JPH056664Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) This invention relates to an improvement of a lead wire bending device for resin-sealed molded products of semiconductor devices and other electronic components.

(Prior Art) A conventional lead wire bending device that bends the lead wire of an electronic component to a required angle (shape) in order to mount the electronic component on a board etc., for example, bends the lower half of the electronic component body. Devices are already known that include a support member for supporting and fixing, and a pressure member for applying pressure from above to the lead wire of an electronic component supported by the support member and bending it at a desired angle.

(Problems to be Solved by the Invention) By the way, the above-described conventional lead wire bending device has advantages such as being able to easily bend the lead wire, but the above-mentioned support member in the device Since the pressing member and the pressing member are made of metal such as iron, as in the case of a normal bending device, there are the following problems.

That is, the surface of the lead wire of an electronic component is usually solder plated in consideration of the case where the electronic component is mounted on a board or the like.

When the lead wire of such an electronic component is bent using the above-mentioned conventional bending device, the solder plating on the surface of the lead wire joins with the lead wire, such as the joint surface of the support member and pressure member of the bending device. adhering to
The solder plating on the surface of the lead wire will be peeled off.

The above-described peeling of the plating on the surface of the lead wire is thought to occur easily due to a kind of material affinity between the processed material and the workpiece. When mounting on a board, this may cause poor connection between the lead wire and the board, and after mounting, rust prevention treatment is required for the connecting portion.

This is an extremely serious drawback for this type of product, where high quality and high reliability are particularly required. etc., and therefore had the disadvantage of significantly reducing productivity.

Note that the drawing jig (Japanese Unexamined Patent Application Publication No. 112135/1983), in which the die, punch, etc. are made of a ceramic sintered body made of silicon nitride as a main component and a sintering aid added thereto, is used.
No. 2) has been proposed. In this case, since the die and punch have excellent lubricity, welding between the die and punch and the workpiece is prevented, and the surface condition of the workpiece can be machined in a good condition. However, not only is the product expensive, but it also has to be replaced with a new one when it wears out, which is uneconomical.

The present invention efficiently and reliably prevents the solder plating on the surface of the lead wire from being peeled off when the lead wire of an electronic component is bent, thereby reliably solving the conventional problems as described above. The purpose is to

Further, the present invention provides a lead wire bending device for electronic components that can efficiently and reliably obtain a predetermined directionality and bending accuracy of the lead wire during the bending process of the lead wire. The purpose is to

Further, in the present invention, the support member of the electronic component body and the bending pressure member for the lead wire are formed of metal materials, and the support member and the pressure member are provided with a portion of each joint surface that is connected to the lead wire. A lead wire for an electronic component that can improve the overall durability of a device by detachably attaching bent joint surface members of the lead wire each having a ceramic material surface with an engagement groove formed therein. The object of the present invention is to provide a folding device.

(Means for Solving the Problems) A lead wire bending device for electronic components according to the present invention to solve the above-mentioned problems includes a support member for an electronic component main body, and a support member for an electronic component supported by the support member. A lead wire bending device for an electronic component, comprising a pressure member for bending a lead wire at a predetermined angle, wherein the support member and the pressure member are each made of a metal material, and the support member and the pressure member are each made of a metal material. A lead wire bending joint surface member having a ceramic material surface with a groove for engaging with the lead wire of the electronic component is removably attached to each joint surface of the electronic component, and further,
The present invention is characterized in that the bent joint surface members of each lead wire are elastically supported.

(Function) According to the present invention, the lead wire is provided with a ceramic material surface in which a groove for engaging the lead wire is formed on each joint surface of the supporting member and the pressure member that are joined to the lead wire of the electronic component. By attaching and detaching the bending joint surface members, it is possible to efficiently prevent the solder plating on the surface of the lead wires from adhering to the joint surfaces of the support member and the pressure member when bending the lead wires. Therefore, peeling of the solder plating on the surface of the lead wire can be reliably prevented.

In addition, lead wire bending joint surface members each having a ceramic material surface formed with a groove for engaging the lead wire are removably attached to each of the joint surfaces of the support member and the pressure member described above. Therefore, the lead wire bending joint surface member can be easily replaced.

In addition, by forming engagement grooves for the lead wires of electronic components on each joint surface of the support member and the pressure member, the predetermined directionality and bending of the lead wires can be achieved during the bending process of the lead wires. Machining accuracy can be reliably obtained.

(Example) Next, the present invention will be explained based on embodiment figures.

