JPH058108Y2 - - Google Patents
Info
- Publication number
- JPH058108Y2 JPH058108Y2 JP15931988U JP15931988U JPH058108Y2 JP H058108 Y2 JPH058108 Y2 JP H058108Y2 JP 15931988 U JP15931988 U JP 15931988U JP 15931988 U JP15931988 U JP 15931988U JP H058108 Y2 JPH058108 Y2 JP H058108Y2
- Authority
- JP
- Japan
- Prior art keywords
- gate
- molding
- molded
- mold
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 claims description 111
- 238000004891 communication Methods 0.000 claims description 38
- 238000005299 abrasion Methods 0.000 claims description 12
- 239000012778 molding material Substances 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000000155 melt Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- 238000012546 transfer Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 8
- 238000007789 sealing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15931988U JPH058108Y2 (US07223432-20070529-C00017.png) | 1988-12-06 | 1988-12-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15931988U JPH058108Y2 (US07223432-20070529-C00017.png) | 1988-12-06 | 1988-12-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0278321U JPH0278321U (US07223432-20070529-C00017.png) | 1990-06-15 |
JPH058108Y2 true JPH058108Y2 (US07223432-20070529-C00017.png) | 1993-03-01 |
Family
ID=31440428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15931988U Expired - Lifetime JPH058108Y2 (US07223432-20070529-C00017.png) | 1988-12-06 | 1988-12-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH058108Y2 (US07223432-20070529-C00017.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004114696A (ja) * | 2003-11-28 | 2004-04-15 | Oki Electric Ind Co Ltd | モールドパッケージ及びその製造方法 |
-
1988
- 1988-12-06 JP JP15931988U patent/JPH058108Y2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004114696A (ja) * | 2003-11-28 | 2004-04-15 | Oki Electric Ind Co Ltd | モールドパッケージ及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0278321U (US07223432-20070529-C00017.png) | 1990-06-15 |
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