JPH0230236Y2 - - Google Patents
Info
- Publication number
- JPH0230236Y2 JPH0230236Y2 JP17342185U JP17342185U JPH0230236Y2 JP H0230236 Y2 JPH0230236 Y2 JP H0230236Y2 JP 17342185 U JP17342185 U JP 17342185U JP 17342185 U JP17342185 U JP 17342185U JP H0230236 Y2 JPH0230236 Y2 JP H0230236Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- wiring
- pattern
- display
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000004080 punching Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Description
【考案の詳細な説明】
［産業上の利用分野］
本考案は印刷配線基板の構造に関し、特にパン
チング加工などにより密集孔を打抜く場合のクラ
ツク発生を防止するための構造を提供するもので
ある。[Detailed description of the invention] [Industrial application field] The present invention relates to the structure of printed wiring boards, and in particular provides a structure for preventing the occurrence of cracks when punching dense holes by punching or the like. .
［従来の技術］
従来、印刷配線基板は第４図の如く絶縁素材に
よる適当な厚みの基板１１表面に銅箔による所要
の配線パターン１２を、また裏面には配線する部
品の内容等を表示するための表示インクにより各
種記号などの表示パターン１３を形成していた。[Prior Art] Conventionally, as shown in FIG. 4, a printed wiring board has a board 11 of an appropriate thickness made of an insulating material, and a required wiring pattern 12 made of copper foil is printed on the front surface of the board 11, and details of the parts to be wired are displayed on the back surface. Display patterns 13 such as various symbols were formed using display ink.
［考案が解決しようとする問題点］
しかし、このような構造によると、第５図の如
く表示パターン１３は配線穴１４の位置から離れ
ており、これを穴明け加工する際には第６図の如
く穴明加工機の下型１５と上型１６の間に基板１
１を装設すると、上記裏面の表示パターン１３の
表示インクの盛上り厚によつて穴明位置の基板１
１の裏面が浮上つた形となり、特に配線穴１４が
２mmピツチ以下に接近して密集孔として明ける場
合、打抜ピンによりパンチング加工する際に相隣
る穴１４間にヒビ割れなどによるクラツクが発生
し易いなどの欠点を有していた。[Problems to be solved by the invention] However, according to such a structure, the display pattern 13 is far from the position of the wiring hole 14 as shown in FIG. The substrate 1 is placed between the lower die 15 and the upper die 16 of the hole punching machine as shown in the figure.
1, the thickness of the display ink of the display pattern 13 on the back side determines the position of the hole on the substrate 1.
If the back side of 1 is exposed and the wiring holes 14 are close to each other with a pitch of 2 mm or less and open as dense holes, cracks may occur between adjacent holes 14 when punching with a punching pin. It had the disadvantage that it was easy to
［問題を解決するための手段］
しかるに、本考案は上述した問題点を解決する
ために、配線穴などの透孔を穿設した基板の裏面
に表示インクによる補助パターンを形成した印刷
配線基板を提供するものである。[Means for solving the problem] However, in order to solve the above-mentioned problems, the present invention uses a printed wiring board in which an auxiliary pattern is formed using display ink on the back side of a board in which through-holes such as wiring holes are formed. This is what we provide.
［実施例］
以下、本考案に係る印刷配線基板の一実施例を
説明すると、１は絶縁素材による基板で、同基板
１の表面には銅箔による所要の配線パターン２を
形成し、裏面には表示インクによる各種の表示パ
ターン３を形成すると共に、基板１を貫通する配
線穴４などの透孔を穿設する位置の裏面には第２
図の如く表示インクにより補助パターン５を形成
する。この補助パターン５は配線穴４に対してそ
れぞれ個別に形成しても良いし、複数の配線穴４
を囲むように形成しても良く、その形状は如何な
るものでも良い。[Example] Hereinafter, an example of a printed wiring board according to the present invention will be described. Reference numeral 1 is a board made of an insulating material, and a required wiring pattern 2 made of copper foil is formed on the front surface of the board 1, and a wiring pattern 2 made of copper foil is formed on the back surface. In addition to forming various display patterns 3 using display ink, a second layer is formed on the back side at the position where a through hole such as a wiring hole 4 passing through the substrate 1 is to be formed.
