JPH0583633B2 - - Google Patents

Info

Publication number
JPH0583633B2
JPH0583633B2 JP62268893A JP26889387A JPH0583633B2 JP H0583633 B2 JPH0583633 B2 JP H0583633B2 JP 62268893 A JP62268893 A JP 62268893A JP 26889387 A JP26889387 A JP 26889387A JP H0583633 B2 JPH0583633 B2 JP H0583633B2
Authority
JP
Japan
Prior art keywords
target
material particles
semiconductor substrate
sputtering
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62268893A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01111872A (ja
Inventor
Shigeru Nakajima
Hiroshi Yano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP26889387A priority Critical patent/JPH01111872A/ja
Publication of JPH01111872A publication Critical patent/JPH01111872A/ja
Publication of JPH0583633B2 publication Critical patent/JPH0583633B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP26889387A 1987-10-23 1987-10-23 スパッタリング装置 Granted JPH01111872A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26889387A JPH01111872A (ja) 1987-10-23 1987-10-23 スパッタリング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26889387A JPH01111872A (ja) 1987-10-23 1987-10-23 スパッタリング装置

Publications (2)

Publication Number Publication Date
JPH01111872A JPH01111872A (ja) 1989-04-28
JPH0583633B2 true JPH0583633B2 (enrdf_load_stackoverflow) 1993-11-26

Family

ID=17464731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26889387A Granted JPH01111872A (ja) 1987-10-23 1987-10-23 スパッタリング装置

Country Status (1)

Country Link
JP (1) JPH01111872A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2912181B2 (ja) * 1995-02-28 1999-06-28 広島日本電気株式会社 スパッタリング装置
JP4355036B2 (ja) 1997-03-18 2009-10-28 キヤノンアネルバ株式会社 イオン化スパッタリング装置
US6475353B1 (en) * 1997-05-22 2002-11-05 Sony Corporation Apparatus and method for sputter depositing dielectric films on a substrate
JPH111770A (ja) * 1997-06-06 1999-01-06 Anelva Corp スパッタリング装置及びスパッタリング方法
CN104008268A (zh) * 2014-03-20 2014-08-27 上海宇航系统工程研究所 空间目标可见光散射特性分析模型校验方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916975A (ja) * 1982-07-20 1984-01-28 Canon Inc スパツタリング装置

Also Published As

Publication number Publication date
JPH01111872A (ja) 1989-04-28

Similar Documents

Publication Publication Date Title
JP3449459B2 (ja) 薄膜形成装置用部材の製造方法および該装置用部材
JPH021909B2 (enrdf_load_stackoverflow)
KR980011765A (ko) 플라즈마 리액터에서의 전기적 플로팅 실드
JP5725460B2 (ja) スパッタリング装置
JP2002146524A (ja) パーティクル発生の少ないスパッタリングターゲット
JPH10152774A (ja) スパッタリング装置
US6159351A (en) Magnet array for magnetrons
JPH0583633B2 (enrdf_load_stackoverflow)
JP2002004038A (ja) パーティクル発生の少ないスパッタリングターゲット
JP2912181B2 (ja) スパッタリング装置
JPH0220210Y2 (enrdf_load_stackoverflow)
JP4439652B2 (ja) 薄膜形成装置用部材及びその製造方法
JP2019157144A (ja) 成膜装置
JPH11246964A (ja) 蒸着源及び蒸着装置
JPS5916975A (ja) スパツタリング装置
JPH10121235A (ja) 複合スパッタリングカソード、そのカソードを用いたスパッタリング装置
JPS63291421A (ja) 半導体ウエハの処理方法
JP2002038264A (ja) スパッタ成膜方法およびスパッタ成膜装置
JPH05275350A (ja) 半導体製造装置
JP2002363743A (ja) スパッタリング装置
JPH07292465A (ja) スパッタリング装置
KR100188520B1 (ko) 미립자 오염방지를 위한 다전극형 스퍼터링 방법 및 장치
JP2001303245A (ja) パーティクル発生の少ないスパッタリングターゲット−バッキングプレート組立体
JP2604853B2 (ja) 回路板のスルーホール形成方法
JP4594455B2 (ja) 蒸着源及び蒸着装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees