JPH01290287A - Mounting structure of semiconductor module - Google Patents
Mounting structure of semiconductor moduleInfo
- Publication number
- JPH01290287A JPH01290287A JP12086488A JP12086488A JPH01290287A JP H01290287 A JPH01290287 A JP H01290287A JP 12086488 A JP12086488 A JP 12086488A JP 12086488 A JP12086488 A JP 12086488A JP H01290287 A JPH01290287 A JP H01290287A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor module
- module
- printed wiring
- wiring board
- square hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 70
- 238000005476 soldering Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000005549 size reduction Methods 0.000 abstract 1
- 238000012423 maintenance Methods 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Abstract
Description
【発明の詳細な説明】
〔概要〕
半導体モジュールの実装構造に関し、
実装高さが低く小形で、また信号の高速化が促進され、
高速信号の搬送性が良好であって、且つ保守作業が容易
な、半導体モジュールの実装構造を提供することを目的
とし、
上面から４側壁にかけてパターンを並列に形成したモジ
ュール基板の上面に、半導体部品を表面実装して構成し
た半導体モジュールと、印刷配線板の所望の個所に設け
た、該モジュール基板に相似でそれよりも所望に大きい
角孔と、弾性ある金属片よりなり、上辺部が該印刷配線
板の上面に配列したパターンの端末に半田付けされて該
印刷配線板に装着され、ほぼ弓形の接触子部が該角孔の
内壁に配列されてなる、ばね端子とを具備し、該半導体
モジュールを該角孔に嵌挿し、該半導体モジュールのそ
れぞれのパターンを、対応する該ばね端子に弾接接続す
る構成とする。[Detailed Description of the Invention] [Summary] Regarding the mounting structure of a semiconductor module, the mounting height is small and the mounting height is low, and high-speed signals are promoted.
With the aim of providing a semiconductor module mounting structure that has good high-speed signal transport properties and is easy to maintain, semiconductor components are mounted on the top surface of a module substrate with patterns formed in parallel from the top surface to the four side walls. A semiconductor module configured by surface mounting a printed wiring board, a square hole similar to the module board and desirably larger than the printed wiring board, and an elastic metal piece, the upper side of which is connected to the printed wiring board. a spring terminal which is attached to the printed wiring board by being soldered to the terminals of the pattern arranged on the upper surface of the wiring board, and has a substantially arcuate contact portion arranged on the inner wall of the square hole; The module is inserted into the square hole, and each pattern of the semiconductor module is elastically connected to the corresponding spring terminal.
本発明は、半導体モジュールの実装構造に関する。 The present invention relates to a mounting structure for a semiconductor module.
近年の電子部品及び電子機器は、軽薄短小傾向にあり、
同時に高密度化が一般と要求されるようになった。この
ような背景から、半導体部品を印刷配線板に実装した場
合においても、薄型化、小形軽量化が要求され、例えば
ＬＳＩ等のような半導体部品も、薄い基板に表面実装し
て半導体モジュールとし、この半導体モジュールを印刷
配線板に実装する傾向にある。In recent years, electronic parts and devices have become lighter, thinner, and smaller.
At the same time, higher density became a common demand. Against this background, even when semiconductor components are mounted on printed wiring boards, there is a demand for thinner, smaller, and lighter weight. For example, semiconductor components such as LSI are also surface-mounted on thin substrates to form semiconductor modules. There is a trend to mount this semiconductor module on a printed wiring board.
第３図は半導体モジュールの実装構造を示す従来例の側
断面図である。FIG. 3 is a side sectional view of a conventional example showing a mounting structure of a semiconductor module.
第３図において、半導体モジュール３０は、モジュール
基板２の上面に、例えばＬＳＩ等の半導体部品３を表面
実装して構成されている。In FIG. 3, a semiconductor module 30 is constructed by surface-mounting a semiconductor component 3 such as an LSI on the upper surface of a module substrate 2. As shown in FIG.
モジュール基板２は、例えばセラミックスよりなる、小
形で板厚が薄い角板状の基板である。モジュール基板２
の表面には多数のパターン、例えば信号パターン４−１
．アースパターン４−２等を放射線状に形成し、それら
のパターンの集中した中央部に、半導体部品３をマウン
トしである。The module board 2 is a small, thin, rectangular plate-shaped board made of, for example, ceramics. Module board 2
There are many patterns on the surface, such as signal pattern 4-1.
．． Ground patterns 4-2 and the like are formed in a radial pattern, and the semiconductor component 3 is mounted in the center where these patterns are concentrated.
一方、５は、ビン形の端子部の上端に、一対の挟持片を
側面視コ形に設けたリード端子である。On the other hand, 5 is a lead terminal in which a pair of clamping pieces are provided at the upper end of a bottle-shaped terminal portion in a U-shape when viewed from the side.
リード端子５は、挟持片がモジュール基板２の側壁に挟
着して、モジュール基板２に固着し、且つ挟持片が信号
パターン４−１．或いはアースパターン４−２に接続し
ている。The lead terminal 5 has a clamping piece that is clamped to the side wall of the module board 2 and fixed to the module board 2, and the clamping piece is attached to the signal pattern 4-1. Alternatively, it is connected to the ground pattern 4-2.
半導体モジュール３０には、上述のように多数のリード
端子５が、モジュール基板２の４側壁に垂直に下方に突
出して配設されている。In the semiconductor module 30, as described above, a large number of lead terminals 5 are arranged to protrude downward perpendicularly to the four side walls of the module substrate 2.
従来は、上記のように半導体モジュール３０にリード端
子５を装着し、それぞれのリード端子５の端子部の先端
を、印刷配線板１０の対応するスルーホールに挿入し、
半田付けして、半導体モジュール３０を印刷配線板１０
に実装していた。Conventionally, the lead terminals 5 are attached to the semiconductor module 30 as described above, and the tips of the terminal portions of the respective lead terminals 5 are inserted into the corresponding through holes of the printed wiring board 10.
Solder the semiconductor module 30 to the printed wiring board 10.
It was implemented in
しかしながら上記従来の実装構造は、半導体モジュール
に長いリード端子を設けたもので、印刷配線板への実装
高さが大きくなるばかりでなく、信号伝搬距離が長くな
り、信号の高速化が阻害されるという問題点があった。However, in the conventional mounting structure described above, long lead terminals are provided on the semiconductor module, which not only increases the mounting height on the printed wiring board but also increases the signal propagation distance, which hinders high-speed signal transmission. There was a problem.
さらに、リード端子が長いことに起因して、信号線路の
インピーダンスのマンチングがとり難く、また隣接した
パターン間、リード端子間でノイズが授受されて、高速
信号の搬送性が劣るという問題点があった。Furthermore, due to the long lead terminals, it is difficult to munching the impedance of the signal line, and noise is exchanged between adjacent patterns and lead terminals, resulting in poor high-speed signal transport performance. Ta.
一方、モジュール基板にマウントした半導体部品が故障
して、半導体モジュールを交換する場合に、従来の構造
は、スルーホールに充填されている半田を加熱熔融して
、それぞれのリード端子５を引き抜いて、半導体モジュ
ールを取り外さねばならない。On the other hand, when a semiconductor component mounted on a module board breaks down and the semiconductor module is replaced, the conventional structure heats and melts the solder filled in the through holes, pulls out each lead terminal 5, and then replaces the semiconductor module. The semiconductor module must be removed.
即ち、従来構造は半導体モジュールの保守作業が容易で
ないという問題点があった。That is, the conventional structure has a problem in that maintenance work for the semiconductor module is not easy.
本発明はこのような点に鑑みて創作されたもので、実装
高さが低く小形で、また信号の高速化が促進され、高速
信号の搬送性が良好であって、且つ保守作業が容易な、
半導体モジュールの実装構造を提供することを目的とし
ている。The present invention was created in view of these points, and has a low mounting height and small size, promotes high-speed signals, has good high-speed signal transportability, and is easy to maintain. ,
The purpose is to provide a mounting structure for semiconductor modules.
