JP2008186929A - Circuit board and electronic device - Google Patents

Circuit board and electronic device Download PDF

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Publication number
JP2008186929A
JP2008186929A JP2007017991A JP2007017991A JP2008186929A JP 2008186929 A JP2008186929 A JP 2008186929A JP 2007017991 A JP2007017991 A JP 2007017991A JP 2007017991 A JP2007017991 A JP 2007017991A JP 2008186929 A JP2008186929 A JP 2008186929A
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Prior art keywords
holder
circuit board
hole
electronic component
display unit
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JP4979397B2 (en
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Mitsuhisa Kawakami
満久 川上
Shotaro Nagaike
昭太郎 永池
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Mounting Components In General For Electric Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board and an electronic device which can be reduced in thickness. <P>SOLUTION: The circuit board 20 includes a base material 24 having a through-hole 25, a holder 27 which is mounted on a first surface 24A of the base material 24 to traverse the through-hole 25 to come out on a second surface 24B opposite to the first surface 24A via the through-hole 25, and a subdisplay portion 22 which is held on the holder 27 to be placed inside the through-hole 25. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、基材に電子部品が実装された回路基板および電子機器に関する。   The present invention relates to a circuit board and an electronic device in which an electronic component is mounted on a base material.

図１３に示すように、携帯電話等の電子機器２００は、筐体２０１内に収容された回路基板２０２を備え、筐体２０１の主表示開口２０１Ａに回路基板２０２の主表示部２０３が主クッション材２０４を介して対向され、筐体２０１の副表示開口２０１Ｂに回路基板２０２の副表示部２０６が副クッション材２０７を介して対向されている。   As shown in FIG. 13, an electronic device 200 such as a mobile phone includes a circuit board 202 accommodated in a housing 201, and a main display portion 203 of the circuit board 202 is a main cushion in a main display opening 201 </ b> A of the housing 201. The sub-display portion 206 of the circuit board 202 is opposed to the sub-display opening 201 </ b> B of the housing 201 via the sub-cushion material 207.

回路基板２０２は、基材２０８に実装された電子部品２０９を囲むように筒状の枠体２１０が基材２０８の接続端子２１１にハンダを介して接続されている。
枠体２１０の内部に充填された充填剤２１２が固化した後、枠体２１０にシールドカバー２１３が被せられる。シールドカバー２１３には、主表示部２０３（ホルダ２０３Ａおよび液晶本体２０３Ｂ）が固定されている。
さらに、基材２０８の裏面に副表示部２０６（ホルダ２０６Ａおよび液晶本体２０６Ｂ）が設けられている。 In the circuit board 202, a cylindrical frame 210 is connected to the connection terminal 211 of the base material 208 via solder so as to surround the electronic component 209 mounted on the base material 208.
After the filler 212 filled in the frame 210 is solidified, the shield cover 213 is put on the frame 210. The main display unit 203 (the holder 203A and the liquid crystal main body 203B) is fixed to the shield cover 213.
Further, a sub display unit 206 (a holder 206A and a liquid crystal main body 206B) is provided on the back surface of the substrate 208.

この回路基板２０２は、枠体２１０の頭頂部２１０Ａの同一面まで充填剤２１２の天面２１２Ａが達するように、あらかじめ充填剤２１２の充填量が定められている。
従って、充填剤２１２が固化した後、充填剤２１２の天面２１２Ａがシールドカバー２１３を介して主表示部２０３を支持する。 In this circuit board 202, the filling amount of the filler 212 is determined in advance so that the top surface 212A of the filler 212 reaches the same surface of the top 210A of the frame 210.
Therefore, after the filler 212 is solidified, the top surface 212A of the filler 212 supports the main display unit 203 through the shield cover 213.

ところで、回路基板のなかには、基材に設けたホルダに表示部を支持するように構成したものがある（例えば、特許文献１参照）。
特開平２００１−２７２６６０号公報 By the way, some circuit boards are configured to support a display unit on a holder provided on a base material (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 2001-272660

近年では、携帯性や使い勝手性等の観点から、電子機器の薄型化が求められている。
しかしながら、図１３に示す電子機器２００の場合、特許文献１のように、基材の表裏にそれぞれホルダを介して主表示部２０３および副表示部２０６を配置すると、薄型化をする上で不利になる。
なお、主表示部２０３のみを備えた電子機器の場合でも、特許文献１のように、基材にホルダを介して主表示部を配置すると、薄型化をする上で不利になる。 In recent years, there has been a demand for thinner electronic devices from the viewpoints of portability and usability.
However, in the case of the electronic device 200 shown in FIG. 13, if the main display unit 203 and the sub display unit 206 are arranged on the front and back sides of the base material via holders as in Patent Document 1, it is disadvantageous in reducing the thickness. Become.
Even in the case of an electronic apparatus having only the main display unit 203, disposing the main display unit on a base material via a holder as in Patent Document 1 is disadvantageous in reducing the thickness.

本発明は、前述した課題を解決するためになされたもので、その目的は、薄型化できる回路基板および電子機器を提供することにある。   SUMMARY An advantage of some aspects of the invention is that it provides a circuit board and an electronic device that can be reduced in thickness.

本発明の回路基板は、第１の面と、前記第１の面と反対側の第２の面と、前記第１の面と前記第２の面との間を貫通する貫通孔とを有する基材と、前記第１の面に実装され、前記貫通孔を横切るホルダと、前記ホルダに支持され、前記貫通孔の内部に配置される第１の電子部品と、を有することを特徴とする。   The circuit board according to the present invention includes a first surface, a second surface opposite to the first surface, and a through hole penetrating between the first surface and the second surface. A base material, a holder mounted on the first surface and traversing the through hole, and a first electronic component supported by the holder and disposed inside the through hole. .

このような本発明においては、基材の貫通孔内に配置された第１の電子部品がホルダに支持されるため、回路基板の全体厚みとして基材の厚みが加算されず、従来に比較して回路基板を薄型化できる。
さらに、本発明においては、表示部等の第１の電子部品がホルダに支持されているので、第１の電子部品に加えられた外力が例えばホルダの反対側に配置された他の電子部品に影響せず、割れ等の破損が生じ難くできる。 In the present invention, since the first electronic component arranged in the through hole of the base material is supported by the holder, the thickness of the base material is not added as the entire thickness of the circuit board, and compared with the conventional case. The circuit board can be made thinner.
Furthermore, in the present invention, since the first electronic component such as the display unit is supported by the holder, an external force applied to the first electronic component is applied to, for example, another electronic component disposed on the opposite side of the holder. There is no effect, and breakage such as cracks can hardly occur.

また、本発明は、前記第１の電子部品を支持するために前記ホルダに設けられた支持面と、前記ホルダに支持されるために前記第１の電子部品に設けられた被支持面とを有し、前記支持面と前記被支持面とが接触していることを特徴とする。
ここで、支持面および被支持面としては、平坦面、円弧面、球面等を例示できる。 The present invention also includes a support surface provided on the holder for supporting the first electronic component, and a supported surface provided on the first electronic component for being supported by the holder. And the support surface and the supported surface are in contact with each other.
Here, examples of the support surface and the supported surface include a flat surface, an arc surface, and a spherical surface.

