JPH0575576B2 - - Google Patents

Info

Publication number
JPH0575576B2
JPH0575576B2 JP60064254A JP6425485A JPH0575576B2 JP H0575576 B2 JPH0575576 B2 JP H0575576B2 JP 60064254 A JP60064254 A JP 60064254A JP 6425485 A JP6425485 A JP 6425485A JP H0575576 B2 JPH0575576 B2 JP H0575576B2
Authority
JP
Japan
Prior art keywords
copper plate
circuit board
ceramic circuit
copper
adhesive strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60064254A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61220836A (ja
Inventor
Kazuo Matsumura
Tadashi Tanaka
Katsuji Oohashi
Yasunobu Hirasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP6425485A priority Critical patent/JPS61220836A/ja
Publication of JPS61220836A publication Critical patent/JPS61220836A/ja
Publication of JPH0575576B2 publication Critical patent/JPH0575576B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP6425485A 1985-03-28 1985-03-28 セラミツクス回路基板 Granted JPS61220836A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6425485A JPS61220836A (ja) 1985-03-28 1985-03-28 セラミツクス回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6425485A JPS61220836A (ja) 1985-03-28 1985-03-28 セラミツクス回路基板

Publications (2)

Publication Number Publication Date
JPS61220836A JPS61220836A (ja) 1986-10-01
JPH0575576B2 true JPH0575576B2 (enrdf_load_stackoverflow) 1993-10-20

Family

ID=13252851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6425485A Granted JPS61220836A (ja) 1985-03-28 1985-03-28 セラミツクス回路基板

Country Status (1)

Country Link
JP (1) JPS61220836A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63166774A (ja) * 1986-12-27 1988-07-09 同和鉱業株式会社 銅板とアルミナ基板との接合体の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129243A (en) * 1975-07-30 1978-12-12 General Electric Company Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
JPS5649588A (en) * 1979-09-28 1981-05-06 Tokyo Shibaura Electric Co Method of forming thin film for ceramic substrate

Also Published As

Publication number Publication date
JPS61220836A (ja) 1986-10-01

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term