JPH057877B2 - - Google Patents

Info

Publication number
JPH057877B2
JPH057877B2 JP63148521A JP14852188A JPH057877B2 JP H057877 B2 JPH057877 B2 JP H057877B2 JP 63148521 A JP63148521 A JP 63148521A JP 14852188 A JP14852188 A JP 14852188A JP H057877 B2 JPH057877 B2 JP H057877B2
Authority
JP
Japan
Prior art keywords
circuit board
holes
rubber sheet
board
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63148521A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01316988A (ja
Inventor
Kazunori Takeguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Risho Kogyo Co Ltd
Original Assignee
Risho Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Risho Kogyo Co Ltd filed Critical Risho Kogyo Co Ltd
Priority to JP14852188A priority Critical patent/JPH01316988A/ja
Publication of JPH01316988A publication Critical patent/JPH01316988A/ja
Publication of JPH057877B2 publication Critical patent/JPH057877B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0094Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP14852188A 1988-06-16 1988-06-16 貼り合せ回路基板の製造法 Granted JPH01316988A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14852188A JPH01316988A (ja) 1988-06-16 1988-06-16 貼り合せ回路基板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14852188A JPH01316988A (ja) 1988-06-16 1988-06-16 貼り合せ回路基板の製造法

Publications (2)

Publication Number Publication Date
JPH01316988A JPH01316988A (ja) 1989-12-21
JPH057877B2 true JPH057877B2 (enrdf_load_stackoverflow) 1993-01-29

Family

ID=15454637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14852188A Granted JPH01316988A (ja) 1988-06-16 1988-06-16 貼り合せ回路基板の製造法

Country Status (1)

Country Link
JP (1) JPH01316988A (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5515245A (en) * 1978-07-18 1980-02-02 Matsushita Electric Ind Co Ltd Bothhside circuit board and method of manufacturing same
JPS59175796A (ja) * 1983-03-25 1984-10-04 日本電気株式会社 多層印刷配線板の製造方法

Also Published As

Publication number Publication date
JPH01316988A (ja) 1989-12-21

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