JPH057877B2 - - Google Patents
Info
- Publication number
- JPH057877B2 JPH057877B2 JP63148521A JP14852188A JPH057877B2 JP H057877 B2 JPH057877 B2 JP H057877B2 JP 63148521 A JP63148521 A JP 63148521A JP 14852188 A JP14852188 A JP 14852188A JP H057877 B2 JPH057877 B2 JP H057877B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- holes
- rubber sheet
- board
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14852188A JPH01316988A (ja) | 1988-06-16 | 1988-06-16 | 貼り合せ回路基板の製造法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14852188A JPH01316988A (ja) | 1988-06-16 | 1988-06-16 | 貼り合せ回路基板の製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01316988A JPH01316988A (ja) | 1989-12-21 |
JPH057877B2 true JPH057877B2 (enrdf_load_stackoverflow) | 1993-01-29 |
Family
ID=15454637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14852188A Granted JPH01316988A (ja) | 1988-06-16 | 1988-06-16 | 貼り合せ回路基板の製造法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01316988A (enrdf_load_stackoverflow) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5515245A (en) * | 1978-07-18 | 1980-02-02 | Matsushita Electric Ind Co Ltd | Bothhside circuit board and method of manufacturing same |
JPS59175796A (ja) * | 1983-03-25 | 1984-10-04 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
-
1988
- 1988-06-16 JP JP14852188A patent/JPH01316988A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH01316988A (ja) | 1989-12-21 |
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