TW569659B - Multi-layered circuit board with high heat dissipation - Google Patents

Abstract

A multi-layered circuit board with high heat dissipation is disclosed, wherein a metal plate is used as the substrate of the multi-layered circuit board, plural insulation layers and circuit layers are stacked to form the multi-layered circuit board structure. The whole metal substrate can transmit the heat generated by the device on the multi-layered circuit board, so as to increase the heat dissipation surface area. The insulation layer in the multi-layered circuit board structure has micro-pores on its surface, which can increase the adherence force to reduce the usage of adhesive agent. Also, the metal coating layer can effectively isolate the electromagnetic interference phenomenon.

Description

569659 Case No. 92109134 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a 'multi-layer thermal multilayer circuit board'. [Previous technology] In electronic system products, a brushed circuit board (Printed Circui glass fiber cloth or flexible substrate composed of a conductive layer. Or on the substrate, a plurality of circuit layers and insulation to complete a multilayer printed circuit board The design concept of "small production", the number of printed circuit layers and fine lines development, among which, a good solution. However, the components of broken glass fiber cloth or flexible printed circuit boards need to be conducted in a conductive way to dissipate heat. The efficiency of the components is reduced, and even multi-layer printed circuit boards are more serious. In addition, the current multi-layer circuit boards = metal layers or high-conductivity high-conductivity printed circuit boards such as steel reeds. I's regulations will be limited

Adding ion material π + J to the impurities is used to make the circuit board of the substrate, especially the plane known as t Boar, a circuit layer. As the board is also moving towards the multilayer printed substrate, the heat accumulated by the heat is reduced to a reduced quality. However, in line with the future European dielectrics and printed boards (PCBs) used to carry electronic components, glassy substrates are usually used. After the substrate is printed, they are laminated by a glue system and processed. In order to improve the circuit density of small-aperture, high-density, multi-brush circuit boards, the thermal properties are not good, so it is in a conductive medium. However, the heat of the air is quickly and efficiently dissipated, and the component's life is in this case in the adhesive and hot pressing method. , The paste is used as the circuit layer or the formulation of the adhesive needs to be added to the comprehensive exhibition of electronic products in 2004. And the adhesive often adds the poor edge characteristics, and in the

Page 6 569659 __Case No. 92109134 ^ η B_ Amendment V. Description of the invention (2) It is easy to cause distortion and deformation of the substrate at high temperature, which will reduce the reliability of the substrate. At the same time, due to the erosion of the adhesive, the strength of the metal bonding interface of the printed circuit board is reduced. Therefore, how to reduce or even avoid the use of adhesives in circuit boards has become the development trend of multilayer circuit boards. In addition, “the current trend of electronic products toward high frequency, high speed, thinness, and shortness” has led to relatively high requirements for noise prevention design to reduce the impact of noise interference on electronic products. Therefore, many devices need to be added to the design to suppress electromagnetic interference (electr0 EM I), such as inductors and core filters, weight and manufacturing costs. Therefore, the printed circuit board is good to provide a circuit board that can suppress noise interference and improve magnetic interference, which will increase many space circuit boards and also need to improve the component integration. [Summary of the Invention] For layer circuit selection, there is a need to reduce the edge layer of the current layer circuit and add electrical connections to isolate it and improve the board. The effect is improved to avoid the basic combination of the invention board. For the purpose of road layer, the setting of the electromagnetic stem is to dissipate the heat and then the high heat dissipating material, which can also interfere with its insulation adhesion. Or the circuit layer uses a multi-layered multi-layer metal plate layer to have 'the top end of the circuit is opposite to increase'. The present invention discloses a high-heat-dissipation multilayer circuit board junction insulation electromagnetic dry structure design and substrate selection. The surface layer of the board and the system material contains a micro-hole layer as the element's insulation layer. The surface edge layer is suitable for the insulation layer and the interference phenomenon. Furthermore, the metal plate is used as a plurality of circuit layers and the insulation surface. The surface adhesion and electrical surface increase the surface treatment of the metal coating layer, and then the adhesion of the circuit layer.

