JPH058861B2 - - Google Patents

Info

Publication number
JPH058861B2
JPH058861B2 JP61148559A JP14855986A JPH058861B2 JP H058861 B2 JPH058861 B2 JP H058861B2 JP 61148559 A JP61148559 A JP 61148559A JP 14855986 A JP14855986 A JP 14855986A JP H058861 B2 JPH058861 B2 JP H058861B2
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
grounding
metal plate
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61148559A
Other languages
English (en)
Japanese (ja)
Other versions
JPS633426A (ja
Inventor
Atsuya Ooishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP61148559A priority Critical patent/JPS633426A/ja
Publication of JPS633426A publication Critical patent/JPS633426A/ja
Publication of JPH058861B2 publication Critical patent/JPH058861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Wire Bonding (AREA)
JP61148559A 1986-06-24 1986-06-24 半導体集積回路用パツケ−ジ Granted JPS633426A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61148559A JPS633426A (ja) 1986-06-24 1986-06-24 半導体集積回路用パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61148559A JPS633426A (ja) 1986-06-24 1986-06-24 半導体集積回路用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS633426A JPS633426A (ja) 1988-01-08
JPH058861B2 true JPH058861B2 (enExample) 1993-02-03

Family

ID=15455461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61148559A Granted JPS633426A (ja) 1986-06-24 1986-06-24 半導体集積回路用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS633426A (enExample)

Also Published As

Publication number Publication date
JPS633426A (ja) 1988-01-08

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