JPS61222295A - Carrying of parts on printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] By inserting terminals into through-holes and temporarily mounting components mounted outside the board on the dummy side edge, the component body is mounted on the printed board. To reduce mounting costs by making it possible to dip solder at the same time as mounting components on a certain board.

[Industrial application field]

The present invention relates to an improvement in a method for mounting components onto a printed board.

As shown in the printed board mounting sectional view of FIG. 3, the printed board board 2 is removably mounted in parallel to the bottom plate of the base l using mounting screws 3.

Most of the components mounted on the printed circuit board 2 are mounted components whose main bodies are placed on the printed circuit board 2 and whose terminals are inserted into through holes, that is, in-board mounted components 4.

However, some semiconductor components, such as a three-terminal regulator, have terminals 6 inserted into through-holes 16 of printed circuit board 2, and component body 5A is a mounted component mounted on base 1, i.e., mounted outside the board. There is part 5.

For such an off-board mounted component 5, screw the small screw 7 so that the lower surface of the component body 5A is brought into close contact with the upper end surface of the base edge member IA.
By fixing it to the base 1 which has a large surface area, it is possible to thermally connect it to the base 1 which has a large surface area, and it is possible to improve the cooling efficiency.

At this time, it is desired to solder-dip the externally mounted components 5 at the same time as the internally mounted components 4 in order to reduce mounting costs.

[Conventional technology]

FIGS. 4(a) and 4(b) are perspective views showing a conventional mounting process for components mounted outside the board.

Conventionally, as shown in FIG. 4 (al), with the terminals of the components 4 mounted on the board inserted into the through holes of the printed board 2, the side edges of the printed board 2 are inserted into the opposing grooves of the carrier 11. and is attached to the carrier 11.

Then, by lowering the carrier 11 and immersing the lower surface of the printed circuit board 2 in the molten solder 10 contained in the solder bath 10A, the parts mounted on the board are first dipped.
is mounted on the printed circuit board 2. Thereafter, the carrier 11 is moved to automatically cut off the excess length of the terminal protruding from the lower surface of the printed circuit board 2.

Next, as shown in Figure 4), the terminal 6 is inserted into the through hole 16 so that the component body 5^ is horizontal outside the printed circuit board 2. Then, in this state, the terminals 6 and the through holes 16 are connected by soldering manually to mount the off-board components 5 on the printed circuit board 2. Thereafter, the extra length of the terminal 6 is manually cut off.

In this way, the mounting process for the internally mounted components 4 and the externally mounted components 5 is separated by the component body 5 of the externally mounted components 5.
This is because the side edges of the printed circuit board 2 cannot be held between the carriers 11 because the printed circuit board A is mounted so as to protrude outside the printed circuit board 2.

[Problem that the invention seeks to solve]

However, in the above-mentioned conventional component mounting method, the components 4 to be mounted on the board and the components 5 to be mounted outside the board are separate processes, which increases the number of man-hours for soldering and cutting the extra length of the terminals, resulting in high mounting costs. There is a problem.

[Means for solving problems]

In order to solve the above conventional problems, the present invention provides a rectangular dummy side having a width greater than the length of the component body of the off-board mounted component 5 on the outside of the frame-shaped parts line 12, as shown in FIG. An edge 13 is provided, the component body is placed on the dummy side edge 13, and a through hole 16 is formed within the frame of the parts line 12.
With the terminal 6 of the externally mounted component 5 inserted into the board, solder dip the printed circuit board 2 at the same time as the internally mounted component 4 to mount the externally mounted component 5, and then attach the dummy side edge 1.
3 is separated.

[Effect]

According to the means of the present invention, a rectangular dummy side edge portion 13 having a width equal to or greater than the length of the component body of the off-board mounted component 5 is provided on the outside of the frame-shaped parts line 12, so that the terminal 6 is inserted into the through hole 16 and the component main body 5A is placed on the dummy side edge 13, it becomes possible to hold the printed circuit board 2 in the carrier. Therefore, the components 5 mounted outside the board can be soldered-dipped at the same time as the components 4 mounted inside the board, and the excess lengths of the terminals can also be automatically cut, thereby reducing mounting costs.

〔Example〕

The present invention will be specifically explained below with reference to illustrated examples. Note that the same reference numerals indicate the same objects throughout the figures.

FIG. 1 is a perspective view of one embodiment of the present invention, and FIG. 2 is a perspective view of essential parts of another embodiment.

In FIG. 1, the printed circuit board 2 has four
Parallel to the sides, part lines 12 are provided in a frame shape, such as perforations or grooves, which can be cut by hand bending.

A rectangular dummy side edge 13 having a width equal to or greater than the length of the component 5 mounted on the board to the component body 5 is formed on the outside of the parts line 12 .

The components mounted on the board 4 have respective terminals inserted into through holes at desired locations within the frame of the parts line 12, and the components mounted outside the board 5 have their terminals inserted so that the lower surface of the component main body 5A is on the dummy side edge 13. The terminal 6 is inserted into the through hole 16.

Note that a pin 17 passes through a hole provided in the component body 5A and a hole provided in the dummy side edge 13 for fixing the component body 5A to the base with a machine screw (machine screw 7 shown in FIG. 3). is used to prevent the off-board mounted components 5 from shifting their positions.

After placing the internally mounted components 4 and the externally mounted components 5 on the printed circuit board 2 in this way, the opposing dummy side edge 1
The printed circuit board 2 is mounted on the carrier by inserting the side edge 3, the side edge 14 portion for carrier clamping shown by the hatched line in the figure, into the groove of the carrier.

Then, the printed circuit board 2 is soldered dipped, and the terminals of the internally mounted components 4 and the terminals 6 of the externally mounted components 5 are simultaneously soldered and connected to their respective through-hole portions. Subsequently, the excess length of the terminal protruding from the lower surface of the printed circuit board 2 is automatically cut off.

As described above, after the internally mounted component 4 and the externally mounted component 5 are simultaneously mounted on the printed circuit board 2, the dummy side edge 13 is bent and separated at the part line 12.

The component mounting method shown in FIG. 2 is an embodiment in which the off-board mounting component 5 is mounted such that the lower surface of the component main body 5A is located above the surface of the printed circuit board 2.

In such a case, the component main body 5A and the dummy side edge 13 are brought into close contact with each other via a spacer 15 of a desired thickness, and the pin 17 is used to prevent displacement.

After that, the internally mounted components 4 and the externally mounted components 5 are simultaneously mounted on the printed circuit board 2 using the same procedure as explained in FIG.

〔Effect of the invention〕

Claims (1)

[Claims] Off-board mounting components (
5) A rectangular dummy side edge (13) having a width equal to or greater than the length of the part body is provided, the part body is placed on the dummy side edge (13), and the part body is placed within the frame of the part line (12). With the terminal (6) of the off-board mounted component (5) inserted into the provided through hole (16), the printed circuit board (2) was dipped with solder to mount the off-board mounted component (5). A method for mounting components on a printed board, comprising: later cutting off the dummy side edge (13).