The heat transfer capacity generated by the components of the high-performance board made of metal material will increase the surface area of the multilayer circuit. Insulate a metal substrate to dissipate the heat, thereby saving the burden on the surface to increase the adhesion of the circuit layer. The insulating layer is also used at π :::, and its buffer surface can be made by surface treatment. = Thin layered electromagnetic interference phenomenon with micro-hole structure on the top. In order to understand the purpose and understanding of the present invention, a detailed description of the [embodiment] is given in conjunction with the illustration. The structural features and functions are further as follows: Disclosed by this ^ 明High-heat-dissipation multilayer circuit board; the structure design of the substrate through the substrate makes the temperature reduction of the multilayer circuit board faster, and isolates electromagnetic interference, and avoids the use of adhesives. The multilayer circuit board structure is based on a metal plate. According to the design of the substrate structure, a combination of a plurality of insulating layers and circuit layers is stacked on the substrate surface. The buffer surface with micro holes is used to increase the adhesion of the insulating layer, and a metal-to-metal coating is added to the structure. Its characteristic is that the entire metal substrate can be used to transfer the heat generated by the components of the multilayer circuit board, increasing the surface area for heat dissipation. The buffer surface of the insulating layer can increase the adhesion of the circuit layer to eliminate the use of an adhesive. In addition, adding a metal coating to the multilayer circuit board structure can more effectively isolate electromagnetic interference. An example of a structured design is disclosed below. /, Substrate, ... Please refer to FIG. 1 ', which is a schematic cross-sectional view of a four-layer circuit board structure according to the first embodiment of the present invention. Mainly insulated by aluminum sheet metal 10, oxide

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569659 --------- Case No. 92109134_Year_Month_Revision__ V. Description of the invention (4) Combination of layer 11, four circuit layer 20 / insulation layer 21, and metal coating 3 Composed of. The alumina insulating layer 11 is a metal oxide layer formed by anodizing the surface layer of a metal sheet. Furthermore, the alumina insulating layer 11 has a buffer surface 12 and a micropore on the buffer surface. The hole can increase the adhesion of the circuit layer 20. In order to avoid a short circuit with the circuit layer 20, the surface layer of the circuit layer 20 needs to be subjected to an appropriate oxidation treatment to form an insulating layer. In this way, a combination of 4 ^ = the road layer 20 / the insulating layer 21 is formed at the top. Covered with a metal covering, it says' as a protective layer to prevent noise interference. Among them, anodizing the T edge layer u on the surface layer of the aluminum metal substrate 10, and forming the oxide insulating layer in layers === two punched surfaces i 2. Because the aluminum metal is hidden by the solar cell =: = ", tracheid-like micro-holes are generated, which are generally treated with an anode; the embodiment of the present invention utilizes: the surface. Buffered multilayer substrate with micro-holes :: ί ::: The circuit connection is the key to its yield, glass fiber cloth passed I; mechanical drilling, and then filled with metal paste, due to its good t, the present invention & : ,, age, 隹, so it is easy to make the aperture non-electrical resistance when the aperture is reduced, and then proceed = on the area where no circuit is needed # This invention is also two: "to complete. As shown in Figure 2, a multilayer electric diagram is made on the upper and lower surfaces of the five-general substrate, which is a pair of reeds and is shown in the structure of the second embodiment of the present invention. The anode is not used. board. System, metal substrate 1G above and below ^ Form a uniform alumina insulation layer! i and make oxygen

