JPH0567650B2 - - Google Patents
Info
- Publication number
- JPH0567650B2 JPH0567650B2 JP62261843A JP26184387A JPH0567650B2 JP H0567650 B2 JPH0567650 B2 JP H0567650B2 JP 62261843 A JP62261843 A JP 62261843A JP 26184387 A JP26184387 A JP 26184387A JP H0567650 B2 JPH0567650 B2 JP H0567650B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- semiconductor device
- formula
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000003822 epoxy resin Substances 0.000 claims description 11
- 229920000647 polyepoxide Polymers 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 9
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- FHNCCAGEZMNIHZ-UHFFFAOYSA-N 3,4,5,5a,6,7,8,9-octahydro-2h-1,2-benzodiazepine Chemical compound N1CCCC2CCCCC2=N1 FHNCCAGEZMNIHZ-UHFFFAOYSA-N 0.000 claims 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims 1
- 229910052794 bromium Inorganic materials 0.000 claims 1
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- 239000000460 chlorine Substances 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 6
- 230000035939 shock Effects 0.000 description 5
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- DCTOHCCUXLBQMS-UHFFFAOYSA-N 1-undecene Chemical compound CCCCCCCCCC=C DCTOHCCUXLBQMS-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- SSUJUUNLZQVZMO-UHFFFAOYSA-N 1,2,3,4,8,9,10,10a-octahydropyrimido[1,2-a]azepine Chemical compound C1CCC=CN2CCCNC21 SSUJUUNLZQVZMO-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26184387A JPH01105562A (ja) | 1987-10-19 | 1987-10-19 | 樹脂封止型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26184387A JPH01105562A (ja) | 1987-10-19 | 1987-10-19 | 樹脂封止型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01105562A JPH01105562A (ja) | 1989-04-24 |
| JPH0567650B2 true JPH0567650B2 (zh) | 1993-09-27 |
Family
ID=17367518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26184387A Granted JPH01105562A (ja) | 1987-10-19 | 1987-10-19 | 樹脂封止型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01105562A (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0689112B2 (ja) * | 1989-11-25 | 1994-11-09 | 松下電工株式会社 | 半導体封止用エポキシ樹脂組成物 |
| JPH03278450A (ja) * | 1990-03-27 | 1991-12-10 | Matsushita Electric Works Ltd | 樹脂封止半導体装置 |
| JPH04207057A (ja) * | 1990-11-30 | 1992-07-29 | Matsushita Electric Works Ltd | 樹脂封止半導体装置 |
| JPH0597970A (ja) * | 1991-10-07 | 1993-04-20 | Shin Etsu Chem Co Ltd | 熱硬化性樹脂組成物及び半導体装置 |
| JP2643706B2 (ja) * | 1991-11-26 | 1997-08-20 | 信越化学工業株式会社 | 熱硬化性樹脂組成物及び半導体装置 |
| KR100516409B1 (ko) | 1998-02-19 | 2005-09-23 | 히다치 가세고교 가부시끼가이샤 | 신규 화합물, 경화촉진제, 수지조성물 및 전자부품장치 |
| KR20080017101A (ko) * | 2005-06-16 | 2008-02-25 | 산아프로 가부시키가이샤 | 에폭시 수지용 경화 촉진제 |
| KR200457970Y1 (ko) * | 2008-10-01 | 2012-01-16 | 손성철 | 이쑤시개 케이스 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62184020A (ja) * | 1986-02-07 | 1987-08-12 | Toshiba Chem Corp | 封止用樹脂組成物 |
| JPS62201922A (ja) * | 1985-10-31 | 1987-09-05 | Sanyo Kokusaku Pulp Co Ltd | エポキシ樹脂組成物 |
| JPH01101362A (ja) * | 1987-10-14 | 1989-04-19 | Sanyo Kokusaku Pulp Co Ltd | 樹脂組成物 |
| JPH01104615A (ja) * | 1987-10-16 | 1989-04-21 | Sanyo Kokusaku Pulp Co Ltd | 難燃性エポキシ樹脂組成物 |
-
1987
- 1987-10-19 JP JP26184387A patent/JPH01105562A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62201922A (ja) * | 1985-10-31 | 1987-09-05 | Sanyo Kokusaku Pulp Co Ltd | エポキシ樹脂組成物 |
| JPS62184020A (ja) * | 1986-02-07 | 1987-08-12 | Toshiba Chem Corp | 封止用樹脂組成物 |
| JPH01101362A (ja) * | 1987-10-14 | 1989-04-19 | Sanyo Kokusaku Pulp Co Ltd | 樹脂組成物 |
| JPH01104615A (ja) * | 1987-10-16 | 1989-04-21 | Sanyo Kokusaku Pulp Co Ltd | 難燃性エポキシ樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01105562A (ja) | 1989-04-24 |
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