JPH0257711B2 - - Google Patents
Info
- Publication number
- JPH0257711B2 JPH0257711B2 JP16732485A JP16732485A JPH0257711B2 JP H0257711 B2 JPH0257711 B2 JP H0257711B2 JP 16732485 A JP16732485 A JP 16732485A JP 16732485 A JP16732485 A JP 16732485A JP H0257711 B2 JPH0257711 B2 JP H0257711B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- copper
- enamel
- metal layer
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010949 copper Substances 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 35
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 210000003298 dental enamel Anatomy 0.000 claims description 34
- 229910052802 copper Inorganic materials 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 30
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 59
- 239000000463 material Substances 0.000 description 17
- 239000011162 core material Substances 0.000 description 13
- 230000017525 heat dissipation Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910001374 Invar Inorganic materials 0.000 description 3
- 238000005253 cladding Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16732485A JPS6229192A (ja) | 1985-07-29 | 1985-07-29 | 電子回路用ホ−ロ−基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16732485A JPS6229192A (ja) | 1985-07-29 | 1985-07-29 | 電子回路用ホ−ロ−基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6229192A JPS6229192A (ja) | 1987-02-07 |
| JPH0257711B2 true JPH0257711B2 (enrdf_load_stackoverflow) | 1990-12-05 |
Family
ID=15847634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16732485A Granted JPS6229192A (ja) | 1985-07-29 | 1985-07-29 | 電子回路用ホ−ロ−基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6229192A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63173383A (ja) * | 1987-01-13 | 1988-07-16 | 株式会社 コサク | プリント配線基板用鉄コア−ほうろう基板およびその製造方法 |
| JPS63152263U (enrdf_load_stackoverflow) * | 1987-03-25 | 1988-10-06 | ||
| JPH0644615Y2 (ja) * | 1988-10-31 | 1994-11-16 | 株式会社アイチコーポレーション | マニピュレータ装置 |
-
1985
- 1985-07-29 JP JP16732485A patent/JPS6229192A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6229192A (ja) | 1987-02-07 |
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