このような本発明においては、支持面と被支持面とが接触しているため、ホルダが第１の電子部品を安定的に支持できるとともに、第１の電子部品に加えられた外力をホルダの広範囲に亘って分散でき、これにより局所的に外力が伝達されることにより第１の電子部品に破損等の悪影響が生じることを防止できる。   In the present invention, since the support surface and the supported surface are in contact with each other, the holder can stably support the first electronic component, and external force applied to the first electronic component can be applied to the holder. It is possible to disperse over a wide range, thereby preventing adverse effects such as breakage on the first electronic component due to local transmission of external force.

さらに、本発明は、前記ホルダが、前記第１の面に対して交差する面を有する壁部と、前記壁部に連結されて前記第１の面に対して略平行な面を有する底部を有していることを特徴とする。   Further, according to the present invention, the holder includes a wall portion having a surface intersecting the first surface, and a bottom portion having a surface connected to the wall portion and substantially parallel to the first surface. It is characterized by having.

このような本発明においては、ホルダが壁部および底部を有する略箱形状であるため、基材の厚み寸法よりも嵩高の第１の電子部品も第２の面から突出しないように支持できる。   In the present invention, since the holder has a substantially box shape having a wall portion and a bottom portion, the first electronic component bulky than the thickness of the base material can be supported so as not to protrude from the second surface.

ところで、基材に貫通孔を設けた後、貫通孔の内面が若干凹凸状に形成されていることが考えられる。
このため、第１の電子部品をホルダに支持させるにあたって、第１の電子部品を貫通孔に通過させる際に、第１の電子部品が貫通孔の内面に摺接して、基材の（極めて微細な）欠片を脱落させ、ホルダ内に落下させる可能性がある。 By the way, after providing a through-hole in a base material, it is possible that the inner surface of a through-hole is formed in some uneven | corrugated shape.
For this reason, when the first electronic component is supported by the holder, when the first electronic component is passed through the through-hole, the first electronic component is brought into sliding contact with the inner surface of the through-hole, and the (very fine) There is a possibility that the piece will fall off and fall into the holder.

この欠片は、エアガン等を用いて吹き飛ばそうとしても、ホルダが袋小路になっていると、ホルダ内で浮遊するだけで除去し難い。
そして、例えば第１の電子部品が液晶表示装置である場合、ホルダ内に残留した欠片は、回路基板（電子機器）の使用中に、液晶表示装置の表面に付着して外観性が損なわれる虞がある。 Even if an attempt is made to blow off this piece using an air gun or the like, if the holder is a bag path, it will only float in the holder and is difficult to remove.
For example, when the first electronic component is a liquid crystal display device, the fragments remaining in the holder may adhere to the surface of the liquid crystal display device during use of the circuit board (electronic device) and the appearance may be impaired. There is.

これに対して、本発明においては、ホルダの底部に連通孔が設けられているため、エアガンを用いて高圧気体をホルダ内に噴射すれば、ホルダ内に落下したカケラが連通孔を通過して外部に排除され、電子機器の使用中に液晶表示装置等の電子部品の表面に付着して外観性が損なわれる虞がない。   On the other hand, in the present invention, since the communication hole is provided in the bottom of the holder, if high pressure gas is injected into the holder using an air gun, the fragile that has fallen into the holder passes through the communication hole. There is no risk that the external appearance is deteriorated by being removed to the outside and adhering to the surface of an electronic component such as a liquid crystal display device during use of the electronic device.

さらに、本発明は、前記ホルダに第２の電子部品が接していることを特徴とする。   Furthermore, the present invention is characterized in that a second electronic component is in contact with the holder.

本発明においては、ホルダに第２の電子部品を接しているため、例えば電子機器の筐体の表裏側に液晶表示装置等の第２の電子部品を配置しても、回路基板の薄型化が図れる。   In the present invention, since the second electronic component is in contact with the holder, the circuit board can be thinned even if the second electronic component such as a liquid crystal display device is arranged on the front and back sides of the casing of the electronic device. I can plan.

また、本発明は、前記第１の電子部品と、前記貫通孔の内面および前記ホルダとのうちの少なくとも一方との間に弾性部材が介装されていることを特徴とする。
ここで、弾性部材としては、例えば第１の電子部品と一体的に形成したバネ部材や、あるいは第１の電子部品とは別途のスポンジ等を例示できる。 The present invention is characterized in that an elastic member is interposed between the first electronic component and at least one of the inner surface of the through hole and the holder.
Here, examples of the elastic member include a spring member formed integrally with the first electronic component, or a sponge separately from the first electronic component.

このような本発明においては、第１の電子部品と貫通孔の内面との間、および第１の電子部品とホルダとの間のうち、少なくとも一方、あるいは双方に弾性部材が介装されているため、振動や衝撃が弾性部材により吸収あるいは緩和され、第１の電子部品の破損を防止できる。   In the present invention, an elastic member is interposed between at least one of the first electronic component and the inner surface of the through hole and between the first electronic component and the holder, or both. Therefore, vibrations and shocks are absorbed or relaxed by the elastic member, and damage to the first electronic component can be prevented.

さらに、本発明は、前記第１の電子部品と、前記貫通孔の内面および前記ホルダとのうちの少なくとも一方との間に介装され、前記第１の電子部品と、前記貫通孔の内面および前記ホルダとのうちのいずれかに対して線接触する線接触部材を有することを特徴とする。   Furthermore, the present invention is interposed between the first electronic component and at least one of the inner surface of the through hole and the holder, and the first electronic component, the inner surface of the through hole, and It has a line contact member which carries out a line contact with either of the said holders.

このような本発明においては、第１の電子部品と貫通孔の内面との間、および第１の電子部品とホルダとの間のうち、少なくとも一方、あるいは双方に線接触部材が設けられているため、線接触部材の先端が座屈変形することにより振動や衝撃が吸収あるいは緩和され、第１の電子部品の破損を防止できる。   In the present invention, the line contact member is provided between at least one of the first electronic component and the inner surface of the through hole and between the first electronic component and the holder, or both. Therefore, when the tip of the line contact member buckles and deforms, vibration and impact are absorbed or alleviated, and damage to the first electronic component can be prevented.

また、本発明の電子機器は、前記回路基板を用いたことを特徴とする。   Moreover, an electronic apparatus according to the present invention is characterized by using the circuit board.

前記回路基板を、従来のものと比較して薄型化できるので、この回路基板を電子機器に用いることで、電子機器の薄型化が図れる。   Since the circuit board can be reduced in thickness as compared with the conventional circuit board, the electronic apparatus can be reduced in thickness by using the circuit board in the electronic apparatus.

本発明の回路基板および電子機器によれば、基材の貫通孔内に配置された電子部品がホルダに支持されているため、回路基板や電子機器の薄型化が図れるという効果を有する。   According to the circuit board and the electronic device of the present invention, since the electronic component disposed in the through hole of the base material is supported by the holder, the circuit board and the electronic device can be thinned.