上記の目的を達成するために本発明は、第１図に例示し
たように、上面から４側壁にかけてパターンを並列に形
成したモジュール基板２の上面に、半導体部品３を表面
実装して、半導体モジュール１を構成する。In order to achieve the above object, the present invention, as illustrated in FIG. 1.
印刷配線板ｌＯの所望の個所に、モジュール基板２に相
似で、それよりも所望に大きい、半導体モジュール１を
嵌挿する角孔１２を設ける。A square hole 12, similar to the module substrate 2 and desirably larger than the module substrate 2, into which the semiconductor module 1 is inserted is provided at a desired location on the printed wiring board IO.
弾性ある金属を加工してほぼ弓形の接触子部と、接触子
部の上部に設けた直線状の上辺部とでばね端子１５を構
成する。そして、接触子部が角孔１２の内壁に配列する
ように、上辺部を別記線板１０の上面に配列したパター
ンの端末に半田付けして、ばね端子１５を印刷配線板１
０に装着する。The spring terminal 15 is formed by processing an elastic metal into a substantially arcuate contact portion and a linear upper side portion provided on the top of the contact portion. Then, the spring terminals 15 are attached to the printed wiring board 1 by soldering the upper side portions to the terminals of the pattern arranged on the upper surface of the separate wiring board 10 so that the contact portions are arranged on the inner wall of the square hole 12.
Attach to 0.
かかる後に、半導体モジュール１を角孔１２に嵌挿し、
半導体モジュール１のそれぞれのパターンの側壁に設け
た部分を、ばね端子１５に弾接接続する構成とする。After this, the semiconductor module 1 is inserted into the square hole 12,
The structure is such that the portions provided on the side walls of each pattern of the semiconductor module 1 are elastically connected to the spring terminals 15.
また、請求項２の発明は、上記のモジュール基板２に形
成する信号パターン４−１のそれぞれの両側に、近接し
て並行にアースパターン４−２を、設けた構成としたも
のである。Further, the invention according to claim 2 has a configuration in which ground patterns 4-2 are provided in parallel and close to each side of each signal pattern 4-1 formed on the module board 2.
上述のように、印刷配線板ｌＯの角孔１２に、半導体モ
ジュールｌを嵌め込んであるので、半導体モジュール１
の実装高さが非常に低（なり、印刷配線板装置全体の薄
型化を推進することができる。As mentioned above, since the semiconductor module l is fitted into the square hole 12 of the printed wiring board lO, the semiconductor module 1
The mounting height of the board is extremely low, making it possible to make the entire printed wiring board device thinner.
また、モジュール基板２のパターンと印刷配線板１０の
パターンとが、ほぼ同一平面上になっていて、接続線路
長が短いので、信号の伝達時間が短縮され、信号の高速
化が促進される。Further, since the pattern on the module board 2 and the pattern on the printed wiring board 10 are substantially on the same plane and the length of the connection line is short, the signal transmission time is shortened and the speed of the signal is promoted.
また半導体モジュール１のパターンと印刷配線板ｌＯの
パターンとの接続部の距離が短いので、インピーダンス
の整合がとれ易くて、高速信号の搬送性が向上する。Further, since the distance between the connection portion between the pattern of the semiconductor module 1 and the pattern of the printed wiring board IO is short, impedance matching can be easily achieved, and high-speed signal transportability is improved.
一方、半導体モジュール１を印刷配線板１０の角孔１２
に嵌挿した実装構造であって、半田付は等して固着して
ない。したがって、半導体モジュール１の着脱が容易で
、半導体モジュールの保守作業が容易である。On the other hand, the semiconductor module 1 is inserted into the square hole 12 of the printed wiring board 10.
It has a mounting structure that is inserted into the board, and the soldering is not fixed evenly. Therefore, it is easy to attach and detach the semiconductor module 1, and maintenance work for the semiconductor module is easy.
