JPH0571198B2 - - Google Patents

Info

Publication number
JPH0571198B2
JPH0571198B2 JP61261556A JP26155686A JPH0571198B2 JP H0571198 B2 JPH0571198 B2 JP H0571198B2 JP 61261556 A JP61261556 A JP 61261556A JP 26155686 A JP26155686 A JP 26155686A JP H0571198 B2 JPH0571198 B2 JP H0571198B2
Authority
JP
Japan
Prior art keywords
circuit board
thermally conductive
melting point
oxide mixture
highly thermally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP61261556A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63115393A (ja
Inventor
Hisashi Sakuramoto
Shusei Kuratani
Shinya Mizuno
Satoru Nishama
Koichi Uno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel and Sumikin Electronics Devices Inc
Original Assignee
Sumitomo Metal Ceramics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Ceramics Inc filed Critical Sumitomo Metal Ceramics Inc
Priority to JP26155686A priority Critical patent/JPS63115393A/ja
Publication of JPS63115393A publication Critical patent/JPS63115393A/ja
Publication of JPH0571198B2 publication Critical patent/JPH0571198B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
JP26155686A 1986-11-01 1986-11-01 高熱伝導性回路基板 Granted JPS63115393A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26155686A JPS63115393A (ja) 1986-11-01 1986-11-01 高熱伝導性回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26155686A JPS63115393A (ja) 1986-11-01 1986-11-01 高熱伝導性回路基板

Publications (2)

Publication Number Publication Date
JPS63115393A JPS63115393A (ja) 1988-05-19
JPH0571198B2 true JPH0571198B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-10-06

Family

ID=17363536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26155686A Granted JPS63115393A (ja) 1986-11-01 1986-11-01 高熱伝導性回路基板

Country Status (1)

Country Link
JP (1) JPS63115393A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5292552A (en) * 1989-12-20 1994-03-08 Sumitomo Electric Industries, Ltd. Method for forming metallized layer on an aluminum nitride sintered body
US5370907A (en) * 1990-06-15 1994-12-06 Sumitomo Electric Industries, Ltd. Forming a metallized layer on an AlN substrate by applying and heating a paste of a metal composed of W and Mo

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5075208A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-11-07 1975-06-20
JPS5840282A (ja) * 1981-08-27 1983-03-09 ファナック株式会社 工業用ロボツト
JPS59164687A (ja) * 1983-03-11 1984-09-17 日立化成工業株式会社 非酸化物系セラミツクス用メタライズ組成物

Also Published As

Publication number Publication date
JPS63115393A (ja) 1988-05-19

Similar Documents

Publication Publication Date Title
JP4077888B2 (ja) セラミックス回路基板
US4861646A (en) Co-fired metal-ceramic package
JP2602372B2 (ja) メタライズされた構成要素をセラミツク基板にろう付けする方法
JP3517062B2 (ja) 銅メタライズ組成物及びそれを用いたガラスセラミック配線基板
KR100585909B1 (ko) 질화알루미늄 기판에 사용하기 위한 후막 전도체 조성물
JPH022836B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0323512B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0571198B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS60178688A (ja) 高熱伝導性回路基板
JPH0570954B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2563809B2 (ja) 半導体用窒化アルミニウム基板
JPH05156303A (ja) メタライズ用金属粉末組成物，それを用いたメタライズ基板及びメタライズ基板の製造方法
JP2004055558A (ja) 銅ペースト及びそれを用いた配線基板
JPH01201090A (ja) セラミック用メタライズ組成物
JP2620326B2 (ja) 金属化層を有する窒化アルミニウム焼結体の製造方法
JP2616951B2 (ja) 金属化面を有する窒化アルミニウム焼結体及びその製造方法
JPH0723273B2 (ja) 窒化アルミニウム基板のメタライズ方法
JPH0634441B2 (ja) 高熱伝導性回路基板の製法
JPH0613721A (ja) 高熱伝導性回路基板の製造方法
JPH0725690A (ja) ＡｌＮ基板のメタライズ層の形成方法
JPH03122081A (ja) 窒化アルミニウム焼結体用導電ペースト
JPS62186407A (ja) 導電性組成物
JP3433260B2 (ja) メタライズ基板及びその製造方法
JP2867693B2 (ja) 回路基板
JP2763516B2 (ja) 窒化アルミニウム基板のメタライズ方法

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees