JPH056714Y2 - - Google Patents
Info
- Publication number
- JPH056714Y2 JPH056714Y2 JP1984123068U JP12306884U JPH056714Y2 JP H056714 Y2 JPH056714 Y2 JP H056714Y2 JP 1984123068 U JP1984123068 U JP 1984123068U JP 12306884 U JP12306884 U JP 12306884U JP H056714 Y2 JPH056714 Y2 JP H056714Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- base material
- mounting
- hole
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 64
- 239000002184 metal Substances 0.000 claims description 64
- 239000000463 material Substances 0.000 claims description 42
- 239000011347 resin Substances 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 25
- 239000012790 adhesive layer Substances 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12306884U JPS6138997U (ja) | 1984-08-10 | 1984-08-10 | 電子部品搭載用基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12306884U JPS6138997U (ja) | 1984-08-10 | 1984-08-10 | 電子部品搭載用基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6138997U JPS6138997U (ja) | 1986-03-11 |
| JPH056714Y2 true JPH056714Y2 (US06168655-20010102-C00055.png) | 1993-02-19 |
Family
ID=30681819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12306884U Granted JPS6138997U (ja) | 1984-08-10 | 1984-08-10 | 電子部品搭載用基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6138997U (US06168655-20010102-C00055.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62237791A (ja) * | 1986-04-08 | 1987-10-17 | 新藤電子工業株式会社 | プリント配線板の製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS549767A (en) * | 1977-06-24 | 1979-01-24 | Nippon Electric Co | Substrate for multiilayer wiring |
| JPS56955A (en) * | 1979-06-18 | 1981-01-08 | Kyokuto Denki Kk | Water-heating apparatus by using solar heat |
| JPS5753680A (en) * | 1980-09-18 | 1982-03-30 | Seiko Epson Corp | Electronic watch with melody |
| JPS5946086A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板とその製造方法 |
-
1984
- 1984-08-10 JP JP12306884U patent/JPS6138997U/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS549767A (en) * | 1977-06-24 | 1979-01-24 | Nippon Electric Co | Substrate for multiilayer wiring |
| JPS56955A (en) * | 1979-06-18 | 1981-01-08 | Kyokuto Denki Kk | Water-heating apparatus by using solar heat |
| JPS5753680A (en) * | 1980-09-18 | 1982-03-30 | Seiko Epson Corp | Electronic watch with melody |
| JPS5946086A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板とその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6138997U (ja) | 1986-03-11 |
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