JPH0585261B2 - - Google Patents
Info
- Publication number
- JPH0585261B2 JPH0585261B2 JP23465286A JP23465286A JPH0585261B2 JP H0585261 B2 JPH0585261 B2 JP H0585261B2 JP 23465286 A JP23465286 A JP 23465286A JP 23465286 A JP23465286 A JP 23465286A JP H0585261 B2 JPH0585261 B2 JP H0585261B2
- Authority
- JP
- Japan
- Prior art keywords
- heat medium
- steam generation
- generation tank
- flux
- reflow soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 claims description 29
- 230000004907 flux Effects 0.000 claims description 27
- 238000001816 cooling Methods 0.000 claims description 21
- 229920006395 saturated elastomer Polymers 0.000 claims description 13
- 238000001914 filtration Methods 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 5
- 239000002244 precipitate Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007790 scraping Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23465286A JPS6390361A (ja) | 1986-10-03 | 1986-10-03 | ベ−パ−リフロ−式はんだ付け装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23465286A JPS6390361A (ja) | 1986-10-03 | 1986-10-03 | ベ−パ−リフロ−式はんだ付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6390361A JPS6390361A (ja) | 1988-04-21 |
| JPH0585261B2 true JPH0585261B2 (zh) | 1993-12-06 |
Family
ID=16974371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23465286A Granted JPS6390361A (ja) | 1986-10-03 | 1986-10-03 | ベ−パ−リフロ−式はんだ付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6390361A (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01107965A (ja) * | 1987-10-20 | 1989-04-25 | Tamura Seisakusho Co Ltd | 気相式はんだ付け用溶剤のフィルタリング装置 |
| JPH0677812B2 (ja) * | 1988-06-29 | 1994-10-05 | 日立テクノエンジニアリング株式会社 | ベーパリフローはんだ付け装置 |
| JPH082495B2 (ja) * | 1989-12-25 | 1996-01-17 | 日立テクノエンジニアリング株式会社 | ベーパーリフロー式はんだ付け方法及び同装置 |
| JP2549211B2 (ja) * | 1991-01-16 | 1996-10-30 | 株式会社日立製作所 | ベーパーはんだ付装置 |
| JP2794352B2 (ja) * | 1991-08-22 | 1998-09-03 | エイテックテクトロン 株式会社 | リフロー半田付け装置 |
| JP2709365B2 (ja) * | 1992-03-16 | 1998-02-04 | 日立テクノエンジニアリング株式会社 | ベーパーリフローはんだ付け装置 |
-
1986
- 1986-10-03 JP JP23465286A patent/JPS6390361A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6390361A (ja) | 1988-04-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101687263B (zh) | 从回流设备去除污染物的方法和设备 | |
| WO2006082959A1 (ja) | リフロー炉のフューム除去方法およびリフロー炉 | |
| JP2005515078A (ja) | フラックス回収方法およびシステム | |
| US4996781A (en) | Vapor reflow type soldering apparatus with an improved flux separating unit | |
| JPH0585261B2 (zh) | ||
| JP2709365B2 (ja) | ベーパーリフローはんだ付け装置 | |
| US5156325A (en) | Vapor reflow type soldering method and apparatus therefor | |
| JPH0343935B2 (zh) | ||
| JPH0550218A (ja) | リフロー半田付け装置 | |
| JP2902298B2 (ja) | ベーパーリフローはんだ付け装置およびその制御方法 | |
| JPH0245948B2 (zh) | ||
| CN111036013B (zh) | 一种用于管式pecvd设备的尾气粉尘捕捉装置 | |
| JP2751979B2 (ja) | ベーパーリフローはんだ付け装置 | |
| JPH02112872A (ja) | ベーパーリフロー式はんだ付け装置 | |
| JPS62148082A (ja) | ベ−パ−リフロ−式はんだ付け装置 | |
| JPS62148084A (ja) | ベ−パ−リフロ−式はんだ付装置 | |
| JPS62252670A (ja) | ベ−パ−リフロ−式はんだ付け装置 | |
| JPH0677812B2 (ja) | ベーパリフローはんだ付け装置 | |
| JPS63203270A (ja) | ベ−パ−リフロ−式はんだ付け装置 | |
| JPH0677813B2 (ja) | ベーパーリフロー式はんだ付け装置 | |
| JPH035269B2 (zh) | ||
| JPS62148085A (ja) | ペ−パ−リフロ−式はんだ付け装置 | |
| JP2723402B2 (ja) | ベーパーリフローはんだ付け装置 | |
| JPH02155565A (ja) | ベーパーリフロー式はんだ付け装置 | |
| JPH0215873A (ja) | 半田付装置の液浄化装置 |