JPH0588669B2 - - Google Patents
Info
- Publication number
- JPH0588669B2 JPH0588669B2 JP1273491A JP27349189A JPH0588669B2 JP H0588669 B2 JPH0588669 B2 JP H0588669B2 JP 1273491 A JP1273491 A JP 1273491A JP 27349189 A JP27349189 A JP 27349189A JP H0588669 B2 JPH0588669 B2 JP H0588669B2
- Authority
- JP
- Japan
- Prior art keywords
- steel plate
- layer
- plating
- printed circuit
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Chemical Treatment Of Metals (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27349189A JPH03133633A (ja) | 1989-10-20 | 1989-10-20 | 鉄系プリント基板に適した鋼板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27349189A JPH03133633A (ja) | 1989-10-20 | 1989-10-20 | 鉄系プリント基板に適した鋼板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03133633A JPH03133633A (ja) | 1991-06-06 |
JPH0588669B2 true JPH0588669B2 (enrdf_load_stackoverflow) | 1993-12-24 |
Family
ID=17528646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27349189A Granted JPH03133633A (ja) | 1989-10-20 | 1989-10-20 | 鉄系プリント基板に適した鋼板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03133633A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020041601A (ko) * | 2000-11-28 | 2002-06-03 | 이구택 | 보존성이 우수한 발효식품용기용 냉연강판 |
JP7289602B2 (ja) * | 2020-11-13 | 2023-06-12 | 日東電工株式会社 | 配線回路基板、および配線回路基板の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55129459A (en) * | 1979-03-28 | 1980-10-07 | Mitsubishi Electric Corp | Varnish composition |
JPS62176836A (ja) * | 1986-01-30 | 1987-08-03 | 日立化成工業株式会社 | 鋼板ベ−ス銅張積層板の製造法 |
-
1989
- 1989-10-20 JP JP27349189A patent/JPH03133633A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH03133633A (ja) | 1991-06-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103266335B (zh) | 印刷电路用铜箔及覆铜箔层压板 | |
US5861076A (en) | Method for making multi-layer circuit boards | |
JP2849059B2 (ja) | 印刷回路用銅箔の処理方法 | |
US5389446A (en) | Copper foil for printed circuits | |
KR20030077028A (ko) | 캐리어박 구비 전해동박 및 그 제조방법과 그 캐리어박구비 전해동박을 사용한 동 클래드 적층판 | |
JPH1018075A (ja) | 電解銅箔 | |
JP4978456B2 (ja) | 印刷回路用銅箔 | |
JPH0650794B2 (ja) | 印刷回路用銅箔の処理方法 | |
JP2517503B2 (ja) | 印刷回路用銅箔の表面処理方法 | |
JPH0588669B2 (enrdf_load_stackoverflow) | ||
JPH0633467B2 (ja) | 圧延銅箔の表面処理方法 | |
JP2011129685A (ja) | 環境配慮型プリント配線板用銅箔 | |
JP2875186B2 (ja) | 印刷回路用銅箔の処理方法 | |
JP4762533B2 (ja) | 銅メタライズド積層板及びその製造方法 | |
JP2000501142A (ja) | プリント回路製造用の銅ホイルとその製法 | |
JPH0732307B2 (ja) | 印刷回路用銅箔の表面処理方法 | |
JPH0219994B2 (enrdf_load_stackoverflow) | ||
WO1997004627A1 (en) | Copper foil for the manufacture of printed circuits and method of producing same | |
WO2020195748A1 (ja) | プリント配線板用金属箔、キャリア付金属箔及び金属張積層板、並びにそれらを用いたプリント配線板の製造方法 | |
JP5479668B2 (ja) | 表面処理銅箔 | |
JP3769084B2 (ja) | プリント配線板用銅箔及びその製造方法 | |
JP2684164B2 (ja) | 印刷回路用銅箔の表面処理方法 | |
JP2012041626A (ja) | 銅張積層基板とその製造方法 | |
JP6329727B2 (ja) | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法 | |
JP2005042139A (ja) | 表面処理銅箔及びその製造方法 |