JPH0586475B2 - - Google Patents
Info
- Publication number
- JPH0586475B2 JPH0586475B2 JP61277559A JP27755986A JPH0586475B2 JP H0586475 B2 JPH0586475 B2 JP H0586475B2 JP 61277559 A JP61277559 A JP 61277559A JP 27755986 A JP27755986 A JP 27755986A JP H0586475 B2 JPH0586475 B2 JP H0586475B2
- Authority
- JP
- Japan
- Prior art keywords
- target
- sputtering
- cooling
- cooling block
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27755986A JPS63130771A (ja) | 1986-11-20 | 1986-11-20 | スパツタ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27755986A JPS63130771A (ja) | 1986-11-20 | 1986-11-20 | スパツタ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63130771A JPS63130771A (ja) | 1988-06-02 |
| JPH0586475B2 true JPH0586475B2 (cg-RX-API-DMAC10.html) | 1993-12-13 |
Family
ID=17585209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27755986A Granted JPS63130771A (ja) | 1986-11-20 | 1986-11-20 | スパツタ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63130771A (cg-RX-API-DMAC10.html) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4385979A (en) * | 1982-07-09 | 1983-05-31 | Varian Associates, Inc. | Target assemblies of special materials for use in sputter coating apparatus |
| JPS6065529A (ja) * | 1983-09-21 | 1985-04-15 | Hitachi Ltd | スパッタリング用タ−ゲット |
-
1986
- 1986-11-20 JP JP27755986A patent/JPS63130771A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63130771A (ja) | 1988-06-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4385979A (en) | Target assemblies of special materials for use in sputter coating apparatus | |
| KR910001879B1 (ko) | 스퍼터 성막방법 및 그 장치 | |
| US4606802A (en) | Planar magnetron sputtering with modified field configuration | |
| JP2004346356A (ja) | マスクユニットおよびそれを用いた成膜装置 | |
| KR20030064825A (ko) | 고전력 스퍼터링 작업을 위한 마찰 끼워맞춤 타겟 어셈블리 | |
| JPS60152671A (ja) | スパツタリング電極 | |
| US20130098757A1 (en) | Sputtering deposition apparatus and adhesion preventing member | |
| US6287437B1 (en) | Recessed bonding of target for RF diode sputtering | |
| US20030183518A1 (en) | Concave sputtering apparatus | |
| JP4945031B2 (ja) | 基板加熱装置および半導体製造装置 | |
| JPH07292466A (ja) | スパッタリングカソード | |
| GB2156862A (en) | Cathode sputtering unit | |
| JPH0586475B2 (cg-RX-API-DMAC10.html) | ||
| JPS62193141A (ja) | ウエハ−保持機構 | |
| JPH06108241A (ja) | スパッタリング装置 | |
| CN116904953A (zh) | 一种气相沉积设备 | |
| JP3498291B2 (ja) | スパッタリングカソード | |
| JP2844669B2 (ja) | 反応性マグネトロンスパッタ装置 | |
| JP2756158B2 (ja) | スパッタ装置 | |
| JPH03177020A (ja) | エッチング装置 | |
| KR102815335B1 (ko) | 스퍼터링 타겟 접합방법 | |
| JPS61166964A (ja) | スパツタリング用タ−ゲツト | |
| JPH02301558A (ja) | スパッタ装置 | |
| JPH11335827A (ja) | スパッタリング装置 | |
| KR102707659B1 (ko) | 스퍼터링 타겟 접합체 |