（第１実施形態）
以下、本発明に係る実施形態を図面に基づいて詳細に説明する。
図１に示すように、電子機器１０は、筐体１１内に収容された第１実施形態の回路基板２０を備え、筐体１１の表面１２に主表示開口１２Ａが形成され、筐体１１の裏面１３に副表示開口１３Ａが形成されている。
副表示開口１３Ａに、回路基板２０の第１の電子部品である副表示部（サブＬＣＤ）２２が副クッション材１６を介して対向し、主表示開口１２Ａに、回路基板２０の第２の電子部品である主表示部（メインＬＣＤ）２１が主クッション材１５を介して対向している。 (First embodiment)
DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.
As shown in FIG. 1, the electronic device 10 includes the circuit board 20 of the first embodiment housed in a housing 11, and a main display opening 12 </ b> A is formed on the surface 12 of the housing 11. A sub display opening 13 </ b> A is formed on the back surface 13.
A sub-display portion (sub-LCD) 22 as a first electronic component of the circuit board 20 faces the sub-display opening 13A via the sub-cushion material 16, and second electronic components of the circuit board 20 are opposed to the main display opening 12A. A main display portion (main LCD) 21 that is a component is opposed to the main cushion material 15.

第１実施形態の回路基板２０は、略矩形状の貫通孔２５が設けられた基材２４と、基材２４の第１の面２４Ａに実装されたホルダ２７と、ホルダ２７に支持されて貫通孔２５の内部に配置された副表示部（第１の電子部品）２２と、基材２４に実装された複数の電子部品２９と、電子部品２９を囲むように基材２４の第１の面２４Ａ側に接合された枠体３１と、基材２４と電子部品２９と枠体３１とに接する充填剤３３と、枠体３１に被せられたシールドカバー３４と、シールドカバー３４に固定された主表示部（第２の電子部品）２１とを有する。   The circuit board 20 of the first embodiment includes a base material 24 provided with a substantially rectangular through hole 25, a holder 27 mounted on the first surface 24 </ b> A of the base material 24, and is supported by the holder 27 and passes therethrough. A sub-display unit (first electronic component) 22 disposed inside the hole 25, a plurality of electronic components 29 mounted on the base member 24, and a first surface of the base member 24 so as to surround the electronic component 29 A frame 31 joined to the 24A side, a filler 33 in contact with the base member 24, the electronic component 29, and the frame 31, a shield cover 34 placed on the frame 31, and a main body fixed to the shield cover 34. And a display unit (second electronic component) 21.

基材２４に設けられた貫通孔２５は、基材２４の第２の面２４Ｂ側から第１の面２４Ａ側に副表示部２２を貫通可能とするとともに、副表示部２２の一部を収容可能とするように、副表示部２２の外形より一回り大きく形成された開口である。   The through hole 25 provided in the base material 24 allows the sub display portion 22 to penetrate from the second surface 24B side of the base material 24 to the first surface 24A side and accommodates a part of the sub display portion 22. The opening is formed to be slightly larger than the outer shape of the sub display unit 22 so as to be possible.

ホルダ２７は、略矩形状に形成された壁部３５と、壁部３５の一端に形成された底部（支持面）３６と、壁部３５の他端に形成されたフランジ３７とを有し、フランジ３７側に収容空間３８の開口が形成された金属製の箱形部材である。
壁部３５は、第１の面２４Ａに対して交差する面を有する第１壁部３５Ａ、第２壁部３５Ｂ、第３壁部３５Ｃおよび第４壁部３５Ｄを有する。底部３６は、壁部３５に連結されて第１の面２４Ａに対して略平行な面を有する。 The holder 27 has a wall portion 35 formed in a substantially rectangular shape, a bottom portion (support surface) 36 formed at one end of the wall portion 35, and a flange 37 formed at the other end of the wall portion 35, This is a metal box-shaped member in which an opening of the accommodation space 38 is formed on the flange 37 side.
The wall portion 35 includes a first wall portion 35A, a second wall portion 35B, a third wall portion 35C, and a fourth wall portion 35D that have surfaces that intersect the first surface 24A. The bottom portion 36 is connected to the wall portion 35 and has a surface substantially parallel to the first surface 24A.

壁部３５は、第１壁部３５Ａ、第２壁部３５Ｂ、第３壁部３５Ｃおよび第４壁部３５Ｄで略矩形状に形成され、第１壁部３５Ａの内面に粘着テープ３９が貼り付けられている。
粘着テープ３９は欠片４１（図１参照）を付着するものである。 The wall portion 35 is formed in a substantially rectangular shape by the first wall portion 35A, the second wall portion 35B, the third wall portion 35C, and the fourth wall portion 35D, and the adhesive tape 39 is attached to the inner surface of the first wall portion 35A. It has been.
The adhesive tape 39 attaches the piece 41 (see FIG. 1).

ここで、基材２４に貫通孔２５を設ける際に、貫通孔２５の内面が若干凹凸状に形成されることが考えられる。
このため、副表示部２２をホルダ２７に支持させるにあたって、副表示部２２が貫通孔２５を通過する際に、副表示部２２が貫通孔２５の内面に摺接して、基材２４の（極めて微細な）欠片４１（図１参照）を脱落させ、ホルダ２７内に落下させる可能性がある。 Here, when providing the through-hole 25 in the base material 24, it is possible that the inner surface of the through-hole 25 is formed in a slightly uneven shape.
For this reason, when the sub display unit 22 is supported by the holder 27, when the sub display unit 22 passes through the through hole 25, the sub display unit 22 is in sliding contact with the inner surface of the through hole 25, There is a possibility that the fine piece 41 (see FIG. 1) is dropped and dropped into the holder 27.

この欠片４１は、エアガン等で吹き飛ばそうとしても、ホルダ２７が袋小路になっていると、ホルダ２７内で浮遊するだけで除去し難い。
ホルダ２７内に残留した欠片４１は、回路基板２０（電子機器１０）の使用中に、副表示部２２の表面に付着して外観性が損なわれる虞がある。 Even if the piece 41 is intended to be blown away by an air gun or the like, if the holder 27 is in a bag path, it is only floating in the holder 27 and difficult to remove.
The piece 41 remaining in the holder 27 may adhere to the surface of the sub-display unit 22 during use of the circuit board 20 (electronic device 10), and the appearance may be impaired.

そこで、第１壁部３５Ａの内面に粘着テープ３９を貼り付けた。貫通孔２５の内面から脱落した欠片４１が粘着テープ３９に付着され、電子機器１０の使用中に副表示部２２の表面に付着して外観性が損なわれる虞がない。   Therefore, an adhesive tape 39 is attached to the inner surface of the first wall portion 35A. The chip 41 dropped from the inner surface of the through-hole 25 is attached to the adhesive tape 39, and there is no possibility that the appearance is impaired by attaching to the surface of the sub-display unit 22 during use of the electronic device 10.

支持面３６は、壁部３５に連結されて第１の面２４Ａに対して略平行に形成され、副表示部２２の被支持面４２と面接触されている。
副表示部２２の被支持面４２を支持面３６に面接触させる理由については後述する。 The support surface 36 is connected to the wall portion 35, is formed substantially parallel to the first surface 24 </ b> A, and is in surface contact with the supported surface 42 of the sub display unit 22.
The reason why the supported surface 42 of the sub-display unit 22 is in surface contact with the support surface 36 will be described later.

