TW242687B - - Google Patents
Info
- Publication number
- TW242687B TW242687B TW080108610A TW80108610A TW242687B TW 242687 B TW242687 B TW 242687B TW 080108610 A TW080108610 A TW 080108610A TW 80108610 A TW80108610 A TW 80108610A TW 242687 B TW242687 B TW 242687B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04H—BROADCAST COMMUNICATION
- H04H20/00—Arrangements for broadcast or for distribution combined with broadcast
- H04H20/65—Arrangements characterised by transmission systems for broadcast
- H04H20/67—Common-wave systems, i.e. using separate transmitters operating on substantially the same frequency
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Mobile Radio Communication Systems (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/445,210 US5054113A (en) | 1989-12-04 | 1989-12-04 | Communication system with bit sampling method in portable receiver for simulcast communication |
Publications (1)
Publication Number | Publication Date |
---|---|
TW242687B true TW242687B (zh) | 1995-03-11 |
Family
ID=23768015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW080108610A TW242687B (zh) | 1989-12-04 | 1991-11-02 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5054113A (zh) |
JP (1) | JPH0590451A (zh) |
TW (1) | TW242687B (zh) |
WO (1) | WO1991008620A1 (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5201061A (en) * | 1990-07-23 | 1993-04-06 | Motorola, Inc. | Method and apparatus for synchronizing simulcast systems |
US5263177A (en) * | 1991-01-22 | 1993-11-16 | Motorola, Inc. | Modified simulcast communication system |
US5369784A (en) * | 1991-08-01 | 1994-11-29 | City Communications Limited | Radio communications system using multiple simultaneously transmitting transceivers |
US5517675A (en) * | 1991-10-04 | 1996-05-14 | Motorola, Inc. | Signal transmission synchronization in a communication system |
EP0568143A1 (en) * | 1992-04-28 | 1993-11-03 | Koninklijke Philips Electronics N.V. | Improved transmitter network with a single transmitter frequency |
CA2135795A1 (en) * | 1992-05-29 | 1993-12-09 | Steven Jeffrey Goldberg | Method and apparatus for synchronizing a simulcast transmission system |
US5805645A (en) * | 1992-06-30 | 1998-09-08 | Ericsson Inc. | Control channel synchronization between DBC and Cellular networks |
GB2268366B (en) * | 1992-06-30 | 1996-08-07 | Ericsson Ge Mobile Communicat | Control channel timing detection and self correction for digitally trunked simulcast radio communication system |
US5513215A (en) * | 1993-09-20 | 1996-04-30 | Glenayre Electronics, Inc. | High speed simulcast data system using adaptive compensation |
US5745840A (en) * | 1994-03-22 | 1998-04-28 | Tait Electronics Limited | Equalization in a simulcast communication system |
US5559506A (en) * | 1994-05-04 | 1996-09-24 | Motorola, Inc. | Method and apparatus for encoding and decoding a digital radio signal |
US5771462A (en) * | 1995-07-07 | 1998-06-23 | International Business Machines Corporation | Bus arbitration infrastructure for deployment of wireless networks |
US5995850A (en) * | 1997-04-02 | 1999-11-30 | Glenayre Electronics, Inc. | Method and apparatus for on-the-fly mode change in a paging transmitter |
US6778518B2 (en) * | 2002-02-25 | 2004-08-17 | Radioframe Networks, Inc. | Distributed radio system with multiple transceivers for simulcasting and selective processing of received signals |
US8369459B2 (en) | 2009-03-31 | 2013-02-05 | Telefonaktiebolaget L M Ericsson (Publ) | Diversity receivers and methods for relatively-delayed signals |
US8694037B1 (en) | 2013-02-07 | 2014-04-08 | Harris Corporation | Method for improving radio performance in a simulcast environment using phase tilted filters |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7511562A (nl) * | 1975-02-05 | 1976-08-09 | Chiba Communications Ind | Radiocommunicatie-stelsel met mogelijkheid van gelijktijdige communicatie tussen radioposten. |
US4255814A (en) * | 1977-07-15 | 1981-03-10 | Motorola, Inc. | Simulcast transmission system |
US4208630A (en) * | 1978-10-19 | 1980-06-17 | Altran Electronics, Inc. | Narrow band paging or control radio system |
SE435438B (sv) * | 1982-12-09 | 1984-09-24 | Ericsson Telefon Ab L M | Forfarande for instellning av radiosendare pa samtidig sendning |
JPS6039310A (ja) * | 1983-08-12 | 1985-03-01 | 株式会社東芝 | サンプリング同期方法 |
US4696052A (en) * | 1985-12-31 | 1987-09-22 | Motorola Inc. | Simulcast transmitter apparatus having automatic synchronization capability |
-
1989
- 1989-12-04 US US07/445,210 patent/US5054113A/en not_active Expired - Lifetime
-
1990
- 1990-11-23 WO PCT/US1990/006755 patent/WO1991008620A1/en unknown
- 1990-12-21 JP JP2404833A patent/JPH0590451A/ja active Pending
-
1991
- 1991-11-02 TW TW080108610A patent/TW242687B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO1991008620A1 (en) | 1991-06-13 |
US5054113A (en) | 1991-10-01 |
JPH0590451A (ja) | 1993-04-09 |