JP2001185822A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JP2001185822A JP2001185822A JP36856899A JP36856899A JP2001185822A JP 2001185822 A JP2001185822 A JP 2001185822A JP 36856899 A JP36856899 A JP 36856899A JP 36856899 A JP36856899 A JP 36856899A JP 2001185822 A JP2001185822 A JP 2001185822A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- board
- discarded
- harmful substance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電子部品を搭載する
プリント配線基板の分割溝に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dividing groove for a printed wiring board on which electronic components are mounted.
【０００２】[0002]
【従来の技術】プリント配線基板の製品となるプリント
配線基板１と捨て基板２は、従来図２に示すように、双
方の間の周囲に具備した分割溝６と双方を接続する継部
５によって構成されていた。前記のように製品となるプ
リント配線基板１の他に周囲に分割溝６、継部５及び捨
て基板２を具備させるのは、製品の形状、サイズが多種
多様であり、電子部品搭載段取り時間短縮等の目的で、
一定の外形寸法にして生産し、プリント基板完成後に不
要な部分を除去するためである。又前記捨て基板２の一
部にパターン認識マーク４があるのは、電子部品を高精
度でプリント配線基板に搭載する場合に画像認識処理で
位置精度を確保するためである。2. Description of the Related Art As shown in FIG. 2, a printed wiring board 1 and a discarded board 2 which are products of a printed wiring board are separated by a joint groove 5 provided on the periphery between them and a joint 5 for connecting the two. Was composed. As described above, in addition to the printed wiring board 1 as a product, the division groove 6, the joint portion 5, and the waste board 2 are provided around the periphery because the shape and size of the product are various and the electronic component mounting setup time is reduced. For purposes such as
This is for producing a fixed external dimension and removing unnecessary portions after the printed circuit board is completed. The reason why the pattern recognition mark 4 is provided on a part of the discard substrate 2 is to secure the positional accuracy by the image recognition processing when the electronic component is mounted on the printed wiring board with high accuracy.
【０００３】[0003]
【発明が解決しようとする課題】従来の分割溝６は製品
となるプリント配線基板１の周囲にのみ具備されてお
り、捨て基板２は半田等の有害物質を含む部分も含め、
一体で大きな形状のまま残り、廃棄する場合の有害物質
付着廃棄物量が増大する問題があった。本発明はこれら
の欠点を除去し、前記廃棄物の量を削減することを目的
とするものである。The conventional dividing groove 6 is provided only around the printed wiring board 1 as a product, and the discarded substrate 2 includes a portion including a harmful substance such as solder.
There is a problem in that the waste remains in a large shape as one piece, and the amount of waste attached with harmful substances increases when the waste is discarded. The present invention aims to eliminate these drawbacks and reduce the amount of said waste.
【０００４】[0004]
【課題を解決するための手段】本発明は上記目的を達成
するため、半田等の有害物質が付着しているパターン認
識マーク等の周囲にも分割溝を具備するパターン認識部
捨て基板を有する構成としたものである。その結果、捨
て基板側の有害物質付着部分を最少の形状で分離するこ
とができる。SUMMARY OF THE INVENTION In order to achieve the above object, the present invention has a structure having a pattern recognition portion discarded substrate provided with a division groove also around a pattern recognition mark or the like to which a harmful substance such as solder is attached. It is what it was. As a result, the harmful substance-attached portion on the discarded substrate side can be separated with a minimum shape.
【０００５】[0005]
【発明の実施の形態】以下この発明の一実施例を図１に
より説明する。１は製品となるプリント配線基板であ
る。この部分には多数の電子部品が搭載されている。２
は製品となるプリント配線基板１の完成後不要となる捨
て基板であり、６は前記双方の基板を分離する分割溝で
ある。５は前記の双方を生産時に連結している継部であ
る。又４は製品となるプリント配線基板１に電子部品を
搭載する時に画像認識するパターン認識マークであり、
生産時に半田等の有害物質が付着することが多い。本発
明は有害物質等が付着しているパターン認識マーク部４
周囲にも分割溝６を具備させることにより、基板分割後
に有害物質付着廃棄物量を最少限にする手段を提供する
ものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIG. Reference numeral 1 denotes a printed wiring board as a product. Many electronic components are mounted on this part. 2
Reference numeral 6 denotes a discarded substrate which becomes unnecessary after the completion of the printed wiring board 1 as a product. Reference numeral 6 denotes a dividing groove for separating the two substrates. Reference numeral 5 denotes a joint connecting both of the above at the time of production. Reference numeral 4 denotes a pattern recognition mark for recognizing an image when an electronic component is mounted on the printed wiring board 1 as a product.
Harmful substances such as solder often adhere during production. The present invention relates to a pattern recognition mark portion 4 to which harmful substances and the like are attached.
The provision of the dividing groove 6 around the periphery also provides a means for minimizing the amount of harmful substance adhering waste after dividing the substrate.
【０００６】[0006]
【発明の効果】本発明によれば、有害物質付着廃棄物量
を大幅に削減できる効果がある。又前記パターン認識マ
ーク４の他にプリント配線基板生産時に使用する捨て基
板２側に具備された機能チェック用パターン等について
も容易に適用が可能である。According to the present invention, there is an effect that the amount of waste containing harmful substances can be greatly reduced. Further, in addition to the pattern recognition mark 4, a function check pattern or the like provided on the discard substrate 2 used in the production of a printed wiring board can be easily applied.
【図１】本発明の一実施例を示すプリント配線基板の平
面図。FIG. 1 is a plan view of a printed wiring board according to an embodiment of the present invention.
【図２】従来のプリント配線基板の平面図。FIG. 2 is a plan view of a conventional printed wiring board.
１：製品となるプリント配線基板、２：捨て基板、３：
パターン認識部捨て基板、４：パターン認識マーク、
５：継部、６：分割溝。1: Printed wiring board to be a product, 2: Discarded board, 3:
Discard substrate for pattern recognition part 4: Pattern recognition mark,
5: joint, 6: dividing groove.
Claims (1)
基板において、製品となるプリント配線基板と分割後に
廃棄する捨て基板の周囲に具備した分割溝の他に、前記
捨て基板の一部にある半田等の有害物質付着部分の周囲
にも分割溝を具備させたことを特徴とするプリント配線
基板。1. A split type printed wiring board on which electronic components are mounted, in addition to a divided groove provided around a printed wiring board to be a product and a discarded board to be discarded after being divided, and a solder on a part of the discarded board. A printed wiring board characterized in that a dividing groove is also provided around a portion where harmful substances are adhered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36856899A JP2001185822A (en) | 1999-12-27 | 1999-12-27 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36856899A JP2001185822A (en) | 1999-12-27 | 1999-12-27 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001185822A true JP2001185822A (en) | 2001-07-06 |
Family
ID=18492170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36856899A Pending JP2001185822A (en) | 1999-12-27 | 1999-12-27 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001185822A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007234951A (en) * | 2006-03-02 | 2007-09-13 | Yazaki Corp | Wiring substrate positioning method in reflow soldering treatment, and wiring substrate for reflow soldering |
-
1999
- 1999-12-27 JP JP36856899A patent/JP2001185822A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007234951A (en) * | 2006-03-02 | 2007-09-13 | Yazaki Corp | Wiring substrate positioning method in reflow soldering treatment, and wiring substrate for reflow soldering |
| JP4714600B2 (en) * | 2006-03-02 | 2011-06-29 | 矢崎総業株式会社 | Wiring board positioning method and reflow soldering wiring board in reflow soldering processing |
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