フランジ３７は、壁部３５の他端から外側に向けて張り出された張出片である。
ホルダ２７がマウンタ使用で載置され、フランジ３７がリフローにより基材２４の第１の面２４Ａに実装される。
ホルダ２７は、基材２４の第１の面２４Ａに実装された状態において、収容空間３８が貫通孔２５を横切り、かつ、貫通孔２５から第１の面２４Ａと反対側の第２の面２４Ｂ側に露呈するように形成されている。 The flange 37 is a protruding piece that protrudes outward from the other end of the wall portion 35.
The holder 27 is mounted by using a mounter, and the flange 37 is mounted on the first surface 24A of the substrate 24 by reflow.
In the state where the holder 27 is mounted on the first surface 24A of the base material 24, the accommodation space 38 crosses the through hole 25, and the second surface 24B opposite to the first surface 24A from the through hole 25. It is formed to be exposed to the side.

さらに、ホルダ２７で副表示部２２を電子部品２９と仕切ることで、副表示部２２を駆動するためのドライバチップ（図示せず）から発生されたノイズ源を遮断できる。
これにより、ドライバチップから発生されたノイズ源が電子部品２９に悪影響を及ぼすことを防止できる。
なお、通常の表示部は、表示部を駆動するためのドライバチップが近傍に設けられている。 Further, by separating the sub display unit 22 from the electronic component 29 by the holder 27, a noise source generated from a driver chip (not shown) for driving the sub display unit 22 can be blocked.
Thereby, it is possible to prevent the noise source generated from the driver chip from adversely affecting the electronic component 29.
Note that a normal display unit is provided with a driver chip in the vicinity for driving the display unit.

副表示部２２は、ホルダ２７の収容空間３８に収容される副ホルダ２２Ａと、副ホルダ２２Ａに収容される副液晶本体２２Ｂとからなる。
副ホルダ２２Ａは、副表示部２２および貫通孔２５の第１内面２５Ａ間に介装された弾性部材４３と、副表示部２２および貫通孔２５の第２内面２５Ｂ間に介装された線接触部材４４と、ホルダ２７の支持面３６に接する被支持面４２とを有する。 The sub display unit 22 includes a sub holder 22A housed in the housing space 38 of the holder 27, and a sub liquid crystal main body 22B housed in the sub holder 22A.
The sub-holder 22A has a line contact interposed between the elastic member 43 interposed between the sub-display portion 22 and the first inner surface 25A of the through-hole 25, and the second inner surface 25B of the sub-display portion 22 and the through-hole 25. It has a member 44 and a supported surface 42 in contact with the support surface 36 of the holder 27.

弾性部材４３は、副ホルダ２２Ａの壁面のうち、第１壁面２２Ｃに一体成形された一対の突片である。弾性部材４３は、中央に向けて傾斜するように形成され、先端部４３Ａが貫通孔２５の第１内面２５Ａに当接されている。
これにより、弾性部材４３で振動や衝撃が吸収され、振動や衝撃が副表示部２２に伝達され難くなり、副表示部２２の破損を防止できる。 The elastic member 43 is a pair of projecting pieces integrally formed with the first wall surface 22C among the wall surfaces of the sub-holder 22A. The elastic member 43 is formed so as to be inclined toward the center, and the distal end portion 43A is in contact with the first inner surface 25A of the through hole 25.
As a result, vibration and impact are absorbed by the elastic member 43, and vibration and impact are hardly transmitted to the sub display unit 22, and damage to the sub display unit 22 can be prevented.

さらに、線接触部材４４は、副ホルダ２２Ａの壁面のうち、第２壁面２２Ｄに一体成形された一対の突起である。
線接触部材４４は、先端が貫通孔２５の第２内面２５Ｂに線接触して座屈変形することで、振動や衝撃が副表示部２２に伝達され難くなり、副表示部２２の破損を防止できる。 Further, the line contact member 44 is a pair of protrusions integrally formed on the second wall surface 22D among the wall surfaces of the sub-holder 22A.
The tip of the line contact member 44 is buckled and deformed by making line contact with the second inner surface 25B of the through hole 25, so that vibrations and impacts are not easily transmitted to the sub display unit 22, and damage to the sub display unit 22 is prevented. it can.

図１に戻って、枠体３１は、略矩形状の筒状に形成された周壁３１Ａと、周壁３１Ａの基部に外側に張り出すように形成された外フランジ３１Ｂと、周壁３１Ａの頂部に内側に張り出すように形成された内フランジ３１Ｃとを有する。
枠体３１は、外フランジ３１Ｂが基材２４の接続端子４６に接続されることで、基材２４の第１の面２４Ａに設けられている。 Returning to FIG. 1, the frame 31 includes a peripheral wall 31A formed in a substantially rectangular cylindrical shape, an outer flange 31B formed so as to protrude outward from the base of the peripheral wall 31A, and an inner side at the top of the peripheral wall 31A. And an inner flange 31 </ b> C formed so as to overhang.
The frame body 31 is provided on the first surface 24 </ b> A of the base material 24 by connecting the outer flange 31 </ b> B to the connection terminal 46 of the base material 24.

充填剤３３は、熱可塑性の樹脂である。この充填剤３３は、枠体３１に充填される際に、内フランジ３１Ｃに対して略同一面になるように充填量があらかじめ定められている。   The filler 33 is a thermoplastic resin. The filling amount of the filler 33 is determined in advance so as to be substantially flush with the inner flange 31C when the frame body 31 is filled.

枠体３１の内フランジ３１Ｃにシールドカバー３４が被せられ、シールドカバー３４に主表示部２１が固定されている。
すなわち、主表示部２１は、シールドカバー３４を介してホルダ２７の支持面３６に接している。
ホルダ２７に主表示部２１を接触させることで、例えば、電子機器１０の筐体１１の表裏側に主表示部２１および副表示部２２を配置しても、回路基板２０（電子機器１０）の薄型化が図れる。
主表示部２１は主ホルダ２１Ａおよび主液晶本体２１Ｂで構成される。 A shield cover 34 is placed on the inner flange 31 </ b> C of the frame 31, and the main display unit 21 is fixed to the shield cover 34.
That is, the main display unit 21 is in contact with the support surface 36 of the holder 27 through the shield cover 34.
By bringing the main display unit 21 into contact with the holder 27, for example, even if the main display unit 21 and the sub display unit 22 are arranged on the front and back sides of the casing 11 of the electronic device 10, the circuit board 20 (electronic device 10). Thinning can be achieved.
The main display unit 21 includes a main holder 21A and a main liquid crystal main body 21B.

以上説明したように、電子機器１０および回路基板２０によれば、基材２４の貫通孔２５内に配置された副表示部２２がホルダ２７に支持される。これにより、回路基板２０の全体厚みＴ１として基材２４の厚みＴ２が加算されず、電子機器１０や回路基板２０を、従来のものと比較して薄型化できる。   As described above, according to the electronic apparatus 10 and the circuit board 20, the sub display unit 22 disposed in the through hole 25 of the base material 24 is supported by the holder 27. Thereby, the thickness T2 of the base material 24 is not added as the total thickness T1 of the circuit board 20, and the electronic device 10 and the circuit board 20 can be thinned compared with the conventional one.