FIG. 1 schematically shows the main parts of a lead wire bending device for electronic components, and the bending device includes a support member 2 for supporting the lower half of an electronic component main body 1;
Pressure members 4, 4 for bending the lead wires 3, 3 of the electronic components supported by the support member 2 at a required angle;
are provided.

Further, on the upper surface of the support member 2, a recess 5 for fitting and supporting the lower half of the electronic component main body 1;
a protrusion pin 6 of the electronic component main body 1 fitted into the center of the recess 5; a bending joint surface 7 to be joined to the lead wires 3, 3 in order to bend the lead wires 3, 3 at a required angle; 7 are provided respectively.

Further, a support member 2 is provided on the lower surface of the pressure member 4.
There are provided bending joint surfaces 8, 8 of the lead wires 3, 3 corresponding to the bending joint surfaces 7, 7, respectively.

Further, the above-mentioned double-bending joint surfaces 7 and 8 may be constructed from a required smooth surface, but the lead wires 3 and 8 in the illustrated example
3 is formed to have a circular cross section, so when the lead wires 3, 3 are bent at a desired angle (shape), the bending surfaces 7, 8 have a predetermined direction and a bending direction of the lead wires. A case is shown in which lead wire engaging grooves 7a and 8a are respectively provided for the purpose of obtaining bending accuracy.

Note that the lead wire engaging grooves 7a and 8a are
As shown in the figure, the double-bent joint surfaces 7 and 8 may be disposed facing each other over the entire length thereof.

Furthermore, both the engagement grooves 7a, 8a are connected to both the lead wires 3,
It is preferable to form the cross-sectional tapered surface shape as shown in FIG. 4 so that it can be bent at the predetermined position of FIG.

What is shown in FIGS. 1 to 4 is a case in which the supporting member 2 and the processing members 4, 4 themselves are made of ceramic material, and what is shown in FIG. 2 and 4 themselves are formed of ordinary metal material A such as iron, and a ceramic coating layer B is provided on the double-bent joint surfaces 7 and 8.

However, in the former configuration, as described above, although it is possible to prevent welding with the lead wire due to the lubricity of both members 2 and 4, it not only increases the product price, but also increases the cost of the product. When it wears out, it has to be replaced entirely with a new one, which poses problems such as being uneconomical. Further, in the latter case, when the ceramic coating layer B peels off, the entire layer must be replaced with a new one, which is uneconomical.

Therefore, in the present invention, as shown in FIG. Engagement grooves 7a, 8a (first
By detachably attaching the bending joint surface members C of the lead wires each having a ceramic material surface formed with a ceramic material (see Fig. 3, etc.), the bending joint surface members C are configured to be replaceable. This improves the overall durability of the device.

In this case, each of the above-mentioned bending joint surface members C is provided removably, so for example, each of the bending joint surface members C is formed of a metal material such as ordinary iron, and A ceramic coating layer of a required thickness may be integrated onto each joint surface 7, 8 of the bent joint surface member C.

Further, in the embodiment, as shown in the figure, a required elastic member D such as a compression spring is interposed between the joint surfaces 7 and 8 and the bent joint surface member C. As a result, the bent joint surface member C is elastically supported by the joint surfaces 7 and 8.

Therefore, it is possible to prevent excessive deformation pressure from being applied to the lead wire 3, to obtain appropriate lead wire bending accuracy efficiently and reliably, and to prevent the lead wire 3 from being bent. It is possible to efficiently and reliably prevent the solder plating on the surface of the lead wire from being peeled off during bending.

Furthermore, by forming the engaging grooves 7a and 8a with the lead wire 3 to have a tapered cross-sectional shape, when the lead wire 3 is bent, the predetermined directionality of the lead wire and the bending process can be adjusted. This makes it possible to obtain accuracy efficiently and reliably.

Next, the bending effect of the lead wire in the configuration of the above embodiment will be explained.

First, the lower half of the electronic component main body 1 is fitted and supported in the recess 5 of the support member 2, and the lower surface of the lead wire 3 of the electronic component is engaged with the engagement groove 7a of the support member 2 (first (See Figure 1).

Next, the pressure members 4, 4 are moved downward to engage the engagement grooves 8a, 8a with the upper surface of the lead wire 3 of the electronic component, and in this state, the pressure members 4, 4 are lowered to a predetermined position. (See Figure 2).

Therefore, at this time, the lead wire 3 of the electronic component is connected to the above-mentioned double bending joint surfaces 7, 8, that is, both the engaging grooves 7a, 8.
It is bent to a desired angular position (shape) while being engaged with a.

