JPS61181883A - はんだ付用一時接着剤 - Google Patents

はんだ付用一時接着剤

Info

Publication number
JPS61181883A
JPS61181883A JP60021517A JP2151785A JPS61181883A JP S61181883 A JPS61181883 A JP S61181883A JP 60021517 A JP60021517 A JP 60021517A JP 2151785 A JP2151785 A JP 2151785A JP S61181883 A JPS61181883 A JP S61181883A
Authority
JP
Japan
Prior art keywords
rosin
item
adhesive
adhesive according
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60021517A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0588279B2 (enExample
Inventor
Toshiaki Ogura
小倉　利明
Hideo Chagi
茶木　英雄
Koichi Hagio
浩一 萩尾
Noboru Yamazaki
登 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON GENMA KK
Panasonic Holdings Corp
Original Assignee
NIPPON GENMA KK
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON GENMA KK, Matsushita Electric Industrial Co Ltd filed Critical NIPPON GENMA KK
Priority to JP60021517A priority Critical patent/JPS61181883A/ja
Publication of JPS61181883A publication Critical patent/JPS61181883A/ja
Publication of JPH0588279B2 publication Critical patent/JPH0588279B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP60021517A 1985-02-05 1985-02-05 はんだ付用一時接着剤 Granted JPS61181883A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60021517A JPS61181883A (ja) 1985-02-05 1985-02-05 はんだ付用一時接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60021517A JPS61181883A (ja) 1985-02-05 1985-02-05 はんだ付用一時接着剤

Publications (2)

Publication Number Publication Date
JPS61181883A true JPS61181883A (ja) 1986-08-14
JPH0588279B2 JPH0588279B2 (enExample) 1993-12-21

Family

ID=12057156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60021517A Granted JPS61181883A (ja) 1985-02-05 1985-02-05 はんだ付用一時接着剤

Country Status (1)

Country Link
JP (1) JPS61181883A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63289991A (ja) * 1987-05-22 1988-11-28 Uchihashi Estec Co Ltd チップ型電子部品の固着方法
JPH03203981A (ja) * 1989-12-29 1991-09-05 Nikka Seiko Kk ウエハーの仮着用接着剤およびその洗浄剤
JPH0929486A (ja) * 1995-07-24 1997-02-04 Matsushita Electric Ind Co Ltd クリームはんだ
JP2000265151A (ja) * 1999-03-17 2000-09-26 The Inctec Inc 液状仮着接着剤
JPWO2022254818A1 (enExample) * 2021-06-03 2022-12-08
JPWO2022254819A1 (enExample) * 2021-06-03 2022-12-08

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5118245A (ja) * 1974-08-05 1976-02-13 Tamura Kaken Co Ltd Tsuyakeshifuratsukusu

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5118245A (ja) * 1974-08-05 1976-02-13 Tamura Kaken Co Ltd Tsuyakeshifuratsukusu

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63289991A (ja) * 1987-05-22 1988-11-28 Uchihashi Estec Co Ltd チップ型電子部品の固着方法
JPH03203981A (ja) * 1989-12-29 1991-09-05 Nikka Seiko Kk ウエハーの仮着用接着剤およびその洗浄剤
JPH0929486A (ja) * 1995-07-24 1997-02-04 Matsushita Electric Ind Co Ltd クリームはんだ
JP2000265151A (ja) * 1999-03-17 2000-09-26 The Inctec Inc 液状仮着接着剤
JPWO2022254818A1 (enExample) * 2021-06-03 2022-12-08
JPWO2022254819A1 (enExample) * 2021-06-03 2022-12-08
US12402255B2 (en) 2021-06-03 2025-08-26 Panasonic Intellectual Property Management Co., Ltd. Method for producing electronic component mounted substrate

Also Published As

Publication number Publication date
JPH0588279B2 (enExample) 1993-12-21

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