JPH01111872A - スパッタリング装置 - Google Patents

スパッタリング装置

Info

Publication number
JPH01111872A
JPH01111872A JP26889387A JP26889387A JPH01111872A JP H01111872 A JPH01111872 A JP H01111872A JP 26889387 A JP26889387 A JP 26889387A JP 26889387 A JP26889387 A JP 26889387A JP H01111872 A JPH01111872 A JP H01111872A
Authority
JP
Japan
Prior art keywords
target
sputtering
semiconductor substrate
capture electrode
electric field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26889387A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0583633B2 (enrdf_load_stackoverflow
Inventor
Shigeru Nakajima
中島　成
Hiroshi Yano
浩 矢野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP26889387A priority Critical patent/JPH01111872A/ja
Publication of JPH01111872A publication Critical patent/JPH01111872A/ja
Publication of JPH0583633B2 publication Critical patent/JPH0583633B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP26889387A 1987-10-23 1987-10-23 スパッタリング装置 Granted JPH01111872A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26889387A JPH01111872A (ja) 1987-10-23 1987-10-23 スパッタリング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26889387A JPH01111872A (ja) 1987-10-23 1987-10-23 スパッタリング装置

Publications (2)

Publication Number Publication Date
JPH01111872A true JPH01111872A (ja) 1989-04-28
JPH0583633B2 JPH0583633B2 (enrdf_load_stackoverflow) 1993-11-26

Family

ID=17464731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26889387A Granted JPH01111872A (ja) 1987-10-23 1987-10-23 スパッタリング装置

Country Status (1)

Country Link
JP (1) JPH01111872A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08239761A (ja) * 1995-02-28 1996-09-17 Hiroshima Nippon Denki Kk スパッタリング装置
WO1998053117A1 (en) * 1997-05-22 1998-11-26 Tokyo Electron Limited Apparatus and method for sputter depositing dielectric films on a substrate
US6077403A (en) * 1997-06-06 2000-06-20 Anelva Corporation Sputtering device and sputtering method
US6361667B1 (en) 1997-03-18 2002-03-26 Anelva Corporation Ionization sputtering apparatus
CN104008268A (zh) * 2014-03-20 2014-08-27 上海宇航系统工程研究所 空间目标可见光散射特性分析模型校验方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916975A (ja) * 1982-07-20 1984-01-28 Canon Inc スパツタリング装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916975A (ja) * 1982-07-20 1984-01-28 Canon Inc スパツタリング装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08239761A (ja) * 1995-02-28 1996-09-17 Hiroshima Nippon Denki Kk スパッタリング装置
US6361667B1 (en) 1997-03-18 2002-03-26 Anelva Corporation Ionization sputtering apparatus
WO1998053117A1 (en) * 1997-05-22 1998-11-26 Tokyo Electron Limited Apparatus and method for sputter depositing dielectric films on a substrate
US6475353B1 (en) * 1997-05-22 2002-11-05 Sony Corporation Apparatus and method for sputter depositing dielectric films on a substrate
US6077403A (en) * 1997-06-06 2000-06-20 Anelva Corporation Sputtering device and sputtering method
CN104008268A (zh) * 2014-03-20 2014-08-27 上海宇航系统工程研究所 空间目标可见光散射特性分析模型校验方法

Also Published As

Publication number Publication date
JPH0583633B2 (enrdf_load_stackoverflow) 1993-11-26

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