In addition, when the bending process of the lead wire described above is completed, the electronic component main body 1 may be pushed out from the recess 5 of the support member using the pin 6.

According to the configuration of the embodiment described above, the lead wire 3 of the electronic component is attached to the joint surfaces 7 and 8 of the support member 2 and the processed members 4 and 4 that are joined to the lead wire 3.
By removably attaching the lead wire bending joint surface members C each having a ceramic material surface formed with engagement grooves 7a and 8a, when bending the lead wire 3, the lead wire 3 can be bent. Since the solder plating on the surface of the lead wire can be efficiently prevented from adhering to the joint surfaces 7 and 8 of the supporting member 2 and the pressure members 4 and 4, peeling of the solder plating on the surface of the lead wire can be reliably prevented. It can be prevented. The action and effect of preventing the plating on the surface of the lead wire from peeling off is mainly due to the fact that there is a type of This is thought to be due to the lack of material compatibility.

Moreover, the lead wire is provided with a ceramic material surface having engagement grooves 7a, 8a formed therein for engagement with the lead wire 3 of the electronic component at the joint surfaces 7, 8 of the support member 2 and the pressure members 4, 4. By removably mounting the bending joint surface members C, the lead wire bending joint surface members C can be easily replaced.

Further, engagement grooves 7a, 8a with the lead wires 3 are provided on the joint surfaces 7, 8 of the support member 2 and the pressure members 4, 4.
By forming the lead wire 3, it is possible to reliably obtain the predetermined directionality and bending accuracy of the lead wire 3 when bending the lead wire 3.

In the configuration of the above-described embodiment, the case of a lead wire bending device for an electronic component having a lead wire having a circular cross section was explained. It can also be appropriately applied as a bending device.

(Effect of the invention) According to the invention, when the lead wire of an electronic component is bent, it is possible to efficiently and reliably prevent the solder plating on the surface of the lead wire from being peeled off. In addition to reliably solving the problems of conventional products, there is no need to re-plat the surface of the lead wire after bending the lead wire. This has excellent practical effects such as improving productivity.

In addition, when bending the lead wire, it is possible to efficiently and reliably obtain the predetermined directionality and bending accuracy of the lead wire, so this type of product has high quality and high reliability. This provides an excellent effect in that it is possible to provide a lead wire bending device for electronic components that can be molded.

Furthermore, the support member of the electronic component main body and the bending pressure member for the lead wire are each formed of a metal material, and an engagement groove for the lead wire is formed at each joint surface of the support member and the pressure member. To provide a lead wire bending device for an electronic component, which can improve the overall durability of the device by detachably mounting lead wire bending joint surface members each having a ceramic material surface. It has excellent effects.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway vertical front view schematically showing the main parts of a lead wire bending device for electronic components. Second
The figure is a partially cutaway vertical front view for explaining the operation of the device. FIG. 3 is a longitudinal sectional front view showing an example of the structure of the lead wire engaging groove. FIG. 4 is a longitudinal sectional side view showing another example of the structure of the lead wire engaging groove.
FIG. 5 is a partially cutaway longitudinal sectional front view schematically showing the main parts of another lead wire bending device. FIG. 6 is a partially cutaway vertical front view schematically showing the main parts of the electronic component lead wire bending device according to the present invention. Explanation of symbols, 1... Electronic component body, 2... Support member, 3... Lead wire, 4... Pressure member, 5...
Recess, 6...Ejection pin, 7...Bending joint surface, 7
a... Engagement groove, 8... Bent joint surface, 8a... Engagement groove, A... Metal material, B... Ceramic coating layer, C... Bent joint surface member, D... Elastic member .

Claims (1)

[Claims for Utility Model Registration] (1) Lead wire bending of an electronic component that includes a support member for an electronic component body and a pressure member that bends the lead wire of the electronic component supported by the support member to a required angle. In the device, the support member and the pressure member are each made of a metal material, and an engagement groove for a lead wire of an electronic component is formed at each joint surface of the support member and the pressure member. An electronic component characterized in that bent joint surface members of lead wires each having a ceramic material surface are detachably attached to each other, and each of the bent joint surface members of each lead wire is elastically supported. Lead wire bending device. (2) A lead wire bending device for an electronic component according to claim 1, wherein the engaging groove for engaging the lead wire is formed to have a tapered surface shape in cross section. (3) A claim for registration of a utility model characterized in that each bent joint surface member is formed of a metal material, and a ceramic coating layer is integrated on the joint surface of each bent joint surface member. A lead wire bending device for electronic components according to scope 1.