JPH0590451A - 半導体集積回路及びその実装装置製造方法 - Google Patents

半導体集積回路及びその実装装置製造方法

Info

Publication number
JPH0590451A
JPH0590451A JP2404833A JP40483390A JPH0590451A JP H0590451 A JPH0590451 A JP H0590451A JP 2404833 A JP2404833 A JP 2404833A JP 40483390 A JP40483390 A JP 40483390A JP H0590451 A JPH0590451 A JP H0590451A
Authority
JP
Japan
Prior art keywords
lead
chip
integrated circuit
semiconductor integrated
polyimide coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2404833A
Other languages
English (en)
Japanese (ja)
Inventor
Thiam B Lim
ビー．リム シアム
Tadashi Saito
正 斉藤
Kyuu Seho Buun
キユー．セホウ ブーン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPH0590451A publication Critical patent/JPH0590451A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04H—BROADCAST COMMUNICATION
    • H04H20/00—Arrangements for broadcast or for distribution combined with broadcast
    • H04H20/65—Arrangements characterised by transmission systems for broadcast
    • H04H20/67—Common-wave systems, i.e. using separate transmitters operating on substantially the same frequency
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73215—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Mobile Radio Communication Systems (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2404833A 1989-12-04 1990-12-21 半導体集積回路及びその実装装置製造方法 Pending JPH0590451A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/445,210 US5054113A (en) 1989-12-04 1989-12-04 Communication system with bit sampling method in portable receiver for simulcast communication
US445210 1989-12-22

Publications (1)

Publication Number Publication Date
JPH0590451A true JPH0590451A (ja) 1993-04-09

Family

ID=23768015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2404833A Pending JPH0590451A (ja) 1989-12-04 1990-12-21 半導体集積回路及びその実装装置製造方法

Country Status (4)

Country Link
US (1) US5054113A (en:Method)
JP (1) JPH0590451A (en:Method)
TW (1) TW242687B (en:Method)
WO (1) WO1991008620A1 (en:Method)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5201061A (en) * 1990-07-23 1993-04-06 Motorola, Inc. Method and apparatus for synchronizing simulcast systems
US5263177A (en) * 1991-01-22 1993-11-16 Motorola, Inc. Modified simulcast communication system
ZA925728B (en) * 1991-08-01 1993-04-28 City Communications Ltd Improvements in a radio communication system
US5517675A (en) * 1991-10-04 1996-05-14 Motorola, Inc. Signal transmission synchronization in a communication system
EP0568143A1 (en) * 1992-04-28 1993-11-03 Koninklijke Philips Electronics N.V. Improved transmitter network with a single transmitter frequency
KR950701783A (ko) * 1992-05-29 1995-04-28 존 에이치. 무어 동시방송 전송 시스템을 동기화하기 위한 방법 및 장치(Method and Apparatus for Synchronizing a Simulcast Transmission System)
US5805645A (en) * 1992-06-30 1998-09-08 Ericsson Inc. Control channel synchronization between DBC and Cellular networks
GB2268366B (en) * 1992-06-30 1996-08-07 Ericsson Ge Mobile Communicat Control channel timing detection and self correction for digitally trunked simulcast radio communication system
US5513215A (en) * 1993-09-20 1996-04-30 Glenayre Electronics, Inc. High speed simulcast data system using adaptive compensation
US5745840A (en) * 1994-03-22 1998-04-28 Tait Electronics Limited Equalization in a simulcast communication system
US5559506A (en) * 1994-05-04 1996-09-24 Motorola, Inc. Method and apparatus for encoding and decoding a digital radio signal
US5771462A (en) * 1995-07-07 1998-06-23 International Business Machines Corporation Bus arbitration infrastructure for deployment of wireless networks
US5995850A (en) * 1997-04-02 1999-11-30 Glenayre Electronics, Inc. Method and apparatus for on-the-fly mode change in a paging transmitter
US6778518B2 (en) * 2002-02-25 2004-08-17 Radioframe Networks, Inc. Distributed radio system with multiple transceivers for simulcasting and selective processing of received signals
US8369459B2 (en) 2009-03-31 2013-02-05 Telefonaktiebolaget L M Ericsson (Publ) Diversity receivers and methods for relatively-delayed signals
US8694037B1 (en) 2013-02-07 2014-04-08 Harris Corporation Method for improving radio performance in a simulcast environment using phase tilted filters

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7511562A (nl) * 1975-02-05 1976-08-09 Chiba Communications Ind Radiocommunicatie-stelsel met mogelijkheid van gelijktijdige communicatie tussen radioposten.
US4255814A (en) * 1977-07-15 1981-03-10 Motorola, Inc. Simulcast transmission system
US4208630A (en) * 1978-10-19 1980-06-17 Altran Electronics, Inc. Narrow band paging or control radio system
SE435438B (sv) * 1982-12-09 1984-09-24 Ericsson Telefon Ab L M Forfarande for instellning av radiosendare pa samtidig sendning
JPS6039310A (ja) * 1983-08-12 1985-03-01 株式会社東芝 サンプリング同期方法
US4696052A (en) * 1985-12-31 1987-09-22 Motorola Inc. Simulcast transmitter apparatus having automatic synchronization capability

Also Published As

Publication number Publication date
WO1991008620A1 (en) 1991-06-13
US5054113A (en) 1991-10-01
TW242687B (en:Method) 1995-03-11

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