請求項２の発明は、モジュール基板２に形成する信号パ
ターン４−１のそれぞれの両側に、近接して並行にアー
スパターン４−２を設け、印刷配線板１０上のパターン
を含めて、総ての信号パターンの両側にアースパターン
を設けである。According to the second aspect of the invention, ground patterns 4-2 are provided adjacently and in parallel on both sides of each of the signal patterns 4-1 formed on the module board 2, and all of the signal patterns 4-1, including the patterns on the printed wiring board 10, are provided in parallel. A ground pattern is provided on both sides of the signal pattern.
即ち、ストリップ線路構成の信号線路であるので、請求
項２の発明は、パターン間のノイズの授受等が少なくて
、さらに高速信号の搬送性が向上する。That is, since the signal line has a strip line configuration, the invention according to claim 2 reduces the transmission and reception of noise between patterns, and further improves high-speed signal conveyance.
以下図を参照しながら、本発明を具体的に説明する。な
お、全図を通じて同一符号は同一対象物を示す。The present invention will be specifically described below with reference to the drawings. Note that the same reference numerals indicate the same objects throughout the figures.
第１図は本発明の一実施例の図で、（ａ）は斜視図、（
ｂ）は側断面図である。FIG. 1 shows an embodiment of the present invention, in which (a) is a perspective view and (a) is a perspective view;
b) is a side sectional view.
第１図において、半導体モジュール１は、例えばセラミ
ックスよりなる、小形で板厚が薄い角板状のモジュール
基板２の上面に、例えばＬＳＩ等の半導体部品３を表面
実装して構成されている。In FIG. 1, a semiconductor module 1 is constructed by surface-mounting a semiconductor component 3 such as an LSI on the upper surface of a small, thin, rectangular module substrate 2 made of, for example, ceramics.
モジュール基板２の上面からそれぞれの側壁にかけて、
半導体部品３を中心として放射状にパターンを形成しで
ある。From the top surface of the module board 2 to each side wall,
A pattern is formed radially around the semiconductor component 3.
これらのパターンは、それぞれの信号パターン４−１の
両側に、近接して並行にアースパターン４−２を設けて
、ストリップ線路構造としである。These patterns have a strip line structure in which ground patterns 4-2 are provided adjacently and in parallel on both sides of each signal pattern 4-1.
一方、印刷配線板ｌＯの所望の個所に、モジュール基板
２に相似で、それよりも所望に大きい、半導体モジュー
ル１を嵌挿する角孔１２を設け、印刷配線板１０の上面
の角孔１２の角縁部分に、半導体モジュール１のそれぞ
れの信号パターン４−１に対向して信号パターン１１−
１を、アースパターン４−２に対向してアースパターン
１１−２をそれぞれ印刷形成しである。On the other hand, a square hole 12 similar to the module substrate 2 and desirably larger than the module board 2 into which the semiconductor module 1 is inserted is provided at a desired location on the printed wiring board 10. A signal pattern 11- is provided on the corner edge portion, facing each signal pattern 4-1 of the semiconductor module 1.
1, a ground pattern 11-2 is printed and formed opposite to a ground pattern 4-2.
１５は、弾性ある金属、例えば燐青銅、アルミニウム等
を加工して金めつき等した、ほぼ弓形の接触子部と、接
触子部の上部に設けた直線状の上辺部とで構成されたば
ね端子である。Reference numeral 15 denotes a spring terminal made of an elastic metal such as phosphor bronze, aluminum, etc., processed and plated with gold, and composed of a substantially arcuate contact portion and a linear upper side portion provided on the top of the contact portion. It is.
ばね端子１５は、接触子部を角孔１２の内壁に配列させ
、その下端部を角孔１２の下側の角線部に設けた切込み
１６に、それぞれ係合させて左右方向の位置を規制して
いる。The spring terminals 15 have their contact parts arranged on the inner wall of the square hole 12, and their lower ends are engaged with the notches 16 provided in the lower square wire part of the square hole 12 to regulate the position in the left and right direction. are doing.