さらに、ホルダ２７を箱形の形状とすることで、基材２４の厚み寸法Ｔ２よりも嵩高の副表示部２２を、基材２４の第２の面２４Ｂから突出しないように支持することが可能である。
これにより、電子機器１０や回路基板２０を、従来のものと比較して一層薄型化できる。 Furthermore, by making the holder 27 into a box shape, it is possible to support the secondary display portion 22 that is bulkier than the thickness dimension T2 of the base material 24 so as not to protrude from the second surface 24B of the base material 24. It is.
Thereby, the electronic device 10 and the circuit board 20 can be made thinner than the conventional one.

また、副表示部２２がホルダ２７に支持されているので、電子部品２２に加えられた外力が反対側の主表示部２１に影響せず、主表示部２１に割れ等の破損が生じ難くできる。   Further, since the sub display unit 22 is supported by the holder 27, the external force applied to the electronic component 22 does not affect the main display unit 21 on the opposite side, and the main display unit 21 can hardly be broken or broken. .

加えて、副表示部２２の被支持面４２と、ホルダ２７の支持面３６とが面接触している。よって、ホルダ２７が副表示部２２を安定的に支持できるとともに、副表示部２２に加えられた外力をホルダ２７の広範囲に亘って分散できる。
これにより、局所的に外力が伝達されることで副表示部２２等に破損等の悪影響が生じることを防止できる。 In addition, the supported surface 42 of the sub-display unit 22 and the support surface 36 of the holder 27 are in surface contact. Therefore, the holder 27 can stably support the sub-display unit 22, and the external force applied to the sub-display unit 22 can be distributed over a wide range of the holder 27.
As a result, it is possible to prevent adverse effects such as breakage on the secondary display unit 22 and the like due to local transmission of external force.

なお、第１実施形態では、弾性部材４３を貫通孔２５の第１内面２５Ａに当接させた例について説明したが、これに限らないで、弾性部材４３をホルダ２７の壁面や支持面３６に当接させても同様の効果が得られる。   In addition, although 1st Embodiment demonstrated the example which made the elastic member 43 contact | abut to the 1st inner surface 25A of the through-hole 25, it is not restricted to this, The elastic member 43 is attached to the wall surface of the holder 27, or the support surface 36. Even if they are brought into contact with each other, the same effect can be obtained.

さらに、第１実施形態では、線接触部材４４を貫通孔２５の第２内面２５Ｂに線接触させた例について説明したが、これに限らないで、線接触部材４４をホルダ２７の壁面に当接させても同様の効果が得られる。   Furthermore, in the first embodiment, the example in which the line contact member 44 is in line contact with the second inner surface 25B of the through hole 25 has been described. However, the present invention is not limited to this, and the line contact member 44 is in contact with the wall surface of the holder 27. Even if it makes it, the same effect is acquired.

つぎに、第２実施形態〜第４実施形態を図４〜図１１に基づいて説明する。なお、第２実施形態〜第４実施形態において第１実施形態の回路基板２０と同一類似部材については同じ符号を付して説明を省略する。   Next, a second embodiment to a fourth embodiment will be described with reference to FIGS. In addition, in 2nd Embodiment-4th Embodiment, the same code | symbol is attached | subjected about the same similar member as the circuit board 20 of 1st Embodiment, and description is abbreviate | omitted.

（第２実施形態）
図４〜図７に示すように、第２実施形態の回路基板５０は、ホルダ５１の底部（支持面）５２に連通孔５３が設けられ、第１の電子部品である副表示部５５に線接触部材５６が設けられたもので、その他の構成は第１実施形態と同じである。
ホルダ５１は、第１実施形態のホルダ２７の底部（支持面）３６に連通孔５３が設けられたもので、その他の構成はホルダ２７と同じである。 (Second Embodiment)
As shown in FIGS. 4 to 7, in the circuit board 50 of the second embodiment, a communication hole 53 is provided in the bottom portion (support surface) 52 of the holder 51, and a line is connected to the sub display portion 55 that is the first electronic component. A contact member 56 is provided, and other configurations are the same as those of the first embodiment.
The holder 51 is provided with a communication hole 53 in the bottom (support surface) 36 of the holder 27 of the first embodiment, and the other configuration is the same as the holder 27.

副表示部５５は、ホルダ５１の収容空間３８に収容される副ホルダ５５Ａと、副ホルダ５５Ａに収容される副液晶本体２２Ｂとからなる。
副ホルダ５５Ａの線接触部材５６は、副ホルダ５５Ａの第１壁面５５Ｂに一体成形された一対の突起で、副表示部５５および貫通孔２５の第１内面２５Ａ間に介装されている。 The sub display unit 55 includes a sub holder 55A housed in the housing space 38 of the holder 51 and a sub liquid crystal main body 22B housed in the sub holder 55A.
The line contact member 56 of the sub holder 55A is a pair of protrusions integrally formed on the first wall surface 55B of the sub holder 55A, and is interposed between the sub display portion 55 and the first inner surface 25A of the through hole 25.

副ホルダ５５Ａは、線接触部材５６が貫通孔２５の第１内面２５Ａに接するとともに、第２壁面５５Ｃが第２内面２５Ｂに接する。
線接触部材５６は、第１実施形態の線接触部材４４と同様に、先端が貫通孔２５の第１内面２５Ａに線接触して座屈変形することで、振動や衝撃を副表示部５５に伝達され難くして、副表示部５５の破損を防止できる。 In the sub-holder 55A, the line contact member 56 contacts the first inner surface 25A of the through hole 25, and the second wall surface 55C contacts the second inner surface 25B.
Similar to the line contact member 44 of the first embodiment, the line contact member 56 is subjected to buckling deformation by the line contact of the tip with the first inner surface 25A of the through hole 25, so that vibration and impact are applied to the sub display unit 55. It is possible to prevent the sub display unit 55 from being damaged by making it difficult to transmit.

ここで、ホルダ５１の支持面５２に連通孔５３を設けた理由について説明する。
すなわち、副表示部５５をホルダ５１に支持させるにあたって、副表示部５５が貫通孔２５を通過する際に、副表示部５５が貫通孔２５の内面に摺接して、基材２４の（極めて微細な）欠片４１を脱落させ、ホルダ５１内に落下させる可能性がある。
ホルダ５１内に落下した欠片４１は、回路基板５０の使用中に、副表示部５５の表面に付着して外観性が損なわれる虞がある。 Here, the reason why the communication hole 53 is provided in the support surface 52 of the holder 51 will be described.
That is, when the sub display portion 55 is supported by the holder 51, when the sub display portion 55 passes through the through hole 25, the sub display portion 55 comes into sliding contact with the inner surface of the through hole 25, so The chip 41 may be dropped and dropped into the holder 51.
The chip 41 that has fallen into the holder 51 may adhere to the surface of the sub-display unit 55 during use of the circuit board 50 and may deteriorate the appearance.

