JPS5996794A - Method of machining profile of printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for processing the outer shape of a printed wiring board, and particularly to a method for processing the outer shape of a printed wiring board having a special outer shape.

[Technical background of the invention]

When automatic soldering is performed when there is a cut on the outer periphery of a printed wiring board or a hole in the center, solder may flow from the cut or hole onto the wiring board. . In order to prevent this, conventionally, Figure 1 (a) 5b
) on the moon, the sign λ11. ] A tape 5 for preventing soldering is applied to the back surface (soldering surface) 4 of the seal plate 1 so as to close the notch 2 and hole 3 formed in the plate 1.
was pasted.

[Problems with background technology]

This method requires a lot of man-hours for attaching and removing the tape 5.

[Purpose of the invention]

The present invention has been made in view of the above facts, and provides a method for processing the outer shape of a printed wiring board that can reduce the number of steps required for automatic soldering of printed wiring boards having a special outer shape.

[Summary of the invention]

The present invention performs automatic soldering work when processing the external shape of a printed wiring board with a special external shape, such as a notch on the outer periphery or a hole inside, in the external shape DO method for printed wiring boards. Previously, I left a part of the cut line of the external shape processing and connected the unnecessary part and the product part with this connection part,
This prevents solder from rising onto the printed wiring board during automatic soldering work, and after the automatic soldering work is completed, the unnecessary portions are cut off to produce a product.

[Six Examples of the Ability of the Invention] Examples of the method for processing the outer shape of a printed wiring board according to the present invention will be described below with reference to the drawings.

In FIG. 2, the same parts as in FIG. 1 are designated by the same numbers as in FIG. Cut lines 6.7 are formed in the outer circumferential cut portion 2 and the inner hole portion 3 of the printing base 421, respectively, and the product portion 9 and the unnecessary portion 10 are plastically connected by a connecting portion 8 formed in a portion thereof. ing. FIG. 3 is a side view from the -B' side.

In the non-embodiment configured in this way, the printed wiring board 1
When assembling parts and performing automatic soldering work, solder may build up on the printed wiring board because the notch part 2 and internal hole part 3 are covered by the unnecessary part 10 marked on bIJ. Prevent it from coming.

After the automatic soldering work is completed, the connecting portion 8 is cut and the unnecessary portion 10 is removed using R, and the product is completed.

[Efficacy of invention]

The present invention relates to a method for processing the external shape of a printed wiring board, in which a connecting part is provided at a part of the cutting line of the outer circumference cut part or the internal hole part before automatic soldering, and the unnecessary part is connected to the product part. Leave it behind,
After completing the automatic quick delivery, cut this connection and remove the unnecessary part! Since we decided to commercialize the product by removing j・,
It has a great effect in that it can prevent solder from climbing onto the printed wiring board during the automatic process [1E], and the number of man-hours can be significantly reduced by 7 times compared to the conventional masking method.

[Brief explanation of drawings]

Figure 1 (aJ is a perspective view showing the external tele-processing method similar to the marking fii'f wiring of subordinate X, and Figure 4 (b) is the A-
Figure 2 is a perspective view showing an embodiment of the method for processing the external shape of the hjj distribution plate according to the present invention, and Figure 3 is a cross-sectional view taken along arrow B-4 in Figure 2. . 1...Printed wiring board 2...GJ injection wholesaler 3...
Hole part 5...Solder going up J Doyo Tezo 6.7...Incision line 8...Joining part 9...Product department 10...Unnecessary part agent Patent attorney Noriyuki Chika (and others) 1 person) (a) \Figure 2-3 \ (b) 9 Figure 3

Claims (1)

[Claims] In the external processing method for printed wiring boards, when cutting unnecessary parts such as outer peripheral notches or internal holes, a connecting part that connects to the product part is formed on a part of this cutting line, and automatic soldering work is performed. After completing the process, we cut this joint, deleted the unnecessary part, and manufactured the product, which prevented solder from adhering to the printed wiring board during the automatic soldering process! 4. Mark: External processing method for ljl wiring board.