KR970068763A - Printed Circuit Boards and Surface Mount Integrated Circuits - Google Patents

Printed Circuit Boards and Surface Mount Integrated Circuits Download PDF

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Publication number
KR970068763A
KR970068763A KR1019960008199A KR19960008199A KR970068763A KR 970068763 A KR970068763 A KR 970068763A KR 1019960008199 A KR1019960008199 A KR 1019960008199A KR 19960008199 A KR19960008199 A KR 19960008199A KR 970068763 A KR970068763 A KR 970068763A
Authority
KR
South Korea
Prior art keywords
printed circuit
integrated circuits
circuit boards
surface mount
mount integrated
Prior art date
Application number
KR1019960008199A
Other languages
Korean (ko)
Inventor
이중구
Original Assignee
곽정소
한국전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 곽정소, 한국전자 주식회사 filed Critical 곽정소
Priority to KR1019960008199A priority Critical patent/KR970068763A/en
Publication of KR970068763A publication Critical patent/KR970068763A/en

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

본 발명은 인쇄 회로 기판에 형성된 패턴이나표면 실장용 집적회로의 리드 프레임에 소정 형태의 요홈부를 형성하여 전자 부품을 면 실장할 때에 발생하는 기포가 면접촉되는 면의 외부로 빠져 나아가므로 납땜을 양호하게 할 수 있으며, 소요 납땜을 줄일 수 있는 인쇄 회로 기판 및 표면 실장용 집적회로에 관한 것이다.The present invention forms a recess in a predetermined shape in a lead frame of a pattern formed on a printed circuit board or an integrated circuit for surface mounting so that the bubbles generated when the electronic component is mounted on the surface escape to the outside of the surface contacting with the surface, To a printed circuit board and an integrated circuit for surface mounting that can reduce the required soldering.

Description

인쇄 회로 기판 및 표면 실장용 집적회로Printed Circuit Boards and Surface Mount Integrated Circuits

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제3도는 본 발명에 의해 제작된 인쇄 회로 기판에 표면 실장용 부품이 납땜된 나타낸 도면, 제5도는 본 발명에 의한 표면 실장용 집적회로를 나타낸 도면.FIG. 3 is a drawing showing a surface mounting component soldered to a printed circuit board manufactured by the present invention; FIG. 5 is a view showing an integrated circuit for surface mounting according to the present invention;

Claims (2)

표면 실장용 전자 부품이 납땜되는 각 패턴에 소정의 형태를 갖는 요홈부를 적어도 1개 이상 형성한 것을 특징으로 인쇄 회로 기판.Wherein at least one recessed portion having a predetermined shape is formed in each pattern to which the electronic component for surface mounting is to be soldered. 인쇄 회로 기판에 형성된 패턴부에 납땜되는 각각의 리드 프레임에 적어도 1개 이상의 요홈부가 형성된 것을 특징으로 하는 표면 실장용 집적회로.Wherein at least one recessed portion is formed in each of the lead frames to be soldered to the pattern portion formed on the printed circuit board. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960008199A 1996-03-25 1996-03-25 Printed Circuit Boards and Surface Mount Integrated Circuits KR970068763A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960008199A KR970068763A (en) 1996-03-25 1996-03-25 Printed Circuit Boards and Surface Mount Integrated Circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960008199A KR970068763A (en) 1996-03-25 1996-03-25 Printed Circuit Boards and Surface Mount Integrated Circuits

Publications (1)

Publication Number Publication Date
KR970068763A true KR970068763A (en) 1997-10-13

Family

ID=66216354

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960008199A KR970068763A (en) 1996-03-25 1996-03-25 Printed Circuit Boards and Surface Mount Integrated Circuits

Country Status (1)

Country Link
KR (1) KR970068763A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016175558A1 (en) * 2015-04-27 2016-11-03 주식회사 이엘메디칼 Device for removing electromagnetic waves of heating mattress

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016175558A1 (en) * 2015-04-27 2016-11-03 주식회사 이엘메디칼 Device for removing electromagnetic waves of heating mattress

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A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application