JPH058681Y2 - - Google Patents
Info
- Publication number
- JPH058681Y2 JPH058681Y2 JP1987070073U JP7007387U JPH058681Y2 JP H058681 Y2 JPH058681 Y2 JP H058681Y2 JP 1987070073 U JP1987070073 U JP 1987070073U JP 7007387 U JP7007387 U JP 7007387U JP H058681 Y2 JPH058681 Y2 JP H058681Y2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- probe card
- support
- electrical characteristics
- card board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000523 sample Substances 0.000 claims description 117
- 239000011111 cardboard Substances 0.000 claims description 17
- 239000012212 insulator Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000005476 soldering Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987070073U JPH058681Y2 (de) | 1987-05-11 | 1987-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987070073U JPH058681Y2 (de) | 1987-05-11 | 1987-05-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63178327U JPS63178327U (de) | 1988-11-18 |
| JPH058681Y2 true JPH058681Y2 (de) | 1993-03-04 |
Family
ID=30911374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987070073U Expired - Lifetime JPH058681Y2 (de) | 1987-05-11 | 1987-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH058681Y2 (de) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63244750A (ja) * | 1987-03-31 | 1988-10-12 | Tokyo Electron Ltd | プロ−ブカ−ドおよびその製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0341467Y2 (de) * | 1986-12-03 | 1991-08-30 |
-
1987
- 1987-05-11 JP JP1987070073U patent/JPH058681Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63244750A (ja) * | 1987-03-31 | 1988-10-12 | Tokyo Electron Ltd | プロ−ブカ−ドおよびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63178327U (de) | 1988-11-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5382898A (en) | High density probe card for testing electrical circuits | |
| US6333635B1 (en) | Probe card for testing an integrated circuit chip | |
| JPH0517705B2 (de) | ||
| JPH01209380A (ja) | プローブカード | |
| KR20000071437A (ko) | 반도체 장치의 패키지 | |
| JPH058681Y2 (de) | ||
| TWI703328B (zh) | 電性連接裝置 | |
| JPH01128381A (ja) | Ｌｓｉウエハの試験方法 | |
| US6573113B1 (en) | Integrated circuit having dedicated probe pads for use in testing densely patterned bonding pads | |
| KR20030078659A (ko) | 프로브 카드 및 그것을 제조하기 위한 기판 | |
| KR20080000879A (ko) | 비지에이 반도체 칩 패키지 및 이의 검사 방법 | |
| US5220278A (en) | Fixing card for use with high frequency | |
| JPH0964126A (ja) | ウェーハプローバ用接続リング | |
| JP2657315B2 (ja) | プローブカード | |
| JPS59762Y2 (ja) | プロ−ブカ−ド | |
| JPH06308163A (ja) | プローブ装置 | |
| JPS5826530Y2 (ja) | プロ−ブカ−ド | |
| JP2980952B2 (ja) | プローブボード | |
| JP2557685B2 (ja) | プロ−ブカ−ド | |
| JPH0225234Y2 (de) | ||
| JPS61294373A (ja) | 針式プロ−ビング装置 | |
| JPS5826531Y2 (ja) | プロ−ブカ−ド | |
| JPS6331130A (ja) | プロ−ブカ−ド | |
| JPH03173145A (ja) | プローブカード | |
| JPH0926437A (ja) | プローブカードおよびそれを用いた検査装置 |