569659 Case number 92109134 V. Description of the invention (5) I Lu insulation layer 11 The surface layer forms a buffer sound with micro holes 2. The surface layer is subjected to an appropriate oxidation treatment, and the circuit layer 20 is a surface layer, so that two layers of circuit layers 20 and insulation / = ,, and edge are formed on the upper and lower surfaces, respectively, to form a double-sided double-sided circuit board. Then cladding 30 on top and bottom respectively. Among them, the buffer surface of the insulating layer can be formed with micro holes in the insulating layer, and the surface layer of the insulating layer can be subjected to surface sand treatment to obtain a buffer surface with micro holes. 4 processing or congratulations or making microporous structures on the surface of the insulation layer in the mechanical industry, electronics industry or semiconductor industry. In order to apply the material to the material, it is often used on the surface of the material in various squares. Covering film with special properties. During the thin film deposition process, there are special layers of material to control the material particles to form a thin film. Therefore, ^ ~, which has a special structure and function that cannot be obtained in a thermal equilibrium state: = is made on the surface of its insulating layer with micropores Thin layer of the hole structure: 'may' overmolding method, chemical vapor deposition method, vapor condensation method, Yuehe. None: Bell method, chemical liquid phase synthesis method and solution-coagulation method =

Gel SyntheSls). The circuit layer and the metal coating layer of the present invention: the material and the chemical vapor deposition method, the physical vapor deposition = silver 2 electrical type can also be processed by gluing to produce ionic symptom ^^ bonding, and then = to the insulation Layer to carry out the appropriate table "δ is placed on top of the% road layer to enhance the insulation and circuit layers. Page 10 569659

The extreme treatment of the adhering compounds and other peripheral layers, surface activation or degree, that is, force. Lift can use force. Insulation is very waiting. The step of sensitization increases the sensitization. For example, the ion Ibar makes the adsorption on the surface to form an activated site, which is conducive to the subsequent forging reaction. Although the preferred embodiment of the present invention is disclosed as described above, it is not intended to limit the present invention. Any familiarity with related technologies can be made without departing from the scope of the present invention, Minor changes and retouching, so the scope of protection of the present invention must be based on compounds defined in the scope of the patent application attached to this specification, such as oxides or nitrogen ^ ^ f or insulating materials such as molecules. The formation of “much” can include thermal oxidation, inflammation, ^ _ ^ ^ ^ edge sound; ^ six den θ >, vapor deposition, edge 9 surface is not easy to adhere to other substances, so you can go through the process to activate the radical Wood surface or sensitized blunt surface. After the manager, the main function played was to increase the adhesion between the strong adhesion layer (coating, deposition, deposition) and the insulation layer. Generally, the compound solution or colloidal palladium activator is sensitive before the metal layer is chemically plated on the insulation layer. Modified processing, 569659 Case No. 92109134 Modified drawing Brief description The first figure is a schematic cross-sectional view of a multilayer circuit board structure according to an embodiment of the present invention, and the second figure is a structural schematic diagram of a second embodiment of the present invention. [Illustration of Symbols] 10 Metal sheet 11 Alumina insulation layer 12 Buffer surface 20 Circuit layer 21 Insulation layer 30 Metal coating

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Claims (1)

