KR940027638A - Printed Circuit Board (PCB) Manufacturing Method Using Punching - Google Patents

Printed Circuit Board (PCB) Manufacturing Method Using Punching Download PDF

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Publication number
KR940027638A
KR940027638A KR1019930008159A KR930008159A KR940027638A KR 940027638 A KR940027638 A KR 940027638A KR 1019930008159 A KR1019930008159 A KR 1019930008159A KR 930008159 A KR930008159 A KR 930008159A KR 940027638 A KR940027638 A KR 940027638A
Authority
KR
South Korea
Prior art keywords
printed circuit
circuit board
manufacturing
punching
leg portions
Prior art date
Application number
KR1019930008159A
Other languages
Korean (ko)
Inventor
박기준
Original Assignee
윤종용
삼성전기 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윤종용, 삼성전기 주식회사 filed Critical 윤종용
Priority to KR1019930008159A priority Critical patent/KR940027638A/en
Publication of KR940027638A publication Critical patent/KR940027638A/en

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Abstract

본 발명은 여러가지 소자를 실장(Mounting)하는 인쇄회로기판의 제조방법에 관한 것으로 보다 상세히는 외측면이 펀칭(Punching) 작업에 의해서 형성됨으로서 생산원자를 절감하고, 절단면이 깨끗하게 형성됨으로서 샤시(Chassis)와의 결합이 용이하게 되어 작업생산성이 크게 개선된 펀칭을 이용한 인쇄회로기판의 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a printed circuit board for mounting various devices. More specifically, the outer surface is formed by a punching operation to reduce production atoms, and the cut surface is cleanly formed. The present invention relates to a method for manufacturing a printed circuit board using punching, which is easily combined with and improves work productivity.

본 발명은 시이트상으로 형성되는 모재기판으로부터 다수개의 인쇄회로기판의 상. 하측면과 좌, 우측면이 각각 절단되어 분리 제조되는 방법에 있어서, 상기 각각의 인쇄회로기판의 상,하측면은 펀칭 절단 고정에 의해서 형성되는 복수개의 다리부를 갖추고, 상기 다리부의 양측면에는 오목부가 형성되며, 상기 좌, 우측면은 일자형으로 펀칭 절단 가공되는 인쇄회로기판 제조방법을 제공한다.The present invention provides a plurality of printed circuit board images from a base substrate formed in a sheet shape. In the method in which the lower side and the left and right sides are cut and manufactured separately, the upper and lower sides of each printed circuit board are provided with a plurality of leg portions formed by punching cutting fixing, and recesses are formed on both sides of the leg portions. The left and right sides provide a printed circuit board manufacturing method that is punched and cut into a straight line.

Description

펀칭(Punching)을 이용한 인쇄회로기판(PCB) 제조방법Printed Circuit Board (PCB) Manufacturing Method Using Punching

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제 1 도는 본 발명에 따라서 제조되는 인쇄회로기판의 구성도.1 is a configuration diagram of a printed circuit board manufactured according to the present invention.

Claims (2)

시이트상으로 형성되는 모재기판(20)으로부터 다수개의 인쇄회로기판의 상, 하측면(3a)(3b)과 좌, 우측면(4a)(4b)이 각각 절단되어 분리 제조되는 방법에 있어서, 상기 각각의 인쇄회로기판(2)의 상, 하측면(3a)(3b)은 펀칭 절단 공정에 의해서 형성되는 복수개의 다리부(5a)(5b)를 각각 갖추고, 상기 다리부(5a)(5b)의 양측면에는 오목부(8a)(8b)가 형성되며, 좌, 우측면(4a)(4b)은 일자형으로 펀칭 절단 가공됨을 특징으로 하는 인쇄회로기판 제조방법.In the method in which the upper and lower surfaces 3a and 3b and the left and right surfaces 4a and 4b of the plurality of printed circuit boards are cut and manufactured separately from the base substrate 20 formed in the sheet form, respectively. The upper and lower surfaces 3a and 3b of the printed circuit board 2 each have a plurality of leg portions 5a and 5b formed by a punching cutting process, and each of the leg portions 5a and 5b Concave portions (8a) (8b) is formed on both sides, the left, right side (4a) (4b) is a printed circuit board manufacturing method characterized in that the punching cutting process in a straight line. 제1항에 있어서, 상기 상, 하측면(3a)(3b)의 다리부(5a)(5b)는 오목부(8a)(8b)의 저면에 일치하는 가상 절단선(9)을 따라서 절단처리됨을 특징으로 하는 인쇄회로기판 제조방법.The leg portions 5a and 5b of the upper and lower surfaces 3a and 3b are cut along the imaginary cutting line 9 corresponding to the bottom of the recesses 8a and 8b. Printed circuit board manufacturing method characterized in that. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019930008159A 1993-05-12 1993-05-12 Printed Circuit Board (PCB) Manufacturing Method Using Punching KR940027638A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019930008159A KR940027638A (en) 1993-05-12 1993-05-12 Printed Circuit Board (PCB) Manufacturing Method Using Punching

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930008159A KR940027638A (en) 1993-05-12 1993-05-12 Printed Circuit Board (PCB) Manufacturing Method Using Punching

Publications (1)

Publication Number Publication Date
KR940027638A true KR940027638A (en) 1994-12-10

Family

ID=67137412

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930008159A KR940027638A (en) 1993-05-12 1993-05-12 Printed Circuit Board (PCB) Manufacturing Method Using Punching

Country Status (1)

Country Link
KR (1) KR940027638A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100325033B1 (en) * 1998-06-01 2002-08-09 최동구 Method for manufacturing dual tact switch and dual tact switch and medical electronic scalpel using dual tact switch
KR100904630B1 (en) * 2006-11-21 2009-06-25 조현귀 Circuit board punched pattern and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100325033B1 (en) * 1998-06-01 2002-08-09 최동구 Method for manufacturing dual tact switch and dual tact switch and medical electronic scalpel using dual tact switch
KR100904630B1 (en) * 2006-11-21 2009-06-25 조현귀 Circuit board punched pattern and manufacturing method thereof

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