そこで、ホルダ５１の支持面５２に連通孔５３を設けることにした。
これにより、図６に示すように、エアガン５７を用いて高圧気体５８をホルダ５１内に噴射させることで、連通孔５３から欠片４１を除去できる。 Therefore, the communication hole 53 is provided in the support surface 52 of the holder 51.
Accordingly, as shown in FIG. 6, the chip 41 can be removed from the communication hole 53 by injecting the high-pressure gas 58 into the holder 51 using the air gun 57.

さらに、第２実施形態の回路基板５０によれば、第１実施形態の回路基板２０と同様に、従来のものと比較して薄型化できる。
加えて、第２実施形態の回路基板５０によれば、第１実施形態の回路基板２０と同様の効果が得られる。 Furthermore, according to the circuit board 50 of the second embodiment, as with the circuit board 20 of the first embodiment, the circuit board 50 can be made thinner than the conventional one.
In addition, according to the circuit board 50 of the second embodiment, the same effect as the circuit board 20 of the first embodiment can be obtained.

なお、第２実施形態では、線接触部材５６を貫通孔２５の第１内面２５Ａに線接触させた例について説明したが、これに限らないで、線接触部材５６をホルダ５１の壁面に当接させても同様の効果が得られる。   In the second embodiment, the example in which the line contact member 56 is in line contact with the first inner surface 25A of the through hole 25 has been described. However, the present invention is not limited thereto, and the line contact member 56 is in contact with the wall surface of the holder 51. Even if it makes it, the same effect is acquired.

（第３実施形態）
図８〜図１０に示すように、第３実施形態の回路基板７０は、第１実施形態のホルダ２７に代えてホルダ７１が設けられ、第１実施形態の副表示部２２に代えて電子部品７２が設けられたもので、その他の構成は第１実施形態と同じである。 (Third embodiment)
As shown in FIGS. 8 to 10, a circuit board 70 of the third embodiment is provided with a holder 71 instead of the holder 27 of the first embodiment, and an electronic component instead of the sub display unit 22 of the first embodiment. 72 is provided, and the other configuration is the same as that of the first embodiment.

ホルダ７１は、略矩形状に形成された金属製の平板である。
電子部品７２は、厚みＴ３が基材２４の厚みＴ２と略同じに形成された略矩形状の部品である。この電子部品７２は、電子部品７２および貫通孔２５の第１内面２５Ａ間に介装された弾性部材７３と、ホルダ７１の支持面７１Ａに接する被支持面７４とを有する。 The holder 71 is a metal flat plate formed in a substantially rectangular shape.
The electronic component 72 is a substantially rectangular component having a thickness T3 that is substantially the same as the thickness T2 of the substrate 24. The electronic component 72 includes an elastic member 73 interposed between the electronic component 72 and the first inner surface 25 </ b> A of the through hole 25, and a supported surface 74 that contacts the support surface 71 </ b> A of the holder 71.

弾性部材７３は、第１実施形態の弾性部材４３と同様に、電子部品７２の第１壁面７２Ａに一体成形された一対の突片である。弾性部材７３は、中央に向けて傾斜するように形成され、先端部７３Ａが貫通孔２５の第１内面２５Ａに当接されている。
一方、電子部品７２の第２壁面７２Ｂが、貫通孔２５の第２内面２５Ｂに当接されている。
これにより、弾性部材７３で振動や衝撃が吸収され、振動や衝撃が電子部品７２に伝達され難くなり、電子部品７２の破損を防止できる。 The elastic member 73 is a pair of projecting pieces integrally formed on the first wall surface 72A of the electronic component 72, like the elastic member 43 of the first embodiment. The elastic member 73 is formed so as to be inclined toward the center, and the distal end portion 73 </ b> A is in contact with the first inner surface 25 </ b> A of the through hole 25.
On the other hand, the second wall surface 72 </ b> B of the electronic component 72 is in contact with the second inner surface 25 </ b> B of the through hole 25.
As a result, vibration and impact are absorbed by the elastic member 73, and vibration and impact are hardly transmitted to the electronic component 72, and damage to the electronic component 72 can be prevented.

第３実施形態の回路基板７０によれば、電子部品７２は、基材２４の貫通孔２５内に配置されるとともに、ホルダ７１に支持されている。これにより、回路基板７０の全体厚みとして基材２４の厚みが加算されず、回路基板７０を、従来のものと比較して薄型化できる。
加えて、第３実施形態の回路基板７０によれば、第１実施形態の回路基板２０と同様の効果が得られる。 According to the circuit board 70 of the third embodiment, the electronic component 72 is disposed in the through hole 25 of the base material 24 and supported by the holder 71. Thereby, the thickness of the base material 24 is not added as the entire thickness of the circuit board 70, and the circuit board 70 can be made thinner than the conventional one.
In addition, according to the circuit board 70 of the third embodiment, the same effect as the circuit board 20 of the first embodiment can be obtained.

（第４実施形態）
図１１に示すように、第４実施形態の回路基板８０は、第１実施形態の副表示部２２に代えて副表示部８１、弾性部材８２および線接触部材８３が設けられたもので、その他の構成は第１実施形態と同じである。
副表示部８１は、第１実施形態の副表示部２２から弾性部材４３および線接触部材４４を除去したもので、その他の構成は副表示部２２と同じである。 (Fourth embodiment)
As shown in FIG. 11, the circuit board 80 of the fourth embodiment is provided with a sub display portion 81, an elastic member 82, and a line contact member 83 in place of the sub display portion 22 of the first embodiment. The configuration is the same as in the first embodiment.
The sub display unit 81 is obtained by removing the elastic member 43 and the line contact member 44 from the sub display unit 22 of the first embodiment, and other configurations are the same as the sub display unit 22.

弾性部材８２は、弾性変形可能なスポンジ材等で形成され、副表示部８１の第１壁面８１Ａおよび貫通孔２５の第１内面２５Ａ間に介装された部材である。
弾性部材８２は、第１実施形態の弾性部材４３と同様に、振動や衝撃を吸収することで、振動や衝撃を副表示部８１に伝達され難くして、副表示部８１の破損を防止できる。 The elastic member 82 is a member formed of an elastically deformable sponge material or the like and interposed between the first wall surface 81A of the sub display portion 81 and the first inner surface 25A of the through hole 25.
Similar to the elastic member 43 of the first embodiment, the elastic member 82 absorbs vibrations and shocks, thereby making it difficult for vibrations and shocks to be transmitted to the sub display unit 81 and preventing the sub display unit 81 from being damaged. .

線接触部材８３は、ベース８４の両端に線接触部８５が形成されたもので、副表示部８１の第２壁面８１Ｂおよび貫通孔２５の第２内面２５Ｂ間に介装された部材である。
線接触部８５は、第１実施形態の線接触部材４４と同様に、先端が貫通孔２５の第２内面２５Ｂに線接触して座屈変形することで、振動や衝撃を副表示部８１に伝達され難くして、副表示部８１の破損を防止できる。 The line contact member 83 is a member in which a line contact portion 85 is formed at both ends of the base 84 and is interposed between the second wall surface 81B of the sub display portion 81 and the second inner surface 25B of the through hole 25.
Similar to the line contact member 44 of the first embodiment, the line contact portion 85 has its tip line-contacted with the second inner surface 25B of the through hole 25 to buckle and deform, thereby causing vibration and impact to the sub display portion 81. It is possible to prevent the sub display unit 81 from being damaged by making it difficult to transmit.