この状態でばね端子１５の上辺部を、それぞれの信号パ
ターン１１−１或いはアースパターン１１−２の端末に
、半田付けして固着し、印刷配線板１０に装着しである
。In this state, the upper side of the spring terminal 15 is soldered and fixed to the terminal of each signal pattern 11-1 or ground pattern 11-2, and then mounted on the printed wiring board 10.
２０は、絶縁板１例えば合成樹脂よりなる枠形の支持板
であって、その内枠寸法は、角孔１２に相似でそれより
も小さく、その外枠寸法は、角孔１２のよりも十分に大
きい。Reference numeral 20 denotes a frame-shaped support plate made of the insulating plate 1, for example, synthetic resin, and its inner frame size is similar to and smaller than the square hole 12, and its outer frame size is much larger than that of the square hole 12. big.
支持板２０の内枠を角孔１２に位置合わせし、印刷配線
板１０の底面に支持板２０を密着させ、その状態でリベ
ット２１を用いて、４隅を印刷配線板１０に固着させで
ある。The inner frame of the support plate 20 is aligned with the square hole 12, the support plate 20 is brought into close contact with the bottom surface of the printed wiring board 10, and in this state, the four corners are fixed to the printed wiring board 10 using rivets 21. .
上述のように構成した印刷配線板１０の角孔１２に、導
体モジュール１を嵌挿して、半導体モジュール１のそれ
ぞれのパターンの側壁に設けた部分を、ばね端子１５に
弾接させている。The conductor module 1 is inserted into the square hole 12 of the printed wiring board 10 configured as described above, and the portion provided on the side wall of each pattern of the semiconductor module 1 is brought into elastic contact with the spring terminal 15.
したがって、半導体モジュール１の信号パターン４−１
が、印刷配線板１０の対応する信号パターン１１−１に
、半導体モジュール１のアースパターン４−２が、印刷
配線板１０の対応するアースパターン１１−２に、それ
ぞれ接続している。Therefore, the signal pattern 4-1 of the semiconductor module 1
However, the ground pattern 4-2 of the semiconductor module 1 is connected to the corresponding signal pattern 11-1 of the printed wiring board 10, and the ground pattern 4-2 of the semiconductor module 1 is connected to the corresponding ground pattern 11-2 of the printed wiring board 10, respectively.
なお、この際、モジュール基板２の底面が支持板２０の
上面に当接しているので、半導体モジュール１の印刷配
線板１０に対する上下方向の位置が所定に定まる。また
、モジュール基板２は４つノ側壁は、それぞれ等しい数
のばね端子１５により押圧されている。Note that at this time, since the bottom surface of the module substrate 2 is in contact with the top surface of the support plate 20, the vertical position of the semiconductor module 1 with respect to the printed wiring board 10 is determined in a predetermined manner. Further, the four side walls of the module board 2 are pressed by an equal number of spring terminals 15, respectively.
したがって、印刷配線板１０の振動等により半導体モジ
ュール１が、印刷配線板１０から脱落する恐れがない。Therefore, there is no fear that semiconductor module 1 will fall off from printed wiring board 10 due to vibration of printed wiring board 10 or the like.
また、半導体モジュール１がずれる恐れがないので、ば
ね端子１５と信号パターン４−１．或いはアースパター
ン４−２とが接触不良となる恐れが非常に少ない。Furthermore, since there is no risk of the semiconductor module 1 being displaced, the spring terminal 15 and the signal pattern 4-1. Alternatively, there is very little risk of poor contact with the ground pattern 4-2.
上述のように本発明は、半導体モジュール１を印刷配線
板１０の角孔１２に嵌挿したもので、半田付は等して固
着してないので、半導体モジュール１の着脱が容易で、
半導体モジュールの保守作業が容易である。As described above, in the present invention, the semiconductor module 1 is inserted into the square hole 12 of the printed wiring board 10, and since the semiconductor module 1 is not fixed by soldering, it is easy to attach and detach the semiconductor module 1.