As shown in the figure, an auxiliary pattern 5 is formed using display ink. This auxiliary pattern 5 may be formed individually for each wiring hole 4, or may be formed for a plurality of wiring holes 4.
It may be formed so as to surround it, and its shape may be arbitrary.
［効果］
以上のような構成により、基板１に配線穴４の
穴明け加工を行う場合、第３図の如く穴明加工機
の下型１５と上型１６の間に基板１を装設する
と、反打抜き側、すなわち配線穴４を明ける裏面
側に表示インクによる表示パターン３と同じ表示
インクにより補助パターン５を形成しているの
で、表示インクの盛上り厚が反打抜き側にも形成
され、従来のように基板１の浮上りがなく、配線
穴４の穴明け位置が下型１５と上型１６間に確実
に押え込まれ、打抜ピンによるパンチング加工の
際にクラツクの発生を防止することができる。[Effect] When drilling the wiring holes 4 in the board 1 with the above configuration, if the board 1 is installed between the lower mold 15 and the upper mold 16 of the hole punching machine as shown in FIG. Since the auxiliary pattern 5 is formed using the same display ink as the display pattern 3 made of display ink on the side opposite to the punching, that is, the back side where the wiring holes 4 are made, the thickness of the bulge of the display ink is also formed on the side opposite to the punch. The substrate 1 does not float up as in the conventional case, and the drilling position of the wiring hole 4 is reliably pressed between the lower die 15 and the upper die 16, preventing cracks from occurring during punching with a punching pin. be able to.
第１図は本考案の一実施例を示す印刷配線基板
の要部断面図、第２図は本考案の一実施例を示す
印刷配線基板の要部裏面図、第３図は本考案の一
実施例を示す穴明け加工時の要部断面図、第４図
は従来の印刷配線基板の要部断面図、第５図は従
来の印刷配線基板の要部裏面図、第６図は従来の
印刷配線基板の穴明け加工時の要部断面図であ
る。
図中、１……印刷配線基板、２……配線パター
ン、３……表示パターン、４……配線穴、５……
補助パターン。
Fig. 1 is a sectional view of the main parts of a printed wiring board showing an embodiment of the present invention, Fig. 2 is a rear view of the main parts of the printed wiring board showing an embodiment of the invention, and Fig. 3 is a cross-sectional view of the main parts of a printed wiring board showing an embodiment of the invention. 4 is a sectional view of the main part of a conventional printed wiring board, FIG. 5 is a rear view of the main part of the conventional printed wiring board, and FIG. 6 is a sectional view of the main part of the conventional printed wiring board. FIG. 3 is a sectional view of a main part of a printed wiring board during drilling. In the figure, 1...Printed wiring board, 2...Wiring pattern, 3...Display pattern, 4...Wiring hole, 5...
Auxiliary pattern.
Claims (1)
配線パターンを形成し、また裏面には表示パター
ンを形成してなる印刷配線基板において、基板を
貫通する配線穴などの透孔を穿設した位置の裏面
には表示インクによる補助パターンを形成してな
ることを特徴とする印刷配線基板。 In a printed circuit board made of an insulating material, with a required wiring pattern made of copper foil formed on the front side and a display pattern formed on the back side, the location where a through hole such as a wiring hole penetrating the board is drilled. A printed wiring board characterized by forming an auxiliary pattern using display ink on the back side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17342185U JPH0230236Y2 (en) | 1985-11-11 | 1985-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17342185U JPH0230236Y2 (en) | 1985-11-11 | 1985-11-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6281598U JPS6281598U (en) | 1987-05-25 |
| JPH0230236Y2 true JPH0230236Y2 (en) | 1990-08-14 |
Family
ID=31110864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17342185U Expired JPH0230236Y2 (en) | 1985-11-11 | 1985-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0230236Y2 (en) |
-
1985
- 1985-11-11 JP JP17342185U patent/JPH0230236Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6281598U (en) | 1987-05-25 |
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