JPH0574774A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPH0574774A
JPH0574774A JP3232727A JP23272791A JPH0574774A JP H0574774 A JPH0574774 A JP H0574774A JP 3232727 A JP3232727 A JP 3232727A JP 23272791 A JP23272791 A JP 23272791A JP H0574774 A JPH0574774 A JP H0574774A
Authority
JP
Japan
Prior art keywords
pellet
resin
electrode
semiconductor device
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3232727A
Other languages
English (en)
Inventor
Tsumoru Takado
積 高堂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP3232727A priority Critical patent/JPH0574774A/ja
Publication of JPH0574774A publication Critical patent/JPH0574774A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83194—Lateral distribution of the layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】 【構成】アイランド１の上に搭載した半導体ペレット３
の電極４に設けた金属ボール５を介し第２の半導体ペレ
ット６の電極を整合させて接合し搭載する。 【効果】従来の金属細線により発生する短絡、断線事故
を防止する。

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明は樹脂封止型半導体装置に
関し、特に同一パッケージ内に複数の半導体ペレットを
搭載した樹脂封止型半導体装置に関する。
【０００２】
【従来の技術】従来の樹脂封止型半導体装置は、リード
フレームのアイランド上に搭載された第１の半導体ペレ
ットの上に絶縁物を介して第２の半導体ペレットを搭載
し、それらの素子間を金属細線でワイヤボンディングし
て接続するか、または、リードフレームのアイランド上
に複数の半導体ペレットを配列して搭載し、素子と素子
との間をワイヤーボンディングして電気的に接続してい
た。
【０００３】
【発明が解決しようとする課題】この従来の樹脂封止型
半導体装置は、半導体ペレット間を金属細線にて電気的
接続していたため、金属細線間の短絡や断線といった問
題があった。
【０００４】
【課題を解決するための手段】本発明の樹脂封止型半導
体装置は、アイランド上に搭載した第１の半導体ペレッ
トと、前記第１の半導体ペレットの電極上に形成した金
属ボールと、前記金属ボールに整合して電極を接合し前
記第１の半導体ペレット上に搭載した第２の半導体ペレ
ットとを備えている。
【０００５】
【実施例】次に、本発明について図面を参照して説明す
る。
【０００６】図１は本発明の一実施例を示す一部切欠斜
視図である。
【０００７】図１に示すように、リードフレーム１の上
に接着剤２を介して第１のペレット３を搭載し、その内
側の電極４に、金属ボール５を接合し、その金属ボール
５と整合して第２のペレット６の電極を接合し、ペレッ
ト３の上にペレット６を搭載する。また、ペレット３の
外側の電極７を金属細線８にてリード９に電気的に接続
し、アイランド１及びリード９の一部を含む領域を封止
樹脂１０で封止している。
【０００８】図２（ａ）〜（ｃ）及び図３（ａ）〜
（ｃ）は本発明の一実施例の製造方法を説明するための
工程順に示した断面図である。
【０００９】まず、図２（ａ）に示すように、リードフ
レームのアイランド１の上に接着剤２を転写治具１１を
使用して転写する。
【００１０】次に、図２（ｂ）に示すように、第１のペ
レッド３を吸着治具１２を使用してアイランド１上に接
着する。
【００１１】次に、図２（ｃ）に示すように、ペレット
３の電極に金属ボール５をワイヤーボンダ１３を用いて
接合する。
【００１２】次に、図３（ａ）に示すように、第２のペ
レット６の電極を金属ボール５に整合させて接合し、ペ
レット６をペレット３の上に搭載する。
【００１３】次に、図３（ｂ）に示すように、ペレット
３の外側電極７とリード９とを金属細線８で電気的に接
続する。
【００１４】次に、図３（ｃ）に示すように、封止樹脂
１０にてアイランド１及びリード９を含む領域を封止す
る。
【００１５】
【発明の効果】以上説明したように本発明は、アイラン
ド上に積重ねて搭載した半導体ペレット相互間を電極上
に設けた金属ボールを介して接合することにより、従来
の金属細線の変形による短絡や断線といった事故を防止
できるという効果を有する。
【図面の簡単な説明】
【図１】本発明の一実施例を示す一部切欠斜視図。
【図２】本発明の一実施例の製造方法を説明するための
工程順に示した断面図。
【図３】本発明の一実施例の製造方法を説明するための
工程順に示した断面図。
【符号の説明】
１ アイランド ２ 接着剤 ３，６ 半導体ペレット ４，７ 電極 ５ 金属ボール ８ 金属細線 ９ リード １０ 封止樹脂 １１ 転写治具 １２ 吸着治具 １３ ワイヤーホンダ
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 25/18

Claims (1)

    【特許請求の範囲】
  1. 【請求項１】 アイランド上に搭載した第１の半導体ペ
    レットと、前記第１の半導体ペレットの電極上に形成し
    た金属ボールと、前記金属ボールに整合して電極を接合
    し前記第１の半導体ペレット上に搭載した第２の半導体
    ペレットとを備えたことを特徴とする樹脂封止型半導体
    装置。
JP3232727A 1991-09-12 1991-09-12 樹脂封止型半導体装置 Pending JPH0574774A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3232727A JPH0574774A (ja) 1991-09-12 1991-09-12 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3232727A JPH0574774A (ja) 1991-09-12 1991-09-12 樹脂封止型半導体装置

Publications (1)

Publication Number Publication Date
JPH0574774A true JPH0574774A (ja) 1993-03-26

Family

ID=16943841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3232727A Pending JPH0574774A (ja) 1991-09-12 1991-09-12 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPH0574774A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6278190B1 (en) 1999-03-04 2001-08-21 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US7172103B2 (en) 2001-10-03 2007-02-06 Max Kabushiki Kaisha Fastener magazine of fastening machine
US7530458B2 (en) 2001-09-28 2009-05-12 Max Kabushiki Kaisha Connecting fastener

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59224154A (ja) * 1983-06-03 1984-12-17 Mitsubishi Electric Corp ゲ−トアレイ
JPH0215660A (ja) * 1988-07-01 1990-01-19 Sharp Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59224154A (ja) * 1983-06-03 1984-12-17 Mitsubishi Electric Corp ゲ−トアレイ
JPH0215660A (ja) * 1988-07-01 1990-01-19 Sharp Corp 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6278190B1 (en) 1999-03-04 2001-08-21 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US7530458B2 (en) 2001-09-28 2009-05-12 Max Kabushiki Kaisha Connecting fastener
US7172103B2 (en) 2001-10-03 2007-02-06 Max Kabushiki Kaisha Fastener magazine of fastening machine

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Effective date: 19980602