JPS6239094A - Chip part package for printed circuit board - Google Patents
Chip part package for printed circuit boardInfo
- Publication number
- JPS6239094A JPS6239094A JP17769985A JP17769985A JPS6239094A JP S6239094 A JPS6239094 A JP S6239094A JP 17769985 A JP17769985 A JP 17769985A JP 17769985 A JP17769985 A JP 17769985A JP S6239094 A JPS6239094 A JP S6239094A
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed circuit
- circuit board
- chip components
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、プリント基板の両面にチップ部品を実装する
方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for mounting chip components on both sides of a printed circuit board.
（従来の技術）
従来、プリント基板の両面にチップ部品を実装する場合
は、大体への３つの方法が採られていた。(Prior Art) Conventionally, when mounting chip components on both sides of a printed circuit board, three methods have been generally adopted.
■ 基板の両面にそれぞれ形成した導体パターンの所定
の位置にそれぞれ半田ペーストを塗布し、その部分に端
子部が位置するようにチップ部品を載置してリフローソ
ルダリングにより半田付けを行なう方法。■ A method in which solder paste is applied to predetermined positions of conductor patterns formed on both sides of the board, and chip components are placed on the parts so that the terminals are located, and soldered by reflow soldering.
■ 基板の一方の面は、■と同様に半田ペーストを用い
てリフローソルダリングによりチップ部品を半田付けし
、他方の面は、配置したチップ部品を接着剤で基板に固
定した後、半田浸漬法により半田付けする方法。■ On one side of the board, chip components are soldered by reflow soldering using solder paste in the same way as in ■, and on the other side, after fixing the placed chip components to the board with adhesive, the solder dipping method is used. How to solder.
■ 基板の両面とも、片面ずっ■の半田浸漬法によりチ
ップ部品を半田付けする方法。■ A method of soldering chip components on both sides of the board using the solder immersion method on one side.
（発明が解決しようとする問題点）
しかしながら、上記３つの方法は、いずれにしても片面
ずつ別個の半田付は工程を必要とするものであり、従っ
て工数の増加につながり、コストアップとなっていた。(Problems to be Solved by the Invention) However, in any of the above three methods, soldering each side separately requires a process, which leads to an increase in man-hours and costs. Ta.
本発明は、一度の半田付は工程で、基板両面のチップ部
品の実装を行なうようにしたものである。In the present invention, chip components are mounted on both sides of the board in a single soldering process.
（問題点を解決するための手段） プリント基板としてスルホール基板を用いる。(Means for solving problems) A through-hole board is used as the printed circuit board.
基板の一方の主面では、導体パターンの所定の位置にそ
れぞれ端子部が位置するようにチップ部品を配置し、か
つ接着剤で基板に固定し、基板の他方の主面では、基板
の両面を電気的に接続するためのスルホール導体の表面
にそれぞれ端子部が位置するようにチップ部品を配置し
、かつ接着剤で基板に固定する。そしてプリント基板の
一方の主面側を溶融半田に浸漬することにより基板両面
のチップ部品を同時に半田付けする。On one main surface of the board, chip components are arranged so that the terminal parts are located at predetermined positions of the conductor pattern, and fixed to the board with adhesive, and on the other main surface of the board, both sides of the board are placed. Chip components are arranged so that their terminal portions are located on the surfaces of through-hole conductors for electrical connection, and fixed to the substrate with an adhesive. Then, one main surface side of the printed circuit board is immersed in molten solder to simultaneously solder the chip components on both sides of the circuit board.
（作 用）
本発明方法によれば、基板の一方の面は溶融半田内に浸
漬されるので、導体バタ・−ンとチップ部品の端子とは
当然半田付けされ、基板の他方の面では、半田の濡れ性
によりスルホール内を他方の面まで上がってきた溶融半
田により、スルホール導体の表面とチップ部品の端子と
が半田付けされる。(Function) According to the method of the present invention, one side of the board is immersed in molten solder, so the conductor batten and the terminal of the chip component are naturally soldered, and the other side of the board is immersed in molten solder. The surface of the through-hole conductor and the terminal of the chip component are soldered by the molten solder that rises inside the through-hole to the other surface due to the wettability of the solder.
（実施例）
以下図面により本発明の一実施例を詳細に説明する。第
］−図は、スルホール基板１を示しており。(Example) An example of the present invention will be described in detail below with reference to the drawings. Figure 1] shows a through-hole substrate 1.
２は基板１の主面Ａに形成された導体パターン。2 is a conductor pattern formed on the main surface A of the substrate 1;
３はスルホール導体で、基材に孔を開け、半田付は可能
な金属をメッキすることにより形成されている。４は基
板の両面の導体部分を除いて被覆した半田レジスト膜で
ある。3 is a through-hole conductor, which is formed by drilling a hole in the base material and plating it with a metal that can be soldered. 4 is a solder resist film that covers both surfaces of the substrate except for the conductor portions.
