JPH0582059B2 - - Google Patents

Info

Publication number
JPH0582059B2
JPH0582059B2 JP60196542A JP19654285A JPH0582059B2 JP H0582059 B2 JPH0582059 B2 JP H0582059B2 JP 60196542 A JP60196542 A JP 60196542A JP 19654285 A JP19654285 A JP 19654285A JP H0582059 B2 JPH0582059 B2 JP H0582059B2
Authority
JP
Japan
Prior art keywords
pressure
dicing
sensitive adhesive
resin
dicing film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60196542A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6254937A (ja
Inventor
Hideo Kuroda
Masao Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bando Chemical Industries Ltd
Original Assignee
Bando Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bando Chemical Industries Ltd filed Critical Bando Chemical Industries Ltd
Priority to JP60196542A priority Critical patent/JPS6254937A/ja
Priority to DE8686200196T priority patent/DE3665191D1/de
Priority to EP19860200196 priority patent/EP0194706B1/en
Priority to EP19860200195 priority patent/EP0191534B1/en
Priority to DE8686200195T priority patent/DE3671577D1/de
Priority to CA000501750A priority patent/CA1272542A/en
Priority to CA000501753A priority patent/CA1252579A/en
Priority to US06/829,814 priority patent/US4720317A/en
Priority to US06/829,818 priority patent/US4818621A/en
Publication of JPS6254937A publication Critical patent/JPS6254937A/ja
Priority to US07/108,202 priority patent/US4968559A/en
Priority to US07/287,089 priority patent/US4913960A/en
Publication of JPH0582059B2 publication Critical patent/JPH0582059B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
JP60196542A 1985-02-14 1985-09-04 半導体ウエハ−のダイシング方法 Granted JPS6254937A (ja)

Priority Applications (11)

Application Number Priority Date Filing Date Title
JP60196542A JPS6254937A (ja) 1985-09-04 1985-09-04 半導体ウエハ−のダイシング方法
DE8686200196T DE3665191D1 (en) 1985-02-14 1986-02-11 A pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same
EP19860200196 EP0194706B1 (en) 1985-02-14 1986-02-11 A pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same
EP19860200195 EP0191534B1 (en) 1985-02-14 1986-02-11 A method for dicing a semiconductor wafer
DE8686200195T DE3671577D1 (de) 1985-02-14 1986-02-11 Verfahren zum schneiden einer halbleiterscheibe in wuerfel.
CA000501750A CA1272542A (en) 1985-02-14 1986-02-13 Pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same
CA000501753A CA1252579A (en) 1985-02-14 1986-02-13 Method for dicing a semiconductor wafer
US06/829,814 US4720317A (en) 1985-02-14 1986-02-14 Method for dicing a semiconductor wafer
US06/829,818 US4818621A (en) 1985-02-14 1986-02-14 Pressure sensitive adhesives with reducible adhesive force using radiation, and films therewith
US07/108,202 US4968559A (en) 1985-02-14 1987-10-14 Pressure sensitive adhesive film with barrier layer
US07/287,089 US4913960A (en) 1985-02-14 1988-12-21 Pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60196542A JPS6254937A (ja) 1985-09-04 1985-09-04 半導体ウエハ−のダイシング方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2238755A Division JPH03278444A (ja) 1990-09-07 1990-09-07 半導体ウエハーのダイシング方法

Publications (2)

Publication Number Publication Date
JPS6254937A JPS6254937A (ja) 1987-03-10
JPH0582059B2 true JPH0582059B2 (enExample) 1993-11-17

Family

ID=16359470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60196542A Granted JPS6254937A (ja) 1985-02-14 1985-09-04 半導体ウエハ−のダイシング方法

Country Status (1)

Country Link
JP (1) JPS6254937A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0796769B2 (ja) * 1988-08-22 1995-10-18 旭コンクリート工業株式会社 組立式地下構築物およびその施工方法
JP2503828B2 (ja) * 1992-03-16 1996-06-05 建設省北陸地方建設局長 Ｐｃボックスカルバ―トの組立方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850164B2 (ja) * 1977-04-01 1983-11-09 日立化成工業株式会社 表面保護方法
JPS5921038A (ja) * 1982-07-27 1984-02-02 Nec Home Electronics Ltd ペレツト剥離方法

Also Published As

Publication number Publication date
JPS6254937A (ja) 1987-03-10

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