JPH0580834B2 - - Google Patents

Info

Publication number
JPH0580834B2
JPH0580834B2 JP57217243A JP21724382A JPH0580834B2 JP H0580834 B2 JPH0580834 B2 JP H0580834B2 JP 57217243 A JP57217243 A JP 57217243A JP 21724382 A JP21724382 A JP 21724382A JP H0580834 B2 JPH0580834 B2 JP H0580834B2
Authority
JP
Japan
Prior art keywords
oxide film
bonding pad
semiconductor substrate
pad electrode
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57217243A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59106162A (ja
Inventor
Takeshi Takanori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP57217243A priority Critical patent/JPS59106162A/ja
Publication of JPS59106162A publication Critical patent/JPS59106162A/ja
Publication of JPH0580834B2 publication Critical patent/JPH0580834B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP57217243A 1982-12-10 1982-12-10 半導体装置 Granted JPS59106162A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57217243A JPS59106162A (ja) 1982-12-10 1982-12-10 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57217243A JPS59106162A (ja) 1982-12-10 1982-12-10 半導体装置

Publications (2)

Publication Number Publication Date
JPS59106162A JPS59106162A (ja) 1984-06-19
JPH0580834B2 true JPH0580834B2 (enrdf_load_stackoverflow) 1993-11-10

Family

ID=16701091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57217243A Granted JPS59106162A (ja) 1982-12-10 1982-12-10 半導体装置

Country Status (1)

Country Link
JP (1) JPS59106162A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07232552A (ja) * 1994-02-23 1995-09-05 Toyonaga Takemori 車の二段式日よけ

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01262654A (ja) * 1988-04-14 1989-10-19 Toshiba Corp 半導体装置
CN105378923B (zh) * 2013-07-11 2019-09-27 三菱电机株式会社 半导体装置的制造方法以及pin二极管

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243382A (en) * 1975-10-02 1977-04-05 Matsushita Electronics Corp Mos type diode
JPS5429587A (en) * 1977-08-10 1979-03-05 Hitachi Ltd Semiconductor device
JPS54139374A (en) * 1978-04-21 1979-10-29 Toshiba Corp Semiconductor device
JPS56105670A (en) * 1980-01-28 1981-08-22 Mitsubishi Electric Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07232552A (ja) * 1994-02-23 1995-09-05 Toyonaga Takemori 車の二段式日よけ

Also Published As

Publication number Publication date
JPS59106162A (ja) 1984-06-19

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