JPH0588545B2 - - Google Patents

Info

Publication number
JPH0588545B2
JPH0588545B2 JP60289122A JP28912285A JPH0588545B2 JP H0588545 B2 JPH0588545 B2 JP H0588545B2 JP 60289122 A JP60289122 A JP 60289122A JP 28912285 A JP28912285 A JP 28912285A JP H0588545 B2 JPH0588545 B2 JP H0588545B2
Authority
JP
Japan
Prior art keywords
wire
bonding
capillary
conductive material
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60289122A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61222144A (ja
Inventor
Efu Hiifuringu Jeemusu
Daburyu Puritsuchaado Jeemusu
Jei Sutaaman Rojaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPS61222144A publication Critical patent/JPS61222144A/ja
Publication of JPH0588545B2 publication Critical patent/JPH0588545B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP60289122A 1984-12-21 1985-12-21 セラミツク製ワイヤボンデイング用キヤピラリ Granted JPS61222144A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/684,654 US4691854A (en) 1984-12-21 1984-12-21 Coatings for ceramic bonding capillaries
US684654 1984-12-21

Publications (2)

Publication Number Publication Date
JPS61222144A JPS61222144A (ja) 1986-10-02
JPH0588545B2 true JPH0588545B2 (enExample) 1993-12-22

Family

ID=24748982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60289122A Granted JPS61222144A (ja) 1984-12-21 1985-12-21 セラミツク製ワイヤボンデイング用キヤピラリ

Country Status (2)

Country Link
US (1) US4691854A (enExample)
JP (1) JPS61222144A (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62158335A (ja) * 1985-12-28 1987-07-14 Kyocera Corp ワイヤボンディング用キャピラリ−
US5102004A (en) * 1988-06-08 1992-04-07 Transtech Service Network, Inc. Method and apparatus for packaging refrigerated goods
US5246159A (en) * 1989-07-19 1993-09-21 Nec Corporation Method for forming a bump by bonding a ball on an electrode of an electronic device and apparatus for forming the same
US20060071050A1 (en) * 1999-02-25 2006-04-06 Reiber Steven F Multi-head tab bonding tool
US7389905B2 (en) 1999-02-25 2008-06-24 Reiber Steven F Flip chip bonding tool tip
US6354479B1 (en) * 1999-02-25 2002-03-12 Sjm Technologies Dissipative ceramic bonding tip
US20070131661A1 (en) * 1999-02-25 2007-06-14 Reiber Steven F Solder ball placement system
US7124927B2 (en) * 1999-02-25 2006-10-24 Reiber Steven F Flip chip bonding tool and ball placement capillary
US6651864B2 (en) 1999-02-25 2003-11-25 Steven Frederick Reiber Dissipative ceramic bonding tool tip
US7032802B2 (en) * 1999-02-25 2006-04-25 Reiber Steven F Bonding tool with resistance
US20080197172A1 (en) * 1999-02-25 2008-08-21 Reiber Steven F Bonding Tool
US20060261132A1 (en) * 1999-02-25 2006-11-23 Reiber Steven F Low range bonding tool
SG91867A1 (en) * 2000-05-24 2002-10-15 Casem Asia Pte Ltd Improved apparatus and method for dispensing solder
AU2002235542A1 (en) * 2000-08-22 2002-03-04 Microcoating Technologies, Inc. Narrow diameter needle having reduced inner diameter tip
US6729527B2 (en) * 2001-01-30 2004-05-04 Kulicke & Soffa Investments, Inc. Bonding tool with polymer coating
US7249702B2 (en) 2003-12-04 2007-07-31 Kulicke And Soffa Industries, Inc. Multi-part capillary
US7322507B2 (en) * 2005-01-17 2008-01-29 Amkor Technology, Inc. Transducer assembly, capillary and wire bonding method using the same
US20070085085A1 (en) * 2005-08-08 2007-04-19 Reiber Steven F Dissipative pick and place tools for light wire and LED displays
DE102022001130A1 (de) 2022-03-25 2023-09-28 Jonas Münz Sonotrode sowie Vorrichtung und Verfahren zum Ultraschallschweißen von Stahl
WO2023211676A1 (en) * 2022-04-28 2023-11-02 Kulicke And Soffa Industries, Inc. Wire bonding tools, and related methods of providing the same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB487178A (en) * 1936-07-27 1938-06-16 Siemens Ag Improvements in or relating to soldering irons
US2501616A (en) * 1947-04-08 1950-03-21 Sprague Electric Co Soldering iron tip
GB1072871A (en) * 1963-01-14 1967-06-21 Post Office Improvements in or relating to time division multiplex pulse code modulation communication systems
US3358897A (en) * 1964-03-31 1967-12-19 Tempress Res Co Electric lead wire bonding tools
US3542277A (en) * 1968-03-25 1970-11-24 Motorola Inc Wire bonding needle and method for making same
DE2164822A1 (de) * 1971-12-27 1973-07-19 Reinhard Weichert Potentialfreie loetspitze bzw. loetspitzenhuelse aus isoliermaterial, direkt oder indirekt beheizt
US3863827A (en) * 1972-11-10 1975-02-04 Mech El Ind Inc Tailless wire bonder
JPS5080763A (enExample) * 1973-11-14 1975-07-01
SU582073A1 (ru) * 1975-10-10 1977-11-30 Ордена Трудового Красного Знамени Институт Проблем Материаловедения Устройство дл дуговой сварки плав щимс электродом с увеличенным вылетом электрода
JPS5267261A (en) * 1975-11-10 1977-06-03 Toshiba Corp Lead wire joining tool
JPS54281A (en) * 1976-10-15 1979-01-05 Fujiya Oodeo Kk Method of finishing bearing of turntable shaft
US4340166A (en) * 1978-11-22 1982-07-20 Kulicke & Soffa Industries, Inc. High speed wire bonding method
US4327860A (en) * 1980-01-03 1982-05-04 Kulicke And Soffa Ind. Inc. Method of making slack free wire interconnections
US4387283A (en) * 1981-08-03 1983-06-07 Texas Instruments Incorporated Apparatus and method of forming aluminum balls for ball bonding
JPS5856431A (ja) * 1981-09-30 1983-04-04 Adamando Kogyo Kk キヤピラリ−チツプ

Also Published As

Publication number Publication date
US4691854A (en) 1987-09-08
JPS61222144A (ja) 1986-10-02

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term