第４実施形態の回路基板８０によれば、弾性部材８２および線接触部材８３を副表示部２２に対して個別に設けることで用途の拡大が図れ、弾性部材８２および線接触部材８３のみの交換が可能になる。
加えて、第４実施形態の回路基板８０によれば、第１実施形態の回路基板２０と同様の効果が得られる。 According to the circuit board 80 of the fourth embodiment, the elastic member 82 and the line contact member 83 are individually provided with respect to the sub-display unit 22 so that the application can be expanded, and only the elastic member 82 and the line contact member 83 are replaced. Is possible.
In addition, according to the circuit board 80 of the fourth embodiment, the same effect as the circuit board 20 of the first embodiment can be obtained.

なお、第４実施形態では、弾性部材８２を貫通孔２５の第１内面２５Ａに当接させた例について説明したが、これに限らないで、弾性部材８２をホルダ２７の壁面や支持面３６に当接させても同様の効果が得られる。   In the fourth embodiment, the example in which the elastic member 82 is brought into contact with the first inner surface 25A of the through hole 25 has been described. However, the present invention is not limited thereto, and the elastic member 82 is attached to the wall surface of the holder 27 or the support surface 36. Even if they are brought into contact with each other, the same effect can be obtained.

さらに、第４実施形態では、線接触部８５を貫通孔２５の第２内面２５Ｂに線接触させた例について説明したが、これに限らないで、線接触部８５をホルダ２７の壁面に当接させても同様の効果が得られる。   Furthermore, in the fourth embodiment, the example in which the line contact portion 85 is brought into line contact with the second inner surface 25B of the through hole 25 has been described. However, the present invention is not limited thereto, and the line contact portion 85 is brought into contact with the wall surface of the holder 27. Even if it makes it, the same effect is acquired.

また、第４実施形態では、弾性部材８２としてスポンジ材を用いた例について説明したが、これに限らないで、スプリングやウレタンパッド等の他の弾性部材を用いることも可能である。   In the fourth embodiment, an example in which a sponge material is used as the elastic member 82 has been described. However, the elastic member 82 is not limited to this, and other elastic members such as a spring and a urethane pad may be used.

つぎに、第１実施形態で説明したホルダ２７の第１変形例〜第３変形例を図１２（Ａ）〜（Ｃ）に基づいて説明する。
図１２（Ａ）に示す第１変形例のホルダ９０は、第１実施形態のホルダ２７から第２壁部３５Ｂおよび第４壁部３５Ｄを除去するとともに、第２壁部３５Ｂの上端に形成されたフランジおよび第４壁部３５Ｄの上端に形成されたフランジを除去したものである。
すなわち、ホルダ９０は、対向する面に開口９１を形成することで、側面視において略コ字状に形成された金属製の部材である。 Next, a first modification to a third modification of the holder 27 described in the first embodiment will be described with reference to FIGS.
The holder 90 of the first modification shown in FIG. 12A is formed at the upper end of the second wall portion 35B while removing the second wall portion 35B and the fourth wall portion 35D from the holder 27 of the first embodiment. The flange formed on the upper end of the flange and the fourth wall portion 35D is removed.
That is, the holder 90 is a metal member formed in a substantially U shape in a side view by forming the opening 91 on the opposing surface.

第１変形例のホルダ９０によれば、副表示部２２をホルダ９０に支持させるにあたって、副表示部２２が貫通孔２５を通過する際に、副表示部２２が貫通孔２５の内面に摺接して、基材２４の（極めて微細な）欠片４１を脱落させても、図６に示すエアガン５７を用いて高圧気体５８をホルダ９０内に噴射させることで、脱落させた欠片４１を開口９１から除去できる。   According to the holder 90 of the first modified example, when the sub display unit 22 is supported by the holder 90, the sub display unit 22 is in sliding contact with the inner surface of the through hole 25 when the sub display unit 22 passes through the through hole 25. Thus, even if the (very fine) piece 41 of the base material 24 is dropped, the dropped piece 41 is removed from the opening 91 by injecting the high-pressure gas 58 into the holder 90 using the air gun 57 shown in FIG. Can be removed.

図１２（Ｂ）に示す第２変形例のホルダ９５は、第１変形例のホルダ９０の両側部を残して、中央部を除去したものである。
すなわち、ホルダ９５は、一対の帯状部材９６が側面視で略コ字状に形成された金属製の部材である。よって、ホルダ９５は、一対の帯状部材９６の幅Ｗを狭くできる。 The holder 95 of the second modified example shown in FIG. 12B is obtained by removing the central portion while leaving both side portions of the holder 90 of the first modified example.
That is, the holder 95 is a metal member in which a pair of belt-like members 96 are formed in a substantially U shape in a side view. Therefore, the holder 95 can narrow the width W of the pair of belt-like members 96.

第２変形例のホルダ９５によれば、副表示部２２をホルダ９０に支持させるにあたって、副表示部２２が貫通孔２５の内面に摺接して、基材２４の欠片４１を脱落させても、一対の帯状部材９６の幅Ｗが狭いので、欠片４１がホルダ９０内に溜まることを防止できる。   According to the holder 95 of the second modified example, when the sub display unit 22 is supported by the holder 90, even if the sub display unit 22 is in sliding contact with the inner surface of the through hole 25 and the piece 41 of the base material 24 is dropped, Since the width W of the pair of belt-like members 96 is narrow, it is possible to prevent the pieces 41 from collecting in the holder 90.

図１２（Ｃ）に示す第３変形例のホルダ１００は、第１実施形態のホルダ２７から四隅を除去することで、四隅に開口１０１を形成したものである。   The holder 100 of the third modification shown in FIG. 12C is formed by removing the four corners from the holder 27 of the first embodiment to form openings 101 at the four corners.

第３変形例のホルダ１００によれば、副表示部２２をホルダ１００に支持させるにあたって、副表示部２２が貫通孔２５の内面に摺接して、基材２４の欠片４１を脱落させても、図６に示すエアガン５７を用いて高圧気体５８をホルダ１００内に噴射させることで、脱落させた欠片４１を開口１０１から除去できる。   According to the holder 100 of the third modified example, when the sub display unit 22 is supported by the holder 100, even if the sub display unit 22 is in sliding contact with the inner surface of the through hole 25 and the piece 41 of the base material 24 is dropped, By ejecting the high-pressure gas 58 into the holder 100 using the air gun 57 shown in FIG. 6, the dropped piece 41 can be removed from the opening 101.

本発明は、基材に電子部品が実装された回路基板および電子機器への適用に好適である。   The present invention is suitable for application to a circuit board having an electronic component mounted on a base material and an electronic device.

