JPH0578936B2 - - Google Patents

Info

Publication number
JPH0578936B2
JPH0578936B2 JP60038380A JP3838085A JPH0578936B2 JP H0578936 B2 JPH0578936 B2 JP H0578936B2 JP 60038380 A JP60038380 A JP 60038380A JP 3838085 A JP3838085 A JP 3838085A JP H0578936 B2 JPH0578936 B2 JP H0578936B2
Authority
JP
Japan
Prior art keywords
pellet
gold plating
plating layer
bonding
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60038380A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61196545A (ja
Inventor
Tetsukazu Inoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP60038380A priority Critical patent/JPS61196545A/ja
Publication of JPS61196545A publication Critical patent/JPS61196545A/ja
Publication of JPH0578936B2 publication Critical patent/JPH0578936B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP60038380A 1985-02-26 1985-02-26 ペレツトボンデイング方法 Granted JPS61196545A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60038380A JPS61196545A (ja) 1985-02-26 1985-02-26 ペレツトボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60038380A JPS61196545A (ja) 1985-02-26 1985-02-26 ペレツトボンデイング方法

Publications (2)

Publication Number Publication Date
JPS61196545A JPS61196545A (ja) 1986-08-30
JPH0578936B2 true JPH0578936B2 (enExample) 1993-10-29

Family

ID=12523666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60038380A Granted JPS61196545A (ja) 1985-02-26 1985-02-26 ペレツトボンデイング方法

Country Status (1)

Country Link
JP (1) JPS61196545A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6877271B2 (ja) * 2017-07-05 2021-05-26 三菱電機株式会社 光モジュールの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138242A (en) * 1979-04-13 1980-10-28 Toshiba Corp Die bonding
JPS59113629A (ja) * 1982-12-20 1984-06-30 Fujitsu Ltd 半導体装置

Also Published As

Publication number Publication date
JPS61196545A (ja) 1986-08-30

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