a substrate unloading mechanism.
FIG. 6 is a plan view showing a lock mechanism of the spin chuck. A ... Substrate 1 ... Processing chamber 1c ... Processing chamber upper opening 2 ... Spin chuck 3 ... Lifter 3a ... Lifter rod 13 ... Lid 13d ... Upper quartz thin plate 13e ... Lower quartz thin plate 16 ... Ozone Inlet 19 ... UV irradiation lamp 35 ... Ozone generator 47 ... Lift lifter air cylinder 53 ... Heater

Claims (3)

[Scope of utility model registration request] 1. A substrate provided with a spin chuck that holds a substrate by suction and horizontally rotates, and an ultraviolet irradiation lamp disposed above the spin chuck, and decomposes and removes organic substances adhering to the surface of the substrate by ultraviolet irradiation. In the dry cleaning device, the heater built into the spin chuck is passed through a through hole provided in the spin chuck to rise to project above the upper surface of the spin chuck, and a through hole provided in the spin chuck is lowered to descend. A lifter that passes through the lower surface of the spin chuck and lowers and attaches the substrate to and from the spin chuck; a processing chamber that houses the spin chuck and the lifter; a lifted position of the lifter while holding the substrate; A substrate loading / unloading mechanism that horizontally moves back and forth between the outside of the processing chamber and transfers the substrate to and from the lifter; A lid that has a built-in ultraviolet irradiation lamp, moves upward from the upper surface of the spin chuck when moved upward, and closes the upper opening of the processing chamber when moved downward, and ozone that supplies ozone to the substrate on the spin chuck. A dry cleaning apparatus for a substrate, comprising an inlet and an ozone generator connected to the ozone inlet. 2. The lid has quartz thin plates facing each other in the vertical direction, and an ozone inlet is arranged between the upper and lower thin plates,
The dry cleaning apparatus for a substrate according to claim (1), wherein an ozone introduction hole is formed in the lower thin plate, and an ultraviolet irradiation lamp is arranged above the upper thin plate. 3. The utility model registration claim (1) according to claim (1), further comprising a substrate inlet and an outlet, shutters for opening and closing the substrates, and a housing for covering the processing chamber from the outside. Substrate dry cleaning equipment.