JPH0577974U - Printed circuit board - Google Patents

Abstract

(57) [Abstract] [Purpose] In a printed circuit board that constitutes an electronic circuit, prevents solder from blowing up to the component side when soldering in a solder bath. A masking portion 4 is formed inside a through-hole outer shape 2 in a printed circuit board 1 with a substrate die-cutting portion 3 therebetween, and a perforation hole 6 is formed in a base portion 5 of the masking portion 4.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a printed circuit board that constitutes an electronic circuit.

[0002]

[Prior Art]

 In a conventional printed circuit board, there are methods such as a masking jig as shown in FIG. 7 and a paste-like masking material application as shown in FIG. .

[0003]

[Problems to be solved by the device]

 When using the above-mentioned conventional masking jig, the jig has to be prepared, and the jig must be detached before and after the soldering work, which is a troublesome task. there were. In addition, when using a masking material, a screen for applying the masking material must be prepared, and since the masking material can be used only once, it becomes a consumable item. I had to do peeling work.

[0004]

[Means for Solving the Problems]

 The present invention is designed so that, in a printed circuit board that constitutes an electronic circuit, the solder does not blow up to the component surface side when soldering in a solder bath.

[0005]

【Example】

 Next, the present invention will be described with reference to the drawings. First Embodiment (FIGS. 1 to 3) This embodiment shows a case where the outer shape of a hole formed in a substrate is large, and 1 is a printed circuit board, which is constant inside the through hole outer shape 2 of the substrate 1. A masking portion 4 is formed with a substrate die-cutting portion 3 having a space T therebetween. The base portion 5 of the masking portion 4 is connected to the substrate 1 through the perforation holes 6, and the masking portion 4 bends the perforation holes 6 and divides and removes them after the soldering work is completed. By forming the masking portion 4, it is possible to almost prevent the solder from being blown up to the component surface side during soldering with a solder bath (not shown).

Second Embodiment (FIGS. 4 to 6) This embodiment shows a case where the through hole outline 2 formed in the substrate 1 is small. In the case of this embodiment, the occupied area of the board die-cutting portion 3 is larger than that of the first embodiment, but since the through-hole shape 2 is small, it is possible to prevent the solder blowing up. However, the size and shape of the masking portion 4 can be variously changed, and the present invention is not limited to this.

[0007]

[Effect of the device]

 As described above, in the present invention, since the masking portion is formed by connecting to the substrate, it is possible to prevent the solder from blowing up only by the substrate, and unlike the conventional technique, no masking jig is required and the masking material is applied. There are actual benefits such as improved work efficiency, reduced man-hours, and reduced material costs without the need for complicated work.

[Brief description of drawings]

FIG. 1 is a plan view of a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line XX of FIG.

3 is a sectional view taken along line YY of FIG. 1.

FIG. 4 is a plan view of a second embodiment of the present invention.

5 is a sectional view taken along line XX of FIG.

6 is a sectional view taken along line YY of FIG. 4.

[Explanation of symbols]

 1 Printed circuit board 2 Through hole outline 3 Board die cutting part 4 Masking part 5 Base part 6 Perforation hole

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[Procedure amendment]

[Submission date] April 7, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Brief explanation of the drawing

[Correction method] Change

[Correction content]

[Brief description of drawings]

FIG. 1 is a plan view of a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line XX of FIG.

3 is a sectional view taken along line YY of FIG. 1.

FIG. 4 is a plan view of a second embodiment of the present invention.

5 is a sectional view taken along line XX of FIG.

6 is a sectional view taken along line YY of FIG. 4.

FIG. 7 is a cross-sectional view showing a conventional technique.

FIG. 8 is a cross-sectional view showing a conventional technique.

[Explanation of reference numerals] 1 printed circuit board 2 through hole outer shape 3 board die-cutting section 4 masking section 5 base section 6 perforation hole

Claims (3)

[Scope of utility model registration request] 1. A printed circuit board 1 is provided with a board die-cutting portion 3.
Printed circuit board in which masking part 4 is formed by separating 2. A printed circuit board in which a masking portion 4 is formed inside a through hole contour 2 in the printed circuit board 1 with a substrate die-cutting portion 3 being separated. 3. A masking portion (4) is formed inside a through hole (2) in a printed circuit board (1) with a substrate die-cutting portion (3) being separated, and a perforation hole (6) is formed in a base portion (5) of the masking portion (4).
Printed circuit board with