このような基板１を用い、まず第２図に示したように、
基板１の主面Ａに形成された導体パターン２の所定の部
位にそれぞれ端子部が位置するようにチップ部品５を配
置し、かつ接着剤６で基板に固定するっ
次に、第３図に示したように、基板１を裏返し、主面Ｂ
に露出したスルホール導体３の表面にそれぞれ端子部が
位置するようにチップ部品７を配置し、かつ接着剤６で
基板に固定する。Using such a substrate 1, first, as shown in FIG.
After arranging the chip components 5 so that the terminal portions are located at predetermined positions of the conductor pattern 2 formed on the main surface A of the substrate 1, and fixing them to the substrate with adhesive 6, as shown in FIG. As shown, turn the substrate 1 over and expose the main surface B.
Chip components 7 are arranged so that their terminal portions are located on the exposed surfaces of through-hole conductors 3, and fixed to the substrate with adhesive 6.
しかる後、基板１の主面Ａを溶融半田に浸漬する。その
結果、第４図に示したように、主面Ａに固定されたチッ
プ部品５はその端子部が導体パターン２と半田付けされ
、一方、主面Ｂに固定されたチップ部品７は、半田の濡
れ性によりスルホール導体３の孔を上がってきた溶融半
田により、端子部とスルホール導体３が半田付けされる
。８は半田を示している。Thereafter, the main surface A of the substrate 1 is immersed in molten solder. As a result, as shown in FIG. 4, the terminal portion of the chip component 5 fixed on the main surface A is soldered to the conductor pattern 2, while the chip component 7 fixed on the main surface B is soldered. The terminal portion and the through-hole conductor 3 are soldered by the molten solder that has flowed up the hole of the through-hole conductor 3 due to its wettability. 8 indicates solder.
なお、実施例では主面Ａ、Ｂに実装するチップ部品を１
個ずつで説明したが、それぞれ多数のチップ部品を一度
の半田付は工程で同時に半田付けできることは言うまで
もない。In addition, in the example, one chip component is mounted on the main surfaces A and B.
Although we have explained each chip individually, it goes without saying that a large number of chip components can be soldered at the same time in the same process.
（発明の効果）
以上説明したように、本発明によれば、一度の半田付は
工程で、プリント基板の両面にそれぞれ配置した多数の
チップ部品を同時に半田付けすることができ、工程の簡
略化が図られ、コストの低減に大きく寄与することがで
きる。(Effects of the Invention) As explained above, according to the present invention, a large number of chip components arranged on both sides of a printed circuit board can be simultaneously soldered in one soldering process, which simplifies the process. This can greatly contribute to cost reduction.
第１図ないし第４図は５本発明の一実施例の一連の製造
工程を示す断面図である。
１ ・・・スルホール基板、 ２ ・・・導体パターン
、３ ・・・スルホール導体、 ４ ・・・半田レジス
ト膜、 ５，７・・・チップ部品、 ６ ・・・接着剤
、８ ・・・ 半［月。
特許出願人 東北リコー株式会社
代 理 人 星 野 恒 罰ｉ範〉。1 to 4 are cross-sectional views showing a series of manufacturing steps of an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Through-hole board, 2...Conductor pattern, 3...Through-hole conductor, 4...Solder resist film, 5, 7...Chip parts, 6...Adhesive, 8...Semiconductor [Month. Patent applicant: Tohoku Ricoh Co., Ltd. Representative: Hisashi Hoshino.
Claims (1)
の部位にそれぞれ端子部が位置するようにチップ部品を
配置し、かつ接着剤で基板に固定し、前記プリント基板
の他方の主面に露出された、基板の両面を電気的に接続
するためのスルホール導体の表面にそれぞれ端子部が位
置するようにチップ部品を配置し、かつ接着剤で基板に
固定した後、前記プリント基板の一方の主面側を溶融半
田に浸漬して基板両面のチップ部品を同時に半田付けす
ることを特徴とするプリント基板のチップ部品実装方法
。The chip components are arranged so that the terminal parts are located at predetermined positions of the conductor layer formed on one main surface of the printed circuit board, and fixed to the board with adhesive, and then placed on the other main surface of the printed circuit board. After arranging the chip components so that the terminal parts are located on the surfaces of the exposed through-hole conductors for electrically connecting both sides of the board and fixing them to the board with adhesive, one of the printed board A method for mounting chip components on a printed circuit board, characterized in that chip components on both sides of the board are simultaneously soldered by dipping the main surface side in molten solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17769985A JPS6239094A (en) | 1985-08-14 | 1985-08-14 | Chip part package for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17769985A JPS6239094A (en) | 1985-08-14 | 1985-08-14 | Chip part package for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6239094A true JPS6239094A (en) | 1987-02-20 |
Family
ID=16035555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17769985A Pending JPS6239094A (en) | 1985-08-14 | 1985-08-14 | Chip part package for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6239094A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5931269B2 (en) * | 1975-12-31 | 1984-08-01 | 株式会社リコー | Eizoushingoushiyorihoushikiniokel |
-
1985
- 1985-08-14 JP JP17769985A patent/JPS6239094A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5931269B2 (en) * | 1975-12-31 | 1984-08-01 | 株式会社リコー | Eizoushingoushiyorihoushikiniokel |
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