JPH0588279B2 - - Google Patents

Info

Publication number
JPH0588279B2
JPH0588279B2 JP60021517A JP2151785A JPH0588279B2 JP H0588279 B2 JPH0588279 B2 JP H0588279B2 JP 60021517 A JP60021517 A JP 60021517A JP 2151785 A JP2151785 A JP 2151785A JP H0588279 B2 JPH0588279 B2 JP H0588279B2
Authority
JP
Japan
Prior art keywords
rosin
adhesive
soldering
adhesive according
acid value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60021517A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61181883A (ja
Inventor
Toshiaki Ogura
Hideo Chaki
Koichi Hagio
Noboru Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60021517A priority Critical patent/JPS61181883A/ja
Publication of JPS61181883A publication Critical patent/JPS61181883A/ja
Publication of JPH0588279B2 publication Critical patent/JPH0588279B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305Affixing by adhesive
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP60021517A 1985-02-05 1985-02-05 はんだ付用一時接着剤 Granted JPS61181883A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60021517A JPS61181883A (ja) 1985-02-05 1985-02-05 はんだ付用一時接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60021517A JPS61181883A (ja) 1985-02-05 1985-02-05 はんだ付用一時接着剤

Publications (2)

Publication Number Publication Date
JPS61181883A JPS61181883A (ja) 1986-08-14
JPH0588279B2 true JPH0588279B2 (enExample) 1993-12-21

Family

ID=12057156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60021517A Granted JPS61181883A (ja) 1985-02-05 1985-02-05 はんだ付用一時接着剤

Country Status (1)

Country Link
JP (1) JPS61181883A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2525182B2 (ja) * 1987-05-22 1996-08-14 内橋エステツク株式会社 チップ型電子部品の固着方法
JPH0726087B2 (ja) * 1989-12-29 1995-03-22 日化精工株式会社 ウエハーの仮着用接着剤およびその洗浄剤
JPH0929486A (ja) * 1995-07-24 1997-02-04 Matsushita Electric Ind Co Ltd クリームはんだ
JP4492893B2 (ja) * 1999-03-17 2010-06-30 株式会社Dnpファインケミカル 液状仮着接着剤
US20240282594A1 (en) * 2021-06-03 2024-08-22 Panasonic Intellectual Property Management Co., Ltd. Electronic-component-mounting-substrate manufacturing method
WO2022254819A1 (ja) 2021-06-03 2022-12-08 パナソニックIpマネジメント株式会社 電子部品実装基板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5118245A (ja) * 1974-08-05 1976-02-13 Tamura Kaken Co Ltd Tsuyakeshifuratsukusu

Also Published As

Publication number Publication date
JPS61181883A (ja) 1986-08-14

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