Maintenance work for semiconductor modules is easy.
また、半導体モジュール１の全体が、角孔１２内に殆ど
嵌め込めれているので、半導体モジュール１の実装高さ
が非常に低くなり、印刷配線板装置全体の薄型化が推進
させる。Moreover, since the entire semiconductor module 1 is almost entirely fitted into the square hole 12, the mounting height of the semiconductor module 1 is extremely low, which promotes thinning of the entire printed wiring board device.
一方、モジュール基板２のパターンと印刷配線板ＩＯの
パターンとが、ほぼ同一平面上になっていて、接続線路
長が短いので信号の伝達時間が短縮され、高速化が促進
される。On the other hand, since the pattern of the module board 2 and the pattern of the printed wiring board IO are substantially on the same plane and the length of the connection line is short, the signal transmission time is shortened and high speed is promoted.
また、半導体モジュール１のパターンと印刷配線板１０
のパターンとの接続部の距離が短く、且つ信号パターン
がストリップ線路構造であるので、整合がとれ易く、ノ
イズの授受が少な（て、高速信号の搬送性が向上する。In addition, the pattern of the semiconductor module 1 and the printed wiring board 10
Since the distance between the connecting portion and the pattern is short, and the signal pattern has a strip line structure, matching is easily achieved, and there is less noise exchange (thereby improving high-speed signal transportability).
以上説明したように本発明は、印刷配線板に設けた角孔
に、半導体モジュールを嵌め込むように構成した実装構
造であって、実装高さが低く小形であり、また信号の高
速化が促進され、高速信号の搬送性が良好で、且つ保守
作業が容易である等、実用上で優れた効果がある。As explained above, the present invention is a mounting structure in which a semiconductor module is fitted into a square hole provided in a printed wiring board, which has a low mounting height and is compact, and which facilitates high-speed signal transmission. It has excellent practical effects, such as good high-speed signal conveyance and easy maintenance work.
第１図は本発明の一実施例の図で、
（ａ）は斜視図、
（ｂ）は側断面図、
第２図は従来例の側断面図である。
図において、
ｌ、３０は半導体モジュール、
２はモジエール基板、
３は半導体部品、
４−Ｌｌｌ−１は信号パターン、
４−２．１１−２はアースパターン、
５はリード端子、
１０は印刷配線板、
１２は角孔、
１５はばね端子、
２０は支持板をそれぞれ示す。
工半導イ未己シェル
ノ
（α）
″′″′”サ イ斤１ｍＩ］Ｉ！≧Ｔ（′０）
ノと、’ｆＭ’Ｆ４ａ）＠方１イｉ゛５ ｐ ｆ、
旦ρ−手す１イ罎くモ、う互７Ｉし
名声１ＪＬイク・ｊｆ）イ貝す旨ずＹ代ロレＪ寥２図FIG. 1 is a diagram of one embodiment of the present invention, (a) is a perspective view, (b) is a side sectional view, and FIG. 2 is a side sectional view of a conventional example. In the figure, l, 30 are semiconductor modules, 2 is a module board, 3 is a semiconductor component, 4-Lll-1 is a signal pattern, 4-2.11-2 is a ground pattern, 5 is a lead terminal, 10 is a printed wiring board , 12 is a square hole, 15 is a spring terminal, and 20 is a support plate. Techniques and semiconductors are unknown (α) ″′″′” Sai 1mI] I!≧T('0) ノ,'fM'F4a) @方1ii゛5 p f,
Danrho - hand 1 I'm going to give you another 7 I and fame 1 JL Iku jf) I'm going to have a good time Y's Lore J's 2
Claims (2)
たモジュール基板（２）の上面に、半導体部品（３）を
表面実装して構成した半導体モジュール（１）と、 印刷配線板（１０）の所望の個所に設けた、該モジュー
ル基板（２）に相似でそれよりも所望に大きい角孔（１
２）と、 弾性ある金属片よりなり、上辺部が該印刷配線板（１０
）の上面に配列したパターンの端末に半田付けされて該
印刷配線板（１０）に装着され、ほぼ弓形の接触子部が
該角孔（１２）の内壁に配列されてなる、ばね端子（１
５）とを具備し、 該半導体モジュール（１）を該角孔（１２）に嵌挿し、
該半導体モジュール（１）のそれぞれのパターンを、対
応する該ばね端子（１５）に弾接接続するよう、構成し
たことを特徴とする半導体モジュールの実装構造。(1) Desired semiconductor module (1) configured by surface mounting semiconductor components (3) on the upper surface of a module substrate (2) on which patterns are formed in parallel from the upper surface to the four side walls, and the printed wiring board (10). A square hole (1) similar to and desirably larger than the module board (2) is provided at the location of the module board (2).