本発明に係る電子機器（第１実施形態）を示す断面図である。It is sectional drawing which shows the electronic device (1st Embodiment) which concerns on this invention. 第１実施形態に係る回路基板を示す分解斜視図である。It is a disassembled perspective view which shows the circuit board which concerns on 1st Embodiment. 第１実施形態に係る回路基板を示す平面図である。1 is a plan view showing a circuit board according to a first embodiment. 本発明に係る回路基板（第２実施形態）を示す断面図である。It is sectional drawing which shows the circuit board (2nd Embodiment) which concerns on this invention. 第２実施形態に係る回路基板を示す分解斜視図である。It is a disassembled perspective view which shows the circuit board which concerns on 2nd Embodiment. 第２実施形態に係る回路基板のホルダから欠片を除去する例を説明する図である。It is a figure explaining the example which removes a piece from the holder of the circuit board concerning a 2nd embodiment. 第２実施形態に係る回路基板を示す平面図である。It is a top view which shows the circuit board which concerns on 2nd Embodiment. 本発明に係る回路基板（第３実施形態）を示す断面図である。It is sectional drawing which shows the circuit board (3rd Embodiment) based on this invention. 第３実施形態に係る回路基板を示す分解斜視図である。It is a disassembled perspective view which shows the circuit board which concerns on 3rd Embodiment. 第３実施形態に係る回路基板を示す平面図である。It is a top view which shows the circuit board which concerns on 3rd Embodiment. 本発明に係る回路基板（第４実施形態）を示す分解斜視図である。It is a disassembled perspective view which shows the circuit board (4th Embodiment) based on this invention. 第１実施形態に係るホルダの変形例を示す斜視図である。It is a perspective view which shows the modification of the holder which concerns on 1st Embodiment. 従来の電子機器を示す断面図である。It is sectional drawing which shows the conventional electronic device.

符号の説明Explanation of symbols

１０ 電子機器
２０，５０，７０，８０ 回路基板
２１ 主表示部（第２の電子部品）
２２，５５，８１ 副表示部（第１の電子部品）
２４ 基材
２４Ａ 第１の面
２４Ｂ 第２の面
２５ 貫通孔
２７，５１，７１ ホルダ
３５ 壁部
３６，５２ 底部（支持面）
４２，７４ 被支持面
４３，７３，８２ 弾性部材
４４，５６，８３ 線接触部材
５３ 連通孔
７１Ａ 支持面
７２ 第１の電子部品 DESCRIPTION OF SYMBOLS 10 Electronic device 20, 50, 70, 80 Circuit board 21 Main display part (2nd electronic component)
22, 55, 81 Sub display section (first electronic component)
24 Substrate 24A 1st surface 24B 2nd surface 25 Through-hole 27,51,71 Holder 35 Wall part 36,52 Bottom (support surface)
42, 74 Supported surface 43, 73, 82 Elastic member 44, 56, 83 Line contact member 53 Communication hole 71A Support surface 72 First electronic component

Claims (8)

第１の面と、前記第１の面と反対側の第２の面と、前記第１の面と前記第２の面との間を貫通する貫通孔とを有する基材と、
前記第１の面に実装され、前記貫通孔を横切るホルダと、
前記ホルダに支持され、前記貫通孔の内部に配置される第１の電子部品と、
を有することを特徴とする回路基板。 A base material having a first surface, a second surface opposite to the first surface, and a through-hole penetrating between the first surface and the second surface;
A holder mounted on the first surface and crossing the through hole;
A first electronic component supported by the holder and disposed inside the through hole;
A circuit board comprising: 前記第１の電子部品を支持するために前記ホルダに設けられた支持面と、
前記ホルダに支持されるために前記第１の電子部品に設けられた被支持面とを有し、
前記支持面と前記被支持面とが接触していることを特徴とする請求項１に記載の回路基板。 A support surface provided on the holder for supporting the first electronic component;
A supported surface provided on the first electronic component to be supported by the holder,
The circuit board according to claim 1, wherein the support surface and the supported surface are in contact with each other. 前記ホルダが、前記第１の面に対して交差する面を有する壁部と、前記壁部に連結されて前記第１の面に対して略平行な面を有する底部を有していることを特徴とする請求項１に記載の回路基板。   The holder has a wall portion having a surface intersecting the first surface, and a bottom portion connected to the wall portion and having a surface substantially parallel to the first surface. The circuit board according to claim 1. 前記底部に連通孔が設けられていることを特徴とする請求項３に記載の回路基板。   The circuit board according to claim 3, wherein a communication hole is provided in the bottom portion. 前記ホルダに第２の電子部品が接していることを特徴とする請求項１に記載の回路基板。   The circuit board according to claim 1, wherein a second electronic component is in contact with the holder. 前記第１の電子部品と、前記貫通孔の内面および前記ホルダとのうちの少なくとも一方との間に弾性部材が介装されていることを特徴とする請求項１に記載の回路基板。   The circuit board according to claim 1, wherein an elastic member is interposed between the first electronic component and at least one of the inner surface of the through hole and the holder. 前記第１の電子部品と、前記貫通孔の内面および前記ホルダとのうちの少なくとも一方との間に介装され、前記第１の電子部品と、前記貫通孔の内面および前記ホルダとのうちのいずれかに対して線接触する線接触部材を有することを特徴とする請求項１に記載の回路基板。   Between the first electronic component and at least one of the inner surface of the through-hole and the holder, the first electronic component, the inner surface of the through-hole and the holder The circuit board according to claim 1, further comprising a line contact member that makes line contact with any of the circuit boards. 請求項１から請求項７のうちのいずれかに記載の回路基板を用いたことを特徴とする電子機器。   An electronic device using the circuit board according to claim 1.
JP2007017991A 2007-01-29 2007-01-29 Circuit boards and electronic equipment Expired - Fee Related JP4979397B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012083586A (en) * 2010-10-13 2012-04-26 Tamron Co Ltd Vibration-proof actuator, lens unit including the same, and camera

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JPH01290287A (en) * 1988-05-18 1989-11-22 Fujitsu Ltd Mounting structure of semiconductor module
JP2001272660A (en) * 2000-03-24 2001-10-05 Matsushita Electric Ind Co Ltd Holding structure of liquid crystal display element and electronic appliance provided with the same
JP2002151825A (en) * 2000-11-09 2002-05-24 Matsushita Electric Ind Co Ltd Mounting method of connector

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Publication number Priority date Publication date Assignee Title
JPS5753567U (en) * 1980-09-12 1982-03-29
JPS6027472U (en) * 1983-07-30 1985-02-25 ロ−ム株式会社 circuit board equipment
JPH01290287A (en) * 1988-05-18 1989-11-22 Fujitsu Ltd Mounting structure of semiconductor module
JP2001272660A (en) * 2000-03-24 2001-10-05 Matsushita Electric Ind Co Ltd Holding structure of liquid crystal display element and electronic appliance provided with the same
JP2002151825A (en) * 2000-11-09 2002-05-24 Matsushita Electric Ind Co Ltd Mounting method of connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012083586A (en) * 2010-10-13 2012-04-26 Tamron Co Ltd Vibration-proof actuator, lens unit including the same, and camera

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