JPS63152263U - - Google Patents
Info
- Publication number
- JPS63152263U JPS63152263U JP4264987U JP4264987U JPS63152263U JP S63152263 U JPS63152263 U JP S63152263U JP 4264987 U JP4264987 U JP 4264987U JP 4264987 U JP4264987 U JP 4264987U JP S63152263 U JPS63152263 U JP S63152263U
- Authority
- JP
- Japan
- Prior art keywords
- surface side
- nickel plating
- roughened
- core
- enamel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- 210000003298 dental enamel Anatomy 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 150000002815 nickel Chemical class 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 4
- QUQFTIVBFKLPCL-UHFFFAOYSA-L copper;2-amino-3-[(2-amino-2-carboxylatoethyl)disulfanyl]propanoate Chemical compound [Cu+2].[O-]C(=O)C(N)CSSCC(N)C([O-])=O QUQFTIVBFKLPCL-UHFFFAOYSA-L 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4264987U JPS63152263U (enrdf_load_stackoverflow) | 1987-03-25 | 1987-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4264987U JPS63152263U (enrdf_load_stackoverflow) | 1987-03-25 | 1987-03-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63152263U true JPS63152263U (enrdf_load_stackoverflow) | 1988-10-06 |
Family
ID=30858761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4264987U Pending JPS63152263U (enrdf_load_stackoverflow) | 1987-03-25 | 1987-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63152263U (enrdf_load_stackoverflow) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6229192A (ja) * | 1985-07-29 | 1987-02-07 | 日立電線株式会社 | 電子回路用ホ−ロ−基板 |
| JPS6237995A (ja) * | 1985-08-12 | 1987-02-18 | 松下電工株式会社 | 金属ベ−ス基板及びその製造方法 |
-
1987
- 1987-03-25 JP JP4264987U patent/JPS63152263U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6229192A (ja) * | 1985-07-29 | 1987-02-07 | 日立電線株式会社 | 電子回路用ホ−ロ−基板 |
| JPS6237995A (ja) * | 1985-08-12 | 1987-02-18 | 松下電工株式会社 | 金属ベ−ス基板及びその製造方法 |