JPH0570932B2 - - Google Patents
Info
- Publication number
- JPH0570932B2 JPH0570932B2 JP59002050A JP205084A JPH0570932B2 JP H0570932 B2 JPH0570932 B2 JP H0570932B2 JP 59002050 A JP59002050 A JP 59002050A JP 205084 A JP205084 A JP 205084A JP H0570932 B2 JPH0570932 B2 JP H0570932B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- die collet
- section
- die
- collet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59002050A JPS60147125A (ja) | 1984-01-11 | 1984-01-11 | 半導体組立装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59002050A JPS60147125A (ja) | 1984-01-11 | 1984-01-11 | 半導体組立装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60147125A JPS60147125A (ja) | 1985-08-03 |
| JPH0570932B2 true JPH0570932B2 (online.php) | 1993-10-06 |
Family
ID=11518503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59002050A Granted JPS60147125A (ja) | 1984-01-11 | 1984-01-11 | 半導体組立装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60147125A (online.php) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4799854A (en) * | 1987-07-20 | 1989-01-24 | Hughes Aircraft Company | Rotatable pick and place vacuum sense head for die bonding apparatus |
| JPH01291431A (ja) * | 1988-05-19 | 1989-11-24 | Sanyo Electric Co Ltd | ペレットボディング装置 |
-
1984
- 1984-01-11 JP JP59002050A patent/JPS60147125A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60147125A (ja) | 1985-08-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |