JPH0573262B2 - - Google Patents
Info
- Publication number
- JPH0573262B2 JPH0573262B2 JP14234386A JP14234386A JPH0573262B2 JP H0573262 B2 JPH0573262 B2 JP H0573262B2 JP 14234386 A JP14234386 A JP 14234386A JP 14234386 A JP14234386 A JP 14234386A JP H0573262 B2 JPH0573262 B2 JP H0573262B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- internal circuit
- recess
- microwave
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 description 5
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005219 brazing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14234386A JPS62298142A (ja) | 1986-06-17 | 1986-06-17 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14234386A JPS62298142A (ja) | 1986-06-17 | 1986-06-17 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62298142A JPS62298142A (ja) | 1987-12-25 |
| JPH0573262B2 true JPH0573262B2 (enrdf_load_stackoverflow) | 1993-10-14 |
Family
ID=15313153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14234386A Granted JPS62298142A (ja) | 1986-06-17 | 1986-06-17 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62298142A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01257355A (ja) * | 1987-12-14 | 1989-10-13 | Mitsubishi Electric Corp | マイクロ波モノリシックｉｃ |
| JP2710986B2 (ja) * | 1989-05-23 | 1998-02-10 | 新光電気工業株式会社 | 電子装置 |
-
1986
- 1986-06-17 JP JP14234386A patent/JPS62298142A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62298142A (ja) | 1987-12-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2950472B2 (ja) | 電子集積回路パッケージのメタライゼーション構造を形成する方法 | |
| JPH0758258A (ja) | 改良された放熱能力を有する半導体デバイス | |
| JP3532693B2 (ja) | 半導体装置 | |
| JP2002343911A (ja) | 基 板 | |
| JP2770947B2 (ja) | 樹脂封止型半導体装置及びその製造方法 | |
| JPS60137042A (ja) | 樹脂封止形半導体装置 | |
| JPH0573262B2 (enrdf_load_stackoverflow) | ||
| JP3442721B2 (ja) | 半導体装置 | |
| JPH01120853A (ja) | 半導体装置 | |
| JPS63120431A (ja) | 電力用半導体装置 | |
| JPH0618242B2 (ja) | ハイブリツド集積回路 | |
| JPH02240953A (ja) | 半導体装置 | |
| JPH05235194A (ja) | マイクロ波モノリシック集積回路 | |
| JPH0755003Y2 (ja) | 半導体素子用セラミックパッケージ | |
| JPS6380555A (ja) | 半導体装置 | |
| JPH03212961A (ja) | 半導体チップキャリア | |
| JP2598251B2 (ja) | 半導体装置 | |
| JPS5936916Y2 (ja) | 高周波用混成集積回路基板 | |
| JPH09331150A (ja) | 半導体装置 | |
| JPH0529485A (ja) | 集積回路パツケージ | |
| JPH03171744A (ja) | 半導体装置及びその製造方法 | |
| JPH01310566A (ja) | 半導体装置 | |
| JPH0467658A (ja) | 半導体装置 | |
| JP2878846B2 (ja) | パッケージ | |
| JPS6348850A (ja) | 半導体装置の製造方法 |