JPS6254937A - 半導体ウエハ−のダイシング方法 - Google Patents

半導体ウエハ−のダイシング方法

Info

Publication number
JPS6254937A
JPS6254937A JP60196542A JP19654285A JPS6254937A JP S6254937 A JPS6254937 A JP S6254937A JP 60196542 A JP60196542 A JP 60196542A JP 19654285 A JP19654285 A JP 19654285A JP S6254937 A JPS6254937 A JP S6254937A
Authority
JP
Japan
Prior art keywords
dicing
pressure
sensitive adhesive
resin
ultraviolet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60196542A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0582059B2 (enExample
Inventor
Hideo Kuroda
黒田　秀雄
Masao Taniguchi
谷口　正雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bando Chemical Industries Ltd
Original Assignee
Bando Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bando Chemical Industries Ltd filed Critical Bando Chemical Industries Ltd
Priority to JP60196542A priority Critical patent/JPS6254937A/ja
Priority to DE8686200195T priority patent/DE3671577D1/de
Priority to EP19860200195 priority patent/EP0191534B1/en
Priority to DE8686200196T priority patent/DE3665191D1/de
Priority to EP19860200196 priority patent/EP0194706B1/en
Priority to CA000501753A priority patent/CA1252579A/en
Priority to CA000501750A priority patent/CA1272542A/en
Priority to US06/829,814 priority patent/US4720317A/en
Priority to US06/829,818 priority patent/US4818621A/en
Publication of JPS6254937A publication Critical patent/JPS6254937A/ja
Priority to US07/108,202 priority patent/US4968559A/en
Priority to US07/287,089 priority patent/US4913960A/en
Publication of JPH0582059B2 publication Critical patent/JPH0582059B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
JP60196542A 1985-02-14 1985-09-04 半導体ウエハ−のダイシング方法 Granted JPS6254937A (ja)

Priority Applications (11)

Application Number Priority Date Filing Date Title
JP60196542A JPS6254937A (ja) 1985-09-04 1985-09-04 半導体ウエハ−のダイシング方法
DE8686200195T DE3671577D1 (de) 1985-02-14 1986-02-11 Verfahren zum schneiden einer halbleiterscheibe in wuerfel.
EP19860200195 EP0191534B1 (en) 1985-02-14 1986-02-11 A method for dicing a semiconductor wafer
DE8686200196T DE3665191D1 (en) 1985-02-14 1986-02-11 A pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same
EP19860200196 EP0194706B1 (en) 1985-02-14 1986-02-11 A pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same
CA000501753A CA1252579A (en) 1985-02-14 1986-02-13 Method for dicing a semiconductor wafer
CA000501750A CA1272542A (en) 1985-02-14 1986-02-13 Pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same
US06/829,814 US4720317A (en) 1985-02-14 1986-02-14 Method for dicing a semiconductor wafer
US06/829,818 US4818621A (en) 1985-02-14 1986-02-14 Pressure sensitive adhesives with reducible adhesive force using radiation, and films therewith
US07/108,202 US4968559A (en) 1985-02-14 1987-10-14 Pressure sensitive adhesive film with barrier layer
US07/287,089 US4913960A (en) 1985-02-14 1988-12-21 Pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60196542A JPS6254937A (ja) 1985-09-04 1985-09-04 半導体ウエハ−のダイシング方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2238755A Division JPH03278444A (ja) 1990-09-07 1990-09-07 半導体ウエハーのダイシング方法

Publications (2)

Publication Number Publication Date
JPS6254937A true JPS6254937A (ja) 1987-03-10
JPH0582059B2 JPH0582059B2 (enExample) 1993-11-17

Family

ID=16359470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60196542A Granted JPS6254937A (ja) 1985-02-14 1985-09-04 半導体ウエハ−のダイシング方法

Country Status (1)

Country Link
JP (1) JPS6254937A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0258638A (ja) * 1988-08-22 1990-02-27 Asahi Concrete Works Co Ltd 組立式地下構築物およびその施工方法
JPH05263456A (ja) * 1992-03-16 1993-10-12 Kensetsusho Hokurikuchihou Kensetsukyoku Ｐｃボックスカルバート

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53121832A (en) * 1977-04-01 1978-10-24 Hitachi Chem Co Ltd Method of protecting surface
JPS5921038A (ja) * 1982-07-27 1984-02-02 Nec Home Electronics Ltd ペレツト剥離方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53121832A (en) * 1977-04-01 1978-10-24 Hitachi Chem Co Ltd Method of protecting surface
JPS5921038A (ja) * 1982-07-27 1984-02-02 Nec Home Electronics Ltd ペレツト剥離方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0258638A (ja) * 1988-08-22 1990-02-27 Asahi Concrete Works Co Ltd 組立式地下構築物およびその施工方法
JPH05263456A (ja) * 1992-03-16 1993-10-12 Kensetsusho Hokurikuchihou Kensetsukyoku Ｐｃボックスカルバート

Also Published As

Publication number Publication date
JPH0582059B2 (enExample) 1993-11-17

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