569659 Case No. 9210Q1: U VI. Patent application scope 丄 A high-heat-dissipation multilayer circuit board, which includes: a metal plate;:-an insulation layer with a buffer surface is formed on the metal substrate Surface 'The buffer surface has micro-holes; and a combination of a plurality of circuit layers and an insulation layer covers the insulation layer with the buffer surface, and includes: a circuit layer, which is used to provide components The surface is adhered and electrically connected; an insulating layer is provided above the circuit layer. 2. The high-heat-dissipation multilayer circuit board according to item 1 of the scope of the patent application, wherein the insulating layer is a compound of the metal plate. 3. The high heat dissipation multilayer circuit board as described in item 1 of the scope of the patent application, wherein the insulating layer is an oxide of the metal plate. 4. The multi-layer circuit board with high heat dissipation as described in item 1 of the scope of patent application, wherein the edge layer is a nitride of the metal plate. 5. The high heat dissipation multi-layer circuit board according to item 1 of the scope of patent application, wherein the insulating layer is selected from one of the group consisting of ceramic materials and polymer materials. 6. The high-heat-dissipation multilayer circuit board according to item 1 of the scope of patent application, wherein the insulating layer and the buffer surface are formed by an anodizing treatment. 7. The high-heat-dissipation multilayer circuit board according to item 1 of the scope of the patent application, wherein the buffer surface of the insulating layer is formed by a surface treatment of the surface layer of the insulating layer. 8 · High heat dissipation multilayer circuit board as described in item 7 of the scope of patent application, which 569659 Case No. 92109134 Amendment VI. The surface treatment in the scope of the patent application is selected from surface grinding treatment and sand blasting treatment. 9. The high heat dissipation multi-layer circuit board as described in item 1 of the patent application scope, wherein The buffer surface of the insulating layer is formed by forming a thin layer with a micro-hole structure on the surface of the insulating layer. 10. The high heat dissipation multi-layer circuit board according to item 9 of the scope of the patent application, wherein the thin layer having a micro-hole structure is formed by spray coating method, chemical vapor deposition method, vapor condensation method, molecular beam It is formed by one of epitaxy method, electroless plating method, chemical liquid phase synthesis method and solution-gel method. The high heat dissipation multi-layer circuit board described in item 1 is selected from the group consisting of copper, gold and silver, among which 11. The circuit layer material in the patent application--0 described in item 1 High-heat-dissipation multi-layer circuit board, which further includes a metal slope coating, which is provided at the top of the insulating layer. Table 1 2. If the patent application is 0 0 3. If the patent application is one of the metal coatings . 1 4. A high-heat-dissipating metal plate-insulating layer of a plurality of electrical plates, comprising: the high-heat-dissipating multilayer circuit board described in item 12, and the covering material is selected from the group consisting of copper, gold and silver Family of multi-layer circuit boards, comprising: a material; formed on the surface of the metal substrate; and a combination of a road layer and an insulating layer covered with the metal I Page 14 569659 The circuit layer is used to provide a surface of the component that is bonded to the circuit layer. 15 · The heat-dissipating multilayer circuit board according to item 14 of the scope of patent application, wherein the insulating layer and the circuit layer are bonded by generating ionic elements. 16 · The two heat-dissipating multilayer circuit boards as described in item 14 of the scope of patent application, wherein the circuit layer 玎 is bonded to generate ionic elements for component adhesion. 17. The high heat dissipation multi-layer circuit board as described in item 14 of the scope of the patent application, wherein the surface of the insulating layer is treated with rhenium activation to increase the adhesion between the circuit layer and the insulating layer. 18 · The multi-layer circuit board with high heat dissipation as described in item 14 of the scope of patent application, wherein the insulating layer is a compound of the metal plate. 19 · The multilayer board with high heat dissipation as described in item 4 of the patent application scope, wherein the insulating layer is an oxide of the metal plate. 20. The heat-dissipating multilayer circuit board as described in item 14 of the scope of patent application, wherein the insulating layer is a nitride of the metal plate. 2 1. The multi-layer circuit board with high heat dissipation as described in item 4 of the patent application scope, wherein the insulating layer is one selected from the group consisting of ceramic materials and polymer materials. 2 2 The heat-dissipating multilayer circuit board as described in item 14 of the scope of patent application, wherein the material of the circuit layer is one selected from the group consisting of copper, gold and silver. 569659 _Case No. 92109134_ Amendment Date__Applicable Patent Scope 2 3 · The high heat dissipation multi-layer circuit board as described in Item 14 of the Patent Application Scope, which further includes a metal coating layer at the top Above the insulating layer. 24. The multi-layer circuit board with high heat dissipation as described in item 23 of the scope of patent application, wherein the metal coating material is selected from one of the group consisting of copper, gold and silver. Page 16