2) and an elastic metal piece, the upper side of which is connected to the printed wiring board (10
) is attached to the printed wiring board (10) by soldering to the terminals of the pattern arranged on the upper surface of the spring terminal (1), and has a substantially arcuate contact portion arranged on the inner wall of the square hole (12).
5), inserting the semiconductor module (1) into the square hole (12),
A semiconductor module mounting structure characterized in that each pattern of the semiconductor module (1) is configured to be elastically connected to the corresponding spring terminal (15).
たそれぞれの信号パターン（４−１）の両側に、近接し
て並行にアースパターン（４−２）を、設けたことを特
徴とする半導体モジュールの実装構造。(2) A ground pattern (4-2) is provided adjacently and in parallel on both sides of each signal pattern (4-1) formed on the module board (2) according to claim 1. Mounting structure of semiconductor module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12086488A JPH01290287A (en) | 1988-05-18 | 1988-05-18 | Mounting structure of semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12086488A JPH01290287A (en) | 1988-05-18 | 1988-05-18 | Mounting structure of semiconductor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01290287A true JPH01290287A (en) | 1989-11-22 |
Family
ID=14796843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12086488A Pending JPH01290287A (en) | 1988-05-18 | 1988-05-18 | Mounting structure of semiconductor module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01290287A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008186929A (en) * | 2007-01-29 | 2008-08-14 | Matsushita Electric Ind Co Ltd | Circuit board and electronic device |
| JP2009158552A (en) * | 2007-12-25 | 2009-07-16 | Hosiden Corp | Attaching structure of ptc thermistor |
| CN103404242A (en) * | 2011-03-09 | 2013-11-20 | 大陆汽车有限责任公司 | Assembly having substrate, SMD component, and lead frame part |
| JP2019023987A (en) * | 2017-07-25 | 2019-02-14 | タイコエレクトロニクスジャパン合同会社 | Substrate packaging structure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6112266B2 (en) * | 1978-05-08 | 1986-04-07 | Matsushita Electric Ind Co Ltd |
-
1988
- 1988-05-18 JP JP12086488A patent/JPH01290287A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6112266B2 (en) * | 1978-05-08 | 1986-04-07 | Matsushita Electric Ind Co Ltd |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008186929A (en) * | 2007-01-29 | 2008-08-14 | Matsushita Electric Ind Co Ltd | Circuit board and electronic device |
| JP2009158552A (en) * | 2007-12-25 | 2009-07-16 | Hosiden Corp | Attaching structure of ptc thermistor |
| CN103404242A (en) * | 2011-03-09 | 2013-11-20 | 大陆汽车有限责任公司 | Assembly having substrate, SMD component, and lead frame part |
| US9564789B2 (en) | 2011-03-09 | 2017-02-07 | Continental Automotive Gmbh | Assembly having a substrate, an SMD component, and a lead frame part |
| JP2019023987A (en) * | 2017-07-25 | 2019-02-14 | タイコエレクトロニクスジャパン合同会社 